An adhesive material contains a styrene resin, a (meth)acrylate resin, and an oxidatively polymerizable compound, wherein the adhesive material has a sea-island structure that includes a sea portion containing the styrene resin and an island portion containing the (meth)acrylate resin, and the glass transition temperature of the (meth)acrylate resin is at least 30° C. lower than the glass transition temperature of the styrene resin.

According to one aspect, the present disclosure relates to a curable precursor of a structural adhesive composition, comprising: a) a thermally curable resin; b) a thermal curing initiator for the thermally curable resin; c) a radiation self-polymerizable multi-functional compound comprising a polyether oligomeric backbone and at least one free-radical (co)polymerizable reactive group at each terminal position of the oligomer backbone; and d) a free-radical polymerization initiator for the radiation self-polymerizable multi-functional compound; wherein the free-radical polymerization initiator is activated by visible light.

Provided is an adhesive tape having a base material layer and an adhesive layer disposed on the base material layer, wherein the adhesive layer contains a radical photoinitiator and polymer A having polymerizable carbon double bonds, a tensile modulus of elasticity of the adhesive layer after ultraviolet irradiation is 400 MPa or less, and an elongation at break of the adhesive layer after ultraviolet irradiation is 16% or more.

The present application relates to a method for manufacturing a foldable backplate film, and according to one aspect of the present invention, a method for manufacturing a foldable backplate film that the foldable backplate film is manufactured by a method of cutting it in a direction from the release film to the protective film upon half-cutting, and then release-changing the release film to an extended release film, whereby by improving a half-cutting process, the release film is not peeled off due to the sticking-out of the pressure-sensitive adhesive upon product handling and transportation, or the foldable backplate does not fall off upon the release film peeling, is provided.

An adhesive composition, a method of making the adhesive composition, and an article that contains the adhesive composition are provided. The adhesive composition contains a polymeric material that includes a monomeric unit derived from a polyether (meth)acrylamide macromer having a polyether group comprising at least 50 mole percent propylene oxide based on total moles of alkylene oxide in the polyether group. The article includes a layer of the adhesive composition positioned next to a substrate. The articles can be, for example, an adhesive tape or can be part of another article such as, for example, an electronic device that is impact resistant and/or flexible.

Provided is a masking tape for a shot peening process, including: a substrate having a first surface and a second surface; and a pressure-sensitive adhesive layer disposed on the first surface of the substrate. The masking tape has a breaking strength of 55 N/15 mm or more and exhibits an impact absorption rate of 20% or more in a falling ball impact test. Further, the masking tape has a displacement distance of 2 mm or less after 1 h from an initial position in a holding power test at 40 C. which is performed by applying a load of 500 g.

A high-frequency-dielectric-heating adhesive for bonding three or more adherends to each other is provided. A dielectric property DP1 of the adhesive and a dielectric property DP2 of each of the adherends satisfy a numerical formula (Numerical Formula 1). The adherends are each an adherend having no flow start temperature or an adherend having the flow start temperature. A flow start temperature TF2 (degrees C.) of the adherends and a flow start temperature TF1 (degrees C.) of the adhesive satisfy a numerical formula (Numerical Formula 2). The dielectric properties DP1, DP2 are defined by values of dielectric properties (tan /r), where tan and r are respectively a dielectric dissipation factor and a relative permittivity at 23 degrees C. and a frequency of 40.68 MHz,

0<DP1DP2(Numerical Formula 1)

5TF2TF1(Numerical Formula 2).

A non-flammable contact adhesive includes copolymer rubbers, tackifiers, stabilizer resins, and a solvent composed of a mixture of flammable and non-flammable components.

The invention relates to an adhesive composition, labels and label laminates containing the adhesive composition, wherein the adhesive composition comprises at least the following components: polymer(s) based on alkyl acrylic ester(s) and pressure polymerized vinyl acetate ethylene copolymer(s) comprising ethylene content between 5 and 40%. Further the invention relates to use of an adhesive composition for label laminates and labels, to use of a label for labelling of an item and to a labelled item.

Provided a wave-absorbing impregnation glue liquid, including: two-component epoxy resin, a solvent, a polyether siloxane, and a carbon powder; wherein a mass ratio of the two-component epoxy resin to the solvent is 1:31:5, a mass ratio of the two-component epoxy resin to the carbon powder is 3:16:1, and a mass fraction of the polyether siloxane in the wave-absorbing impregnation glue liquid is 0.05%0.2%. A wave-absorbing impregnation glue liquid, a wave-absorbing honeycomb and their preparation methods are further provided.