The invention provides adhesives comprising at least one polymer component which contains at least 65 weight percent propylene, at least one nucleator and at least one functionalized wax. The inventive adhesives have increased heat resistance and decreased set-time, making them particularly well suited for assembly and packaging applications.

A dielectric welding film capable of tightly welding adherends of a polyolefin resin or the like within a relatively short time through dielectric heating, and a bonding method using the dielectric welding film are provided. The dielectric welding film is configured to bond a plurality of adherends of the same material or different materials through dielectric heating, the dielectric welding film containing (A) a polyolefin resin and (B) a dielectric filler whose mean particle size measured in accordance with JIS Z 8819-2 (2001) is in a range from 1 to 30 m, a thickness of the dielectric welding film ranging from 10 to 2,000 m. The method uses the dielectric welding film.

Provided is adhesive resin compositions comprising (A) 30 to 70% by mass of an acid-modified polypropylene-based resin; (B) 20 to 60% by mass of a polypropylene-based resin; and (C) 2 to 20% by mass of a copolymer of ethylene and one or more kinds of comonomers selected from the group consisting of vinyl acetate, alkyl methacrylate, and alkyl acrylate, with the proviso that the sum of the percentages of the above component (A), the above component (B), and the above component (C) is 100% by mass.

A laminate for a battery with a polypropylene adhesive layer and and a metal substrate layer: (1) the adhesive includes 40-94 wt % of a propylene copolymer (A), 3-30 wt % of a butene-containing copolymer (B), 3-30 wt % of an ethylene--olefin copolymer (C) ((A), (B), and (C) is 100 wt %), (2) the copolymer (A) has a melting point of 130 C. or more measured with a differential scanning calorimeter, and a total proportion of a structural unit derived from ethylene is 4-25 mol % relative to 100 mol % of a total structural units forming all the copolymers (A) contained in the adhesive, (3) the copolymer (B) includes less than 1 mol % of a structural unit derived from ethylene, and has a melting point of 100 C. or less measured with a differential scanning calorimeter, and (4) the copolymer (C) includes 50-99 mol % of a structural unit derived from ethylene.

A laminate for a battery with a polypropylene adhesive layer and and a metal substrate layer: (1) the adhesive includes 40-94 wt % of a propylene copolymer (A), 3-30 wt % of a butene-containing copolymer (B), 3-30 wt % of an ethylene--olefin copolymer (C) ((A), (B), and (C) is 100 wt %), (2) the copolymer (A) has a melting point of 130 C. or more measured with a differential scanning calorimeter, and a total proportion of a structural unit derived from ethylene is 4-25 mol % relative to 100 mol % of a total structural units forming all the copolymers (A) contained in the adhesive, (3) the copolymer (B) includes less than 1 mol % of a structural unit derived from ethylene, and has a melting point of 100 C. or less measured with a differential scanning calorimeter, and (4) the copolymer (C) includes 50-99 mol % of a structural unit derived from ethylene.

The present invention relates to a thermally crosslinkable composition comprising an acid-modified polymer A having a melting point of 110 to 150 C. and a crystallization temperature of 50 to 90 C., an acid-modified polymer B having a melting point of 30 to 110 C. and a crystallization temperature of lower than 50 C., a tackifier resin, and a curing agent, wherein the thermally crosslinkable composition has a crystallization temperature of 30 to 70 C.

Disclosed is a hot melt adhesive composition that includes a first amorphous alpha-olefin copolymer derived from propylene and at least one olefin comonomer other than propylene, the first amorphous alpha-olefin copolymer having a viscosity from 750 centipoise (cP) to less than 50,000 centipoise at 190 C., a second polyolefin derived from propylene and optionally a comonomer, the second polyolefin exhibiting a heat of fusion from 15 Joules per gram (J/g) to no greater than 50 J/g, a hydrogenated styrenic block copolymer that includes styrene polymer blocks and at least one hydrogenated conjugated diene polymer block, tackifying agent, and liquid plasticizer.

A hot melt adhesive composition that includes at least 5% by weight of a first amorphous alpha-olefin copolymer derived from propylene and at least one olefin comonomer other than propylene, the first amorphous alpha-olefin copolymer having a viscosity of less than 50,000 cP at 190 C., from 1% by weight to 20% by weight of a second polyolefin derived from propylene and optionally an alpha-olefin comonomer, the second polyolefin exhibiting a heat of fusion from 15 Joules per gram (J/g) to no greater than 90 J/g, a third polyolefin derived from propylene and optionally an alpha-olefin comonomer other than propylene, the third polyolefin being different from the first amorphous alpha-olefin copolymer and the second polyolefin and exhibiting a melt flow rate of no greater than 100 grams/10 minute and a density of no greater than 0.880 g/cm.sup.3, tackifying agent, and liquid plasticizer.

A wafer processing method includes a wafer providing step of placing a polyolefin or polyester sheet on an upper surface of a substrate for supporting a wafer and placing the wafer on an upper surface of the sheet in a condition where a back side of the wafer is exposed upward, a thermocompression bonding step of setting the wafer placed through the sheet on the substrate in an enclosed environment, next evacuating the enclosed environment, and next heating the sheet as applying a pressure to the wafer, thereby uniting the wafer through the sheet to the substrate by thermocompression bonding, a back processing step of processing the back side of the wafer supported through the sheet to the substrate, and a separating step of separating the wafer from the sheet bonded to the substrate.

A base polymer for hot-melt adhesive, containing a propylenic polymer (A) having a tensile modulus of elasticity of 60 MPa or more, and an olefinic polymer (B) having a tensile modulus of elasticity of less than 60 MPa, wherein, relative to 100 parts by mass of the total amount of the propylenic polymer (A) and the olefinic polymer (B), the content of the propylenic polymer (A) is 1 part by mass or more and less than 50 parts by mass, and the content of the olefinic polymer (B) is more than 50 parts by mass and 99 parts by mass or less; and a hot-melt adhesive containing the base polymer, and further containing at least one of (C) a tackifier resin and (D) an oil.