A wafer processing method includes a wafer providing step of placing a polyolefin or polyester sheet on an upper surface of a substrate for supporting a wafer and placing the wafer on an upper surface of the sheet in a condition where a back side of the wafer is exposed upward, a thermocompression bonding step of setting the wafer placed through the sheet on the substrate in an enclosed environment, next evacuating the enclosed environment, and next heating the sheet as applying a pressure to the wafer, thereby uniting the wafer through the sheet to the substrate by thermocompression bonding, a back processing step of processing the back side of the wafer supported through the sheet to the substrate, and a separating step of separating the wafer from the sheet bonded to the substrate.

An aqueous dispersion contains a resin component and water, wherein the resin component contains composite particles (D) having the ethylene-unsaturated carboxylic acid copolymer (A) and the polymer having an acrylic acid ester unit as a polymerization unit (B), and composite particles (E) having the ethylene-unsaturated carboxylic acid copolymer (A) and the ethylene-vinyl acetate copolymer (C).

A polymer composition for lamination characterized in that the composition consists of (X1) 100 to 60% by weight of an ionomer characterized in that at least a part of a carboxyl group and/or a dicarboxylic anhydride group in a copolymer (P) containing a structural unit (A) derived from ethylene and/or an α-olefin having 3 to 20 carbon atoms and a structural unit (B) derived from a monomer having a carboxyl group and/or a dicarboxylic anhydride group as essential constitutional units being converted into a metal-containing carboxylic acid salt containing at least one kind of a metal ion(s) selected from Group 1, Group 2 or Group 12 of the periodic table, and a phase angle δ of the ionomer at an absolute value G*=0.1 MPa of a complex modulus of elasticity measured by a rotary rheometer is a range of 50 degrees to 75 degrees, and (X2) 40 to 0% by weight of an ethylene-based copolymer.

Provided are curable adhesives, along with adhesive tapes, laminates, and laminated mirror buttons that include the curable adhesive. The curable adhesive includes a (meth)acrylate polymer, a curable oxetane compound, a polymer filler, and a photoinitiator for curable oxetane compounds. The curable adhesive, when cured, can provide excellent interfacial failure resistance.

The present invention relates to a thermoplastic hot melt film having excellent adhesive strength in which hydrophobic nanosilica is mixed. The resin composition contains nanosilica having a particle size of 1 to 100 nm and containing hydrophobic functional groups on its surface in the range of 0.1 to 5 phr (Parts per Hundred Resin), and the nanosilica forms nanosilica aggregates with an average size of the aggregates is within 100˜1200 nm. The thickness of the thermoplastic hot melt film is 0.02˜0.3 mm. The thermoplastic hot melt film of the present invention is mixed with nanosilica containing hydrophobic functional groups, lipophilic, on the surface to improve dispersibility, strengthen water resistance, and increase tensile strength. The material cost is reduced while securing one adhesive strength and excellent durability, and multi-press molding is possible, which has the effect of increasing energy saving and productivity.

The present invention relates to a thermoplastic hot melt film having excellent adhesive strength in which hydrophobic nanosilica is mixed. The resin composition contains nanosilica having a particle size of 1 to 100 nm and containing hydrophobic functional groups on its surface in the range of 0.1 to 5 phr (Parts per Hundred Resin), and the nanosilica forms nanosilica aggregates with an average size of the aggregates is within 100˜1200 nm. The thickness of the thermoplastic hot melt film is 0.02˜0.3 mm. The thermoplastic hot melt film of the present invention is mixed with nanosilica containing hydrophobic functional groups, lipophilic, on the surface to improve dispersibility, strengthen water resistance, and increase tensile strength. The material cost is reduced while securing one adhesive strength and excellent durability, and multi-press molding is possible, which has the effect of increasing energy saving and productivity.

Disclosed herein are various embodiments of a protective packaging system suitable for use with a prefinished building article. The protective packaging system generally is designed to reduce shrink back of the flexible substrate after tension is applied. The protective packaging system generally comprises at least one outer layer, at least one core layer and at least one adhesive layer. One or more layers of the protective packaging system may include a roughening agent such that the flexible substrate will not “gloss” or burnish a coating on a prefinished building article. The protective packaging system may also include one or more biocides.

Disclosed herein are various embodiments of a protective packaging system suitable for use with a prefinished building article. The protective packaging system generally is designed to reduce shrink back of the flexible substrate after tension is applied. The protective packaging system generally comprises at least one outer layer, at least one core layer and at least one adhesive layer. One or more layers of the protective packaging system may include a roughening agent such that the flexible substrate will not “gloss” or burnish a coating on a prefinished building article. The protective packaging system may also include one or more biocides.

A method for dielectrically heating foamable composition to foam and set the composition is described. In particular, radio frequency (RF) heating is used to heat the foamable composition to provide insulation in the manufacture of an article.

Provided is a pressure-sensitive adhesive sheet that may be used for the grinding of a hard and brittle substrate in a backgrinding step for the hard and brittle substrate, the pressure-sensitive adhesive sheet being excellent in all of low contamination property, productivity, grinding accuracy, and peelability. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer has a thickness of from 1 μm to 300 μm, and wherein a microhardness H (Pa) of the pressure-sensitive adhesive layer at 25° C. and the thickness, which is represented by h.sub.A (μm), of the pressure-sensitive adhesive layer satisfy a relationship represented by the following expression (1). log H≥1.9385×log h.sub.A+4.2611 . . . (1)