A membrane composite comprising a polymeric membrane panel, an adhesive layer, and a release liner, where the adhesive layer is a pressure-sensitive adhesive that is at least partially cured, and includes at least two distinct regions with the at least two regions having distinct states of cure.

A bonding film for bonding a semiconductor element and a substrate. The bonding film has an electroconductive bonding layer formed by molding an electroconductive paste including metal fine particles (P) into a film form, and a tack layer having tackiness and laminated on the electroconductive bonding layer. The tack layer includes 0.1% to 1.0% by mass of metal fine particles (M) with respect to the metal fine particles (P) in the electroconductive bonding layer, and the metal fine particles (M) have a melting point of 250 C. or lower.

The present disclosure provides an article. The article includes an adhesive layer with two opposing surfaces. The adhesive layer includes (i) a functionalized ethylene-based polymer having a melt index from 0.1 g/10 min to 300 g/10 min; (ii) from 0.01 wt % to 45 wt % of a functionalized hydrocarbon; (iii) a tackifier; and (iv) optionally, a crosslinking agent.