Patent classifications
C09J2301/50
Adhesive resin pellets and method of manufacturing same
A method for manufacturing adhesive resin pellets includes adding an antiblocking agent to water, melting an adhesive resin and extruding the adhesive resin into the water, and cutting the adhesive resin extruded into the water to form adhesive resin pellets. Polyolefin fine particles used for the antiblocking agent have an average particle diameter of 1 m or more and less than 18 m, and the adhesive resin has an adhesive force of less than 15.00 N/25 mm.
ANISOTROPIC CONDUCTIVE FILM AND FABRICATING METHOD THEREOF
The anisotropic conductive film of the present invention includes a resin base tape and a plurality of composite fibers disposed laterally in the resin base tape, wherein each of the composite fibers includes an electrically insulating fiber and a plurality of conductive rings circling the electrically insulating fiber, the conductive rings including a plurality of conductive particles collectively surrounding the electrically insulating fiber by adsorption, wherein the plurality of composite fibers are periodically arranged in the resin base tape along the extending direction of the resin base tape, and the plurality of conductive rings on each of the composite fibers are periodically arranged along the axial direction of the electrically insulating fiber thereof.
VERY LOW-EMISSION, SOLVENT-, PLASTICIZER-, COALESCENT-, FILLER- AND LIGHT FILLER-FREE AQUEOUS DISPERSION PARQUET ADHESIVE WITH LOW DENSITY AND PARTICULARLY ADVANTAGEOUS MECHANICAL PROPERTIES
Disclosed is an aqueous dispersion parquet adhesive based on at least one dissolved polyvinyl alcohol, at least one dispersed, vinyl acetate-containing polymer, and at least one dispersed, acrylate-containing polymer. The dispersion parquet adhesive has low density, excellent processing properties, and advantageous mechanical properties. The dispersion parquet adhesive according to the invention has an exceptionally high weight ratio of polymeric binder to water and a defined weight ratio of dissolved polymeric binder to dispersed polymeric binder. Also disclosed is a method of producing the parquet adhesive.
Packaged pre-adhesive composition including a polylactic acid-containing packaging material, adhesives, and articles
A polymerizable pre-adhesive composition includes packaging material and a packaged pre-adhesive reactive mixture sealed within the packaging material. The packaging material includes: a semicrystalline polylactic acid (PLA); a polyvinyl acetate (PVAc); and a plasticizer; wherein the PLA/PVAc-containing packaging material has a single T.sub.g of less than 25 C. and a normalized Haze value of less than 10% per 25 microns.
PACKAGED PRE-ADHESIVE COMPOSITION INCLUDING A POLYLACTIC ACID-CONTAINING PACKAGING MATERIAL, ADHESIVES, AND ARTICLES
A polymerizable pre-adhesive composition includes packaging material and a packaged pre-adhesive reactive mixture sealed within the packaging material. The packaging material includes: a semicrystalline polylactic acid (PLA); a polyvinyl acetate (PVAc); and a plasticizer; wherein the PLA/PVAc-containing packaging material has a single T.sub.g of less than 25 C. and a normalized Haze value of less than 10% per 25 microns.
SHEET ADHESIVE AND ADHESION METHOD THEREOF
The present invention relates to a sheet-shaped adhesive and an adhesion method thereof, wherein the sheet-shaped adhesive includes a sheet carrier, a colloid, and isolation films; the sheet carrier has a plurality of non-closed accommodation spaces densely distributed therein; the colloid is coated on the sheet carrier, permeates and fills all the accommodation spaces; and the isolation films seal and wrap the sheet carrier coated with the colloid, so as to solve the problem that the existing adhesive easily causes waste and easily forms air bubbles to cause poor adhesion.
Adhesive sheet joining method and adhesive sheet joining apparatus
A die coater 10 as a coating member directly applies an adhesive resin G to a joining portion of a workpiece W by a predetermined width while a holding table 1 holding the workpiece W placed thereon moves. A reinforcing substrate T supplied from an original master roll is joined to the resin G applied to the workpiece W while being pressed by a joining roller 15, and the reinforcing substrate T is cut by a predetermined length. That is, an adhesive sheet is directly formed on the workpiece W.
Adhesive system with highly reactive pretreatment agent
An adhesive system, having an adhesion promoter composition, containing at least one mercaptosilane, at least one polysilane, at least one transition metal complex having substantially only monodentate ligands, and at least one non-alcoholic solvent, and an adhesive, wherein the adhesive, within an hour after application and storage at 23 C. and 50% relative air humidity, has a tensile shear strength of at least 3 MPa, as measured according to ISO 4587, and/or, within an hour after application and storage at 23 C. and 50% relative air humidity, has at least 50%, preferably at least 60%, of the tensile shear strength achievable after application and storage for 7 days at 23 C. and 50% relative air humidity, as measured according to ISO 4587. An adhesion promoter system has a liquid container having a manually actuable output apparatus, and an adhesion promoter composition, as disclosed above.
Hydrophilic Hot Melt Adhesive and Uses Thereof
The invention provides hydrophilic hot melt adhesive composition with improved water wetting properties. The hydrophilic hot melt adhesive is particularly suitable in the manufacture of disposable nonwoven articles.
WAVE-ABSORBING IMPREGNATION GLUE LIQUID, WAVE-ABSORBING HONEYCOMB, AND PREPARATION METHODS THEREOF
Provided a wave-absorbing impregnation glue liquid, including: two-component epoxy resin, a solvent, a polyether siloxane, and a carbon powder; wherein a mass ratio of the two-component epoxy resin to the solvent is 1:31:5, a mass ratio of the two-component epoxy resin to the carbon powder is 3:16:1, and a mass fraction of the polyether siloxane in the wave-absorbing impregnation glue liquid is 0.05%0.2%. A wave-absorbing impregnation glue liquid, a wave-absorbing honeycomb and their preparation methods are further provided.