In a method for applying an adhesive film (10) to the surface (20) of a component, an adhesive film (10) including an adhesive layer (11) is provided. Furthermore, a component including a surface (20) to which the adhesive film is to be applied is provided. A physical surface activation of the adhesive layer (11) of the adhesive film (10) is carried out. The adhesive layer (11) of the adhesive film (10) is moistened before the surface-activated and moistened adhesive film (10) is brought in contact with the surface (20) of the component to which the adhesive film is to be applied.

The present disclosure discloses a low-viscosity thermosetting starch adhesive for particleboards, and a preparation method therefore, belonging to the technical field of adhesive preparation. The adhesive of the present invention selects N-hydroxyethyl acrylamide or acetoxyethyl methacrylate as the crosslinking monomer, which has a low degree of crosslinking in the process of adhesive preparation to avoid the problem of increasing viscosity, but can cross-link quickly during the hot pressing process, forming a network structure, and improving the water resistance of the adhesive; and furthermore, itaconic acid is added to promote the self-crosslinking reaction of the crosslinking monomer in the hot-pressing process, thus further improving the water resistance. The properties of the manufactured particleboards reach the standard of P2 type particleboards, so that the adhesive can be suitable for mass production and can be widely applied in the preparation of wood decoration, particleboards, plywood and fiberboard.

A method for fabricating, and curing, nanocomposite adhesives including introducing nanoheater elements into a heat-curing adhesive to fabricate a nanocomposite adhesive, and providing a radio-frequency (RF) electromagnetic wave to the nanocomposite adhesive to heat, and cure the nanocomposite adhesive. The nanocomposite adhesive is physically applied to first and second materials to bond the first and second materials upon curing of the nanocomposite adhesive, and the RF electromagnetic wave has a frequency in the radio-frequency range, having energy that is transferred to the nanoheater elements by electromagnetic wave interactions with permanent and induced dipoles, intrinsic photon-phonon interaction, or interactions with nanoheater defects and grain structures.

The present disclosure generally relates to ionic compositions which may be used in or as an adhesive material for selectively adhering two items together. More particularly, but not exclusively, the present disclosure relates to ionic compositions that include a cationic imidazolium compound and an anionic compound such as a sulfonyl imide compound.

Adhesive sheet material application squeegees are disclosed.

A hot melt adhesive composition that includes at least 5% by weight of a first amorphous alpha-olefin copolymer derived from propylene and at least one olefin comonomer other than propylene, the first amorphous alpha-olefin copolymer having a viscosity of less than 50,000 cP at 190 C., from 1% by weight to 20% by weight of a second polyolefin derived from propylene and optionally an alpha-olefin comonomer, the second polyolefin exhibiting a heat of fusion from 15 Joules per gram (J/g) to no greater than 90 J/g, a third polyolefin derived from propylene and optionally an alpha-olefin comonomer other than propylene, the third polyolefin being different from the first amorphous alpha-olefin copolymer and the second polyolefin and exhibiting a melt flow rate of no greater than 100 grams/10 minute and a density of no greater than 0.880 g/cm.sup.3, tackifying agent, and liquid plasticizer.

The present invention provides a void-containing layer in which a pressure-sensitive adhesive or an adhesive is less liable to penetrate into voids. A void-containing layer of the present invention, includes: particles chemically bonding to each other, wherein the void-containing layer has a void fraction of 35 vol % or more, the particle is an inorganic-organic composite particle in which an organic group is bonded to an inorganic compound, the organic group includes a R.sup.1 group which is a linear or branched alkyl group and a R.sup.2 group which is a group containing a carbon-carbon unsaturated bond, and a molar ratio of the R.sup.2 group relative to a sum of the R.sup.1 group and the R.sup.2 group is from 1 to 30 mol %.

A method for transferring an adhesive layer of thermoplastic polymer(s) from a first substrate to a second substrate including: depositing an antiadhesive layer on a first substrate, this layer being deposited on the periphery of the top face of said substrate, referred to as peripheral layer, thus providing on said top face a zone devoid of said layer, referred to as central zone; depositing an adhesive layer of thermoplastic polymer(s) on said central zone; depositing an antiadhesive layer on a second substrate, this layer being deposited on the top face of the second substrate excluding its periphery, said periphery being thus devoid of said antiadhesive layer; bonding the first substrate and the second substrate consisting of thermocompressing the top face of the first substrate onto the top face of the second substrate; removing the first substrate, whereby the second substrate remains, of which the top face is coated by the adhesive layer of thermoplastic polymer(s).

An object of the invention is to provide a flame retardant coating composition that can be applied on the surface of a product to increase flame retardancy while maintaining adhesiveness. In order to achieve the above object, the first aspect of the invention may provide a flame retardant coating composition including a siloxane binder containing at least one of an epoxy group or a dimethyl group and a phenyl group, and a phosphorus-based flame retardant.

The present disclosure relates to a process of manufacturing a pressure sensitive adhesive, comprising the steps of: a) providing a hot melt mixing apparatus comprising a reaction chamber; b) providing a hot melt processable pressure sensitive adhesive composition comprising: (1) a (meth)acrylate copolymer component comprising: i. C1-C32 (meth)acrylic acid ester monomer units; ii. optionally, ethylenically unsaturated monomer units having functional groups selected from the group consisting of acid, hydroxyl, acid anhydride, epoxide, amine, amide groups, and any combinations thereof; and iii. optionally, further ethylenically unsaturated monomer units which are copolymerizable with monomer units (i) and/or (ii); and (2) a crosslinking system selected from the group consisting of thermal crosslinking systems, actinic radiation crosslinking systems, and any combinations thereof; (3) optionally, at least one expandable microsphere; and (4) optionally, at least one pigment; c) providing a polymeric resin; d) subjecting the polymeric resin to a heating step (thereby at least partly remove low Volatile Organic Compounds (VOC) from the polymeric resin) thereby forming a cleaned polymeric resin; e) incorporating the cleaned polymeric resin and the hot melt processable pressure sensitive adhesive composition in the reaction chamber of the hot melt mixing apparatus; 57-f) mixing the hot melt processable pressure sensitive adhesive composition and the cleaned polymeric resin in the hot melt mixing apparatus thereby forming a hot melt blend; g) removing the hot melt blend from the hot melt mixing apparatus; and h) optionally, crosslinking the hot melt blend.