This silver paste is used to form a silver paste layer by applying the silver paste directly on the surface of a copper or copper alloy member, and the silver paste includes a silver powder, a fatty acid silver salt, an aliphatic amine, a high-dielectric-constant alcohol having a dielectric constant of 30 or more, and a solvent having a dielectric constant of less than 30. The content of the high-dielectric-constant alcohol is preferably 0.01% by mass to 5% by mass when an amount of the silver paste is taken as 100% by mass.

The present application discloses a frame sealant and its preparation method and display panel. The frame sealant of the present application includes frame sealant glue and conductive fibers dispersed in the frame sealant glue, and the conductive fibers have a three-dimensional helical structure. The frame sealant of the present application has excellent electrical conductivity, high packaging quality, excellent toughness and packaging bonding strength after curing, and improves the anti-separation ability of the two substrates of the box. The preparation method of the frame sealant of the present application can ensure that the prepared frame sealant has stable performance and high efficiency. The display panel contains the frame sealant of the present application, with stable display and long service life.

A resin composition for temporary fixing of a support for substrate conveyance to an organic substrate, the resin composition containing a thermoplastic resin, a thermosetting resin, and an inorganic filler. When the resin composition is formed into a film that is then heated for 30 minutes at 130° C. and for 2 hours at 170° C., the film obtains an elastic modulus of 350 to 550 MPa at 25° C.

A method for manufacturing a smart card capable of achieving excellent connection reliability and bending resistance, a smart card, and a conductive particle-containing hot-melt adhesive sheet. A conductive particle-containing hot-melt adhesive sheet containing solder particles of a non-eutectic alloy in a binder containing a crystalline polyamide having a carboxyl group is interposed between a card member and an IC chip and subjected to thermocompression bonding. The crystalline polyamide having a carboxyl group improves the solder wettability of the non-eutectic alloy, thereby achieving excellent connection reliability. This effect is considered to be a flux effect due to the carboxyl group present in the crystalline polyamide, and as a result, it is possible to prevent the decrease in the elastic modulus of the adhesive layer which would be caused by the addition of a flux compound and to achieve excellent bending resistance.

A protective cover assembly is disclosed that comprises a porous expanded membrane having a plurality of pores, a first surface and a second surface opposite the first surface. The porous expanded membrane comprises an active area and a bonded area. The bonded area comprises an adhesive material that forms a bridge extending through the plurality of pores in the bonded area from the first surface to the second surface. The adhesive material in the bonded area improves the Z-strength and allows the porous expended membrane to be a lightweight material having a mass/area ratio of less than or equal to 3 g/m.sup.2.

Disclosed are a method of preparing an elastic pressure-sensitive adhesive tape and an elastic pressure-sensitive adhesive tape. Main components of the adhesive include a polyacrylate resin with a carbon-carbon double bond and a diluent monomer with a carbon-carbon double bond. A quasi-microcapsule powder component is adopted, wherein the shell material of the quasi-microcapsule powder selects a cellulose-based water soluble polymer, and the core material selects low boiling point alkane, wherein the preparation method combines UV curing, heating, and shell burst, to obtain an elastic adhesive layer, whereby to prepare a pressure-sensitive adhesive tape product. Compared with conventional elastic pressure-sensitive adhesive tapes, the preparing method as disclosed has a simple manufacturing process. The pressure-sensitive adhesive tape obtained from the disclosed preparing method overcomes the restrictions of conventional foam strips and provide good cushioning and compression properties without using foam as the carrier.

Adhesive tapes include a plasticized polyvinyl chloride backing, a primer including an ethylene/carbon monoxide-containing terpolymer and a styrene-containing block copolymer and an epoxidized polymer, and an adhesive.

Provided are a film and an electric device comprising the same. The film comprises at least one modified polyolefin resin layer. A resin forming the modified polyolefin resin layer comprises 1-100% of modified polyolefin resin. A main chain in the modified polyolefin resin is an ethylene-α-olefin copolymer. A grafted branched chain in the modified polyolefin resin is selected from a compound formed by a vinyl monomer comprising one or more of anhydride group, hydroxyl, ester group, carbonyl, acylamino, pyridyl, epoxy, pyrrolidonyl and glycidyl. A molecular weight of the grafted branched chain is 150-8000 g/mol. The film prepared from the modified POE layer with the main chain and the grafted branched chain has excellent anti-PID performance. The layers have a better adhesive property without a laminated interface therebetween. The co-extruded film further has an excellent water vapor barrier property, a relatively high insulating property and a relatively high light transmittance.

An object of the present invention is to provide a pressure-sensitive adhesive sheet, an optical member, and a touch panel that enable a pressure-sensitive adhesive layer to be formed, the pressure-sensitive adhesive layer allowing the appearance of a display device and an input device to be unlikely to deteriorate even under low pressure conditions. The pressure-sensitive adhesive sheet has a pressure-sensitive adhesive layer, and the number of the voids having a diameter of 300 μM or more in the following low pressure test is less than 10, and the number of the voids having a diameter of not less than 50 less than 300 μM in the following low pressure test is less than 20.

A low-cost, multi-function system with a form factor that unobtrusively integrates the components needed to implement a combination of different functions and also is able to perform a useful ancillary function that otherwise would have to be performed with the attendant need for additional materials, labor, and expense. An example adhesive product that integrates sensing components within a flexible adhesive structure in a way that not only provides a cost-effective platform for interconnecting, optimizing, and protecting the components of the tracking system but also maintains the flexibility needed to function as an adhesive product that can be deployed seamlessly and unobtrusively into various applications and workflows, including person and object tracking applications, and asset management workflows such as manufacturing, storage, shipping, delivery, and other logistics associated with moving products and other physical objects.