An electromagnetic wave shielding sheet according to the disclosure is configured by a protection layer, a metal layer, and a conductive adhesive layer. The metal layer has a plurality of openings, and an aperture ratio of the opening is 0.1%-20%. In addition, a tensile breaking strength of the electromagnetic wave shielding sheet is 10 N/20 mm-80 N/20 mm.

The present disclosure provides a two-part composition polymeric material including a first part and a second part. The first part includes an inorganic filler and a polymeric material including a polymerized reaction product of a polymerizable composition including components. The components include a uretdione-containing material including a reaction product of a diisocyanate reacted with itself; a first hydroxyl-containing compound; and an optional second hydroxyl-containing compound having a single OH group. The second part includes a polythiol having an average sulfhydryl group functionality of 2 or greater. Further, a method of adhering two substrates is provided, including obtaining a two-part composition; combining at least a portion of the first part with at least a portion of the second part to form a mixture; disposing at least a portion of the mixture on a first substrate; and contacting a second substrate with the mixture disposed on the first substrate. The disclosure also provides a polymerized product of the two-part composition and a battery module. Advantageously, two-part compositions can be used as coatings and adhesive systems including high loadings of inorganic filler, such as thermally conductive filler, with handling and performance similar to existing two-part urethane systems, but with less sensitivity to water.

There is a method of manufacturing a multilayer wiring board including: alternately stacking wiring layers and insulating layers; stacking a reinforcing sheet on one surface of the resulting multilayer laminate with a soluble adhesive layer therebetween, wherein an unoccupied region without the soluble adhesive layer is provided within a facing area where the reinforcing sheet faces the multilayer laminate; allowing a liquid capable of dissolving the soluble adhesive layer to infiltrate the unoccupied region to dissolve or soften the soluble adhesive layer; and releasing the reinforcing sheet from the multilayer laminate at the soluble adhesive layer. This method enables the multilayer wiring layer to be reinforced to generate no large local warpage, thereby improving the reliable connection and the surface flatness (coplanarity) of the multilayer wiring layer. The used reinforcing sheet can be released in a significantly short time, while minimizing the stress applied to the multilayer laminate.

An adhesion structure and an electronic device are provided. The adhesion structure includes a substrate and an adhesive layer. The adhesive layer is disposed on the substrate, and the adhesive layer includes a plurality of graphene microplates. A part of the graphene microplates protrude from two opposite surfaces of the adhesive layer. The thickness of the graphene microplates is greater than or equal to 0.3 nanometers and is less than or equal to 3 nanometers. The flake diameter of the graphene microplates is greater than or equal to 1 micrometer and is less than or equal to 30 micrometers. The adhesion structure can not only provide the adhesive function, but also improve the heat dissipation efficiency of electronic device.

A foldable display screen and an assembling method thereof, and a display apparatus are provided. The foldable display screen includes: a display panel; a touch sensing panel, located on a side of the display panel; a first optical adhesive layer, located on a side of the touch sensing panel away from the display panel; and a second optical adhesive layer, located between the display panel and the touch sensing panel; a thickness of the first optical adhesive layer and a thickness of the second optical adhesive layer are both 20 μm to 200 μm; and at a working temperature, an elastic modulus of the first optical adhesive layer and an elastic modulus of the second optical adhesive layer are both less than 1 Mpa.

An electrical steel strip or sheet with a thermosetting water-based hot-melt adhesive varnish layer provided on at least one of its flat sides, a method for producing such an electrical steel strip or sheet, and a laminated core made therefrom are disclosed. In order to produce a particularly storable and aging-stable thermosetting hot-melt adhesive varnish layer on the electrical steel strip or sheet in the B state, it is proposed for the stoichiometric ratio of the epoxy groups of the epoxy resin or epoxy resins relative to the hydrogen atoms of the at least two amino groups of the hardener that is latent at room temperature to lie in the range from 1.33:1 to 5:1.

Provided is a double-sided pressure-sensitive adhesive tape excellent in reworkability. A double-sided pressure-sensitive adhesive tape according to an embodiment of the present invention includes an acrylic pressure-sensitive adhesive, wherein the acrylic pressure-sensitive adhesive is formed from an acrylic pressure-sensitive adhesive composition, wherein the double-sided pressure-sensitive adhesive tape has a load at an elongation of 100% of 7 N/10 mm or less, and wherein the double-sided pressure-sensitive adhesive tape has a load at an elongation of 500% of 20 N/10 mm or less.

A double-sided pressure-sensitive adhesive includes an acrylic pressure-sensitive adhesive, wherein the acrylic pressure-sensitive adhesive is formed from an acrylic pressure-sensitive adhesive composition, wherein the acrylic pressure-sensitive adhesive composition contains an acrylic partially polymerized product obtained by polymerizing a monomer component (m1), a monomer component (m2), a cross-linking agent, and a photopolymerization initiator, wherein the monomer component (m2) contains an alkyl (meth)acrylate having, at an ester terminal thereof, an alkyl group having 4 to 10 carbon atoms, and a polymerizable monomer whose corresponding homopolymer has a Tg of 0° C. or more, and wherein in the monomer component (m2), a content of the polymerizable monomer whose corresponding homopolymer has a Tg of 0° C. or more is from 10 parts by weight to 90 parts by weight with respect to 100 parts by weight of the alkyl (meth)acrylate having, at an ester terminal thereof, an alkyl group having 4 to 10 carbon atoms.

To improve storage stability of a resin composition used for applications such as a semiconductor sealing material. The resin composition is a resin composition that includes (A) an epoxy resin, (B) a curing agent, and (C) a silica filler. The silica filler of component (C) is surface-treated with a basic substance having a conjugate acid dissociation constant (pKa) of 9.4 or more. The resin composition further includes (D) a silane coupling agent, or the silica filler of component (C) is further surface-treated with a silane coupling agent.

An adhesive tape with high repeelability from the state that a portion of the adhesive tape has already been peeled from an adherend is provided. The adhesive tape includes a substrate layer and an adhesive layer. The substrate layer has a breaking stress in a range of 1 to 90 MPa and an elongation at break in a range of 400% to 3000%. The adhesive tape satisfies the following relational expression (i): [Math. 1] P.sub.400/P.sub.0≤0.9 (i). P.sub.0 denotes an initial cleavage strength N/cm.sup.2 of the adhesive tape, and P.sub.400 denotes a cleavage strength N/cm.sup.2 when the adhesive tape is stretched by 400%.