An organic electronic device including a substrate, an organic electronic element formed on the substrate, and an encapsulation film encapsulating the organic electronic element. The organic electronic element includes a transparent electrode formed on the substrate, and a light emitting organic material layer formed on the transparent electrode. The light emitting organic material layer includes a hole transport layer, an emitting layer and an electron transport layer. The encapsulation film includes a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer includes a pressure-sensitive adhesive composition or a crosslinked product thereof. The pressure-sensitive adhesive composition includes a polymer derived from butylene, and has a Mooney viscosity (η*) of 5000 Pa.Math.s to 10.sup.7 Pa.Math.s measured by a shear stress using a planar jig having a diameter of 8 mm at a strain of 5%, a frequency of 1 Hz and any one temperature point in the range of 30° C. to 150° C.

A sealing device including a waterproofing membrane, a sealant layer covering a portion of the second primary exterior surface of the waterproofing membrane, and an adhesive layer covering a portion of the second primary exterior surface of the waterproofing membrane, wherein the sealant layer is composed of an adhesive sealant composition comprising 1-40 wt.-% of at least one elastomer, 10-60 wt.-% of at least one at 25° C. liquid polyolefin resin, and 5-65 wt.-% of at least one inert mineral filler. Further, a method for producing a sealing device, to a method for waterproofing a substrate, and to a waterproofed substrate.

Provided is a barrier adhesive composition comprises polyisobutylene resin, organically modified nanoclay (e.g. montmorillonite or bentonite) and sorbent nanoparticles (e.g. CaO which acts as a desiccant and/or getter). In a preferred embodiment, the barrier adhesive composition is disposed on a gas-barrier film to form an adhesive barrier film. The adhesive barrier film can then be used for protection from oxygen and moisture in OLED displays and solid state lightings, solar cells, electrophoretic and electrochromic displays thin film batteries, quantum dot devices, sensors (e.g. touch sensor) and other organic electronic devices. The adhesive barrier film is especially well-suited for applications that require oxygen and moisture protection as well flexibility and good optical transmittance.

A film including: a substrate; a first barrier layer on the substrate; a resin layer on the first barrier layer; wherein the resin layer includes a structured major surface and a plurality of features; a second barrier layer on the structured major surface of the first resin layer; and an adhesive layer on the second barrier layer, wherein the adhesive layer includes a structured major surface and a plurality of features.

Disclosed are a hot melt tape for hook-and-loop fasteners without sewing which may be adhered at a low temperature and complete hardening of an adhesive resin in a short time and a method for manufacturing a seat padding material for vehicles using the same. The method includes preparing the padding material and a hook-and-loop fabric, preparing a hot melt tape having a hot melt resin layer by coating a surface of a release paper with a reactive hot melt resin having a melting point of 40-80° C. before reacting, adhering the hot melt tape to a surface of the padding material by applying heat of a temperature of 30-70° C. and pressure thereto, removing the release paper, adhering the hook-and-loop fabric to the exposed hot melt resin layer, and hardening the hot melt resin layer by cooling the padding material and the hook-and-loop fabric to a temperature of 0-20° C.

The present invention provides a temporary-bonding adhesive having excellent heat resistance, whereby a semiconductor circuit formation substrate and a support substrate can be bonded by a single type of adhesive layer, the adhesive force thereof does not change over the course of steps for manufacturing a semiconductor device or the like, and the adhesive can subsequently be easily de-bonded at room temperature under mild conditions; and a method for manufacturing a semiconductor device using the temporary-bonding adhesive. The present invention includes a temporary-bonding adhesive wherein a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, the diamine residue including both of (A1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 1 to 15, and (B1) a polysiloxane-based diamine residue represented by a general formula (1) in which n is a natural number from 16 to 100, the polyimide copolymer containing 40-99.99 mol % of the (A1) residue and 0.01-60 mol % of the (B1) residue.

The invention relates to an adhesive strip, in particular a winding strip for sheathing cables in automobiles, comprising a textile support (1.2) that has at least one first fabric (1) and a second fabric (2) which are connected together and comprising an adhesive coating (5) on at least one face of the support (1, 2). According to the invention, the two fabrics (1, 2) are preferably coupled together solely by connection threads (3) of the fabrics.

Disclosed herein are various embodiments of a protective packaging system suitable for use with a prefinished building article. The protective packaging system generally is designed to reduce shrink back of the flexible substrate after tension is applied. The protective packaging system generally comprises at least one outer layer, at least one core layer and at least one adhesive layer. One or more layers of the protective packaging system may include a roughening agent such that the flexible substrate will not gloss or burnish a coating on a prefinished building article.

An object of the present invention is to provide an adhesive tape having flexibility even at a low temperature, having excellent adhesive force at low temperature and after a certain period, and having excellent holding force after a certain period, and suppressing adhesive residue at peeling off even after being left for a certain period.

According to the present invention, provided is an adhesive tape comprising a substrate and an adhesive layer, wherein the adhesive layer is formed directly on the substrate or with another layer therebetween, the substrate contains a polyvinyl chloride resin, a plasticizer, and a zinc compound, a content of the plasticizer in the substrate is 30 to 50 mass % with respect to the total mass of the substrate, a content of a zinc atom in the substrate is 0.01 to 0.15 mass % with respect to the total mass of the substrate, and the adhesive layer contains an adhesive component and a vulcanizing agent.

What is provided is a heat-shrinkable film and a heat-shrinkable label that, when applied to a container in which the difference between the diameter of the body portion and the diameter of the mouth portion is large, sufficiently shrink in the mouth portion and do not easily allow the generation of a wrinkle or a sink mark in the mouth portion. The heat-shrinkable film contains polyester, a dicarboxylic acid component that constitutes the polyester contains 95 mol % or more of terephthalic acid, and a diol component that constitutes the polyester contains 50 mol % or more of ethylene glycol and 15 mol % or more of cyclohexanedimethanol. The shrinkage rate in the primary shrinkage direction when the heat-shrinkable film is immersed in hot water at 70 C. for 30 seconds is 20% or less, the shrinkage rate in the primary shrinkage direction when the heat-shrinkable film is immersed in hot water at 80 C. for 30 seconds is 45% to 65%, and the shrinkage rate in the primary shrinkage direction when the heat-shrinkable film is immersed in hot water at 98 C. for 30 seconds is 65% or more.