An article includes a substrate including a bonding surface area, a first adhesive disposed on the bonding surface area in a first discrete pattern, the first adhesive comprising a hot melt adhesive, and a second adhesive disposed on the bonding surface area in a second discrete pattern that is complementary to the first discrete pattern, wherein the first discrete pattern comprises about 1% to about 25% of the bonding surface area and the second discrete pattern comprises a balance of the bonding surface area.

The present invention is related to an article comprising a substrate, having at least one propylene terpolymer comprising propylene derived units, one or more dienes, and an alpha-olefin content of less than about 35 wt % of the propylene terpolymer; and an adhesive composition, having about 20 to about 80 wt % of a polymer blend comprising a first propylene-based polymer, that is a homopolymer of propylene or a copolymer of propylene and ethylene or a C.sub.4 to C.sub.10 alpha-olefin, and a second propylene-based polymer, that is a homopolymer of propylene or a copolymer of propylene and ethylene or a C.sub.4 to C.sub.10 alpha-olefin; wherein the second propylene-based polymer is different than the first propylene-based polymer; and wherein the adhesive composition is applied to the substrate at temperature of less than about 150 C.

An adhesive composition, which exhibits excellent adhesion to base films made from polyimide resins and the like or copper foils, as well as superior electrical properties, and a laminate having an adhesive layer, which is low in warpage when the adhesive layer is in the B stage, and which is excellent in storage stability of the laminate, are provided. The adhesive composition includes a modified polyolefin-based resin and an epoxy resin, in which the modified polyolefin-based resin is a resin resulting from graft-modification of an unmodified olefin resin with a modifying agent containing an ,-unsaturated carboxylic acid or derivative thereof, wherein the content of the modified polyolefin-based resin is 50 parts by mass or more relative to 100 parts by mass of the solid content of the adhesive composition; the content of the epoxy resin is from 1 to 20 parts by mass relative to 100 parts by mass of the modified polyolefin-based resin; and the dielectric constant of a cured body of the adhesive is less than 2.5 as measured at a frequency of 1 GHz.

The present invention is directed to hot-fill/retort packaging films having a sealant layer composition comprising a first propylene-ethylene copolymer, a second propylene-ethylene copolymer and a polyethylene. Hot-fill/retort packaging films are provided herein having a sealant layer composition that exhibits an ultimate hot tack within a range from 88 N/m to 876 H/m (0.5 lb./in to 5 lb./in) at a temperature within the range from 116 C. to 182 C. (240 F. to 360 F.).

The present invention is directed to hot-fill/retort packaging films having a sealant layer composition comprising a first propylene-ethylene copolymer, a second propylene-ethylene copolymer and a polyethylene. Hot-fill/retort packaging films are provided herein having a sealant layer composition that exhibits an ultimate hot tack within a range from 88 N/m to 876 H/m (0.5 lb./in to 5 lb./in) at a temperature within the range from 116 C. to 182 C. (240 F. to 360 F.).

The disclosure relates to adhesive compositions comprising a semi-crystalline olefin polymer or copolymer and a functionalized wax, functionalized olefin polymer, or mixture thereof. These compositions are useful as, for example, adhesives in disposable articles such as diapers, adult incontinence articles, underpads, personal care garments, and the like.

A dielectric welding film capable of providing excellent adhesiveness to a variety of adherends in a short period of dielectric heating, and an welding method using the dielectric welding film are provided. The dielectric welding film is configured to adhere a pair of adherends of the same material or different materials through dielectric heating, the dielectric welding film including a first thermoplastic resin as an A1 component having a predetermined solubility parameter, a second thermoplastic resin as an A2 component having a solubility parameter larger than the solubility parameter of the first thermoplastic resin, and a dielectric filler as a B component. The welding method uses the dielectric welding film.

Described herein is an adhesive composition including at least 90 wt. % of a copolymer including from about 30 wt. % to about 70 wt. % of propene monomer units and from about 30 wt. % to about 70 wt. % of 1-butene monomer units. The adhesive composition can have a viscosity of from about 2,000 mPa.Math.s to about 11,500 mPa.Math.s at 150 C. The adhesive composition can have an Enthalpy of Fusion of less than 17 J/g. The adhesive composition can have a Tensile Strength at Yield of from about 0.5 MPa to about 1.5 MPa. The copolymer can have a Static Peel Time of at least 220 seconds.

Described herein is an adhesive composition including a copolymer. The adhesive composition has a viscosity of from about 2,000 mPa.Math.s to about 11,500 mPa.Math.s at 150 C. The adhesive composition has a Storage Modulus at 37 C. of from about 3 MPa to 9.5 MPa. The adhesive composition has a Yield Stress at 37 C. of from about 0.8 MPa to about 1.45 MPa.

Described herein is an absorbent article. The absorbent article includes an assembly of components and an adhesive composition joining at least two of the assembly of components together. The adhesive composition includes from about 70 wt. % to about 90 wt. % of one or more copolymers and from about 10 wt. % to about 30 wt. % of one or more heterophase copolymers. The one or more copolymers include from about 30 mole % to about 70 mole % of monomer units selected from ethylene, 1-butene, and mixtures thereof. The one or more copolymers also include from about 30 mole % to about 70 mole % of propene monomer units. The adhesive composition is free of polyisobutylene and has a viscosity of from about 2,000 mPa.Math.s to about 11,500 mPa.Math.s at 150 C.