Patent classifications
C09J2301/50
ADHESIVE COMPOSITION COMPRISING HEAT TREATED DRY PLANT MEAL AND A WATER SOLUBLE PREPOLYMER AND/OR WATER SOLUBLE REACTIVE PREPOLYMER
The invention relates to a process for preparing an adhesive composition comprising a heat treated dry plant meal, said heat treated dry plant meal and relating dispersions, adhesive compositions, articles and uses of said heat treated dry plant meal.
PROCESS OF INCORPORATING GELLING AND PHASE SEPARATION INHIBITOR INTO A FILLED POLYURETHANE REACTIVE HOT MELT ADHESIVE
Disclosed is a moisture reactive, polyurethane hot melt adhesive composition that is the reaction product of a first mixture comprising heat stabilizer and only one of polyester polyol or filler, wherein the first mixture can optionally comprise polyether polyol and/or thermoplastic polymer but does not comprise all of heat stabilizer and polyester polyol and filler; polyisocyanate; and a second mixture comprising the other of polyester polyol or filler not present in the first mixture; wherein the second mixture can optionally comprise polyether polyol and/or thermoplastic polymer. The moisture reactive hot melt adhesive can also comprise an additive selected from additional catalyst, additional filler, adhesion promoter, plasticizer, colorant, rheology modifier, flame retardant, UV pigment, nanofiber, defoamer, compatible tackifier, anti-oxidant, stabilizer, thixotrope and mixtures thereof.
ADHESIVE FOR SEMICONDUCTORS, AND SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
An adhesive for a semiconductor, the adhesive containing a thermoplastic resin, a thermosetting resin, a curing agent, and a flux compound having an acid group, in which an exothermic calorific value at 60 to 155° C. of a DSC curve obtained by differential scanning calorimetry in which the adhesive for a semiconductor is heated at a temperature increase rate of 10° C./min is 20 J/g or less, and a minimum melt viscosity of a viscosity curve obtained by shear viscosity measurement in which the adhesive for a semiconductor is heated at a temperature increase rate of 10° C./min is 2000 Pa.Math.s or more.
Protective Tapes, Articles Therefrom, and Methods of Making and Using Same
An article includes a substrate having a circuit forming surface and a non-circuit forming surface opposite the circuit forming surface. The article further includes a protective tape borne on the circuit forming surface. The protective tape includes a support layer and a curable adhesive layer borne on a major surface of the support layer. The curable adhesive layer includes a rubber elastomer and a thermal curing agent.
METHOD OF PRODUCING DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET AND DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE SHEET
A method of producing a double-sided pressure-sensitive adhesive sheet includes a step of applying a water-dispersed pressure-sensitive adhesive composition onto a release liner to form a coating film, a step of drying the coating film by heating to form a pressure-sensitive adhesive layer, a step of bonding a first surface of a substrate film to an exposed surface of the pressure-sensitive adhesive layer, a step of applying a water-dispersed pressure-sensitive adhesive composition onto a second surface of the substrate film to form a coating film, and a step of drying the coating film by heating to form a pressure-sensitive adhesive layer. A double-sided pressure-sensitive adhesive sheet includes the substrate film with a thickness of 12 μm or less, the first pressure-sensitive adhesive layer on the first surface formed from the water-dispersed pressure-sensitive adhesive composition, the second pressure-sensitive adhesive layer on the second surface formed from the water-dispersed pressure-sensitive adhesive composition, and the release liner in releasable contact with an adhesive surface of the pressure-sensitive adhesive layer.
TWO-STAGE EPOXY BONDING OIL, PREPARATION METHOD AND APPLICATION THEREOF
A two-stage epoxy bonding oil includes a main agent A and a curing agent B in a weight ratio of 1:1 to 3:1. The curing agent B includes 70 to 90 parts of a linear bifunctional secondary amine curing agent, 10 to 30 parts of a high-melting-point latent curing agent and 1 to 5 parts of an anti-settling agent. A two-stage curing of epoxy bonding oil includes a first-stage curing at room temperature whereby the cured product is in a thermoplastic state and a second-stage curing at 100° C. to 180° C. whereby the cured product is in a thermosetting state. It solves the contradiction between sticking wheels and bonding performance of the bonding layer in field of road and bridge pavement, exploring a new direction for the waterproof bonding layer materials in road and bridge pavement such as steel bridge deck pavement, concrete bridge deck pavement and tunnel pavement.
Adhesive material, and method of use thereof
An adhesive material which comprises an epoxy component including a first flame retardant and a curing component which includes an adhesion promoter and a second flame retardant The epoxy component and curing component are present in a ratio of about 1:1 and the adhesive is formed when the epoxy component is combined with the curing component.
PRESSURE-SENSITIVE ADHESIVE SHEET AND USE THEREOF
Provided is a PSA sheet having a PSA layer. The PSA layer has a multilayer structure comprising a layer A forming one face of the PSA layer and a layer B placed on the backside of the layer A. The layer B is a photo-crosslinkable PSA layer comprising a photo-crosslinkable polymer.
Bilayer Reinforcement Structures
A multi-layer composition to be located onto a substrate. The composition comprises a bi-layer construction, including a first layer and a second layer, the first layer having a high elastic modulus and tensile strength in comparison to the second layer. The second layer includes a blowing agent such that, when cured, the first layer is spaced away from the substrate. The compositions of the first layer and second layer are similar, thus enabling the reconstitution of scrap into usable material for forming another multi-layer reinforcement.
Methods of curing ionic liquid epoxy mixtures
The present disclosure is generally directed to a method of curing an ionic liquid epoxy mixture using an electromagnetic signal. First, an ionic liquid epoxy resin comprising ionic liquid epoxide monomers and, optionally, diluent epoxy resins and powdered fillers, is combined with a curing agent to form an ionic liquid epoxy mixture. The mixture is then applied as a coating onto a surface of a material. The coating is placed in contact with a second surface of the same material or a surface of another material. An electromagnetic signal, which in some instances is a microwave signal, is applied to the coating. Following application of the signal, the ionic liquid epoxide monomers polymerize and the mixture cures, adhering the surfaces together. Alternately, the epoxy mixture is applied to a surface and cured with microwaves to form a protective coating as in cladding or paint.