A method of installing a roof system, the method comprising (i) providing a first membrane composite including a polymeric planar body having first and second planar surfaces, a UV-cured pressure-sensitive adhesive layer disposed on the second planar surface, a release member removably secured to the pressure-sensitive adhesive layer opposite the planar body; and a primer layer disposed along a lap area on the first planar surface; (ii) adhesively securing the first membrane composite to a roof surface through the UV-cured pressure-sensitive adhesive layer; (iii) providing a second membrane composite including a polymeric planar body having first and second planar surfaces, a UV-cured pressure-sensitive adhesive layer disposed on the second planar surface, a release member removably secured to the pressure-sensitive adhesive layer opposite the planar body; and optionally including a primer layer disposed along a lap area on the first planar surface; (iv) adhesively securing the second membrane composite to the roof surface through the UV-cured pressure-sensitive adhesive layer, where the second membrane composite is positioned adjacent to and partially overlapping the lap area of the first membrane composite; and (v) adhesively securing the second membrane composite to the first planar surface of the first membrane composite along the primer layer through the UV-cured pressure-sensitive adhesive layer disposed on the second membrane composite.

The present invention relates to a process for cold bonding elastomeric rubber substrates to non-elastomeric substrates of a different material, preferably metal, by use of a rubber treatment, preferably a primer composition and a 2k adhesive, preferably a 2k epoxy adhesive as well as the thus obtained bonded substrates.

The pressure sensitive adhesive tape for semiconductor processing of the present invention is a pressure sensitive adhesive tape for semiconductor processing, which, in a step of grinding a back face of a semiconductor wafer having a groove formed on a front face thereof or having a modified region formed therein to singulate the semiconductor wafer into semiconductor chips, is stuck on the front face of the semiconductor wafer and used, the pressure sensitive adhesive tape for semiconductor processing including a base, a buffer layer provided on one face of the base, and a pressure sensitive adhesive layer provided on the other face of the base, and having a ratio (D2/D1) of a thickness (D2) of the buffer layer to a thickness (D1) of the base of 0.7 or less and an indentation depth (X) of the front face on the buffer layer side of 2.5 m or less.

An adhesive tape (1) which requires a smaller amount of adhesive by comparison with conventional adhesive tapes having the same adhesive properties is obtained using a method for producing an adhesive tape, which method comprises the following steps: a) mixing an ASE thickener with water and producing an (ASE) thickener-water mixture (7); b) producing an adhesive dispersion (8) from an adhesive and a solvent; c) providing a textile substrate (2); d) applying the (ASE) thickener-water mixture (7) to the textile substrate; e) applying the adhesive dispersion (8) to the (ASE) thickener-water mixture (7) in order to obtain the adhesive tape; f) drying the obtained adhesive tape; in which method the thickener, in particular the ASE thickener, is saturated with water and the adhesive dispersion (8) is applied after or at the same time as the (ASE) thickener-water mixture (7) is applied.

Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

The present invention relates to a pressure-sensitive adhesive tape comprising a backing layer having a first and a second surface; and a first pressure-sensitive adhesive layer affixed to the first surface; wherein the first pressure-sensitive adhesive layer has an adhesive strength of 2.0 N/10 mm to 9.0 N/10 mm in absence of a solvent and the pressure-sensitive adhesive tape has a tensile strength in longitudinal direction of 45 N/15 mm to 80 N/15 mm.

Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen from penetrating into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.