Pressure-sensitive adhesive film and method of manufacturing organic electronic device using the same

Abstract

Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen from penetrating into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

Claims

1. A pressure-sensitive adhesive film satisfying Equation 1, comprising: a pressure-sensitive adhesive having a water vapor transmission rate of 50 g/m.sup.2.Math.day or less in a thickness direction, wherein the water vapor transmission rate is measured according to a specification of ASTM F1249:
S3.5 m/min[Equation 1] wherein S is a dimension variation with respect to a longitudinal direction of the film between 40 to 120 minutes, which is measured through thermomechanical analysis (TMA) when the film laminated to a thickness of 600 m is treated with heat at 80 C. for 120 minutes, wherein the pressure-sensitive adhesive comprises a pressure-sensitive adhesive composition comprising: an encapsulating resin which is a polyolefin-based resin or elastomer; and a multifunctional active energy ray-polymerizable compound which is included at 5 to 18 parts by weight relative to 100 parts by weight of the encapsulating resin, wherein the encapsulating resin forms a crosslinking structure with the multifunctional active energy ray-polymerizable compound, wherein the multifunctional active energy ray-polymerizable compound satisfies Formula 1: ##STR00003## where R.sub.1 is hydrogen or an alkyl group having 1 to 4 carbon atoms, n is an integer of 2 or more, and X is a residue derived from a cyclic alkyl group having 3 to 30 carbon atoms, and wherein the pressure-sensitive adhesive film has a gel content represented by Equation 1 of 50% or more:
Gel content (%)=B/A100[Equation 1] wherein, in Equation 1, A is a mass of the pressure-sensitive adhesive, and B is a dry mass of an insoluble content of the pressure-sensitive adhesive remaining after being dipped in toluene at 60 C. for 24 hours and filtered through a 200-mesh filter (pore size of 200 m).

2. The film according to claim 1, wherein the polyolefin-based resin or elastomer is a copolymer of a diene and an olefin-based compound including one carbon-carbon double bond.

3. The film according to claim 1, wherein the pressure-sensitive adhesive composition further comprises a silane compound satisfying Formula 2: ##STR00004## where R.sub.1 is hydrogen or an alkyl group, R.sub.2 and R.sub.3 are each independently hydrogen, or a linear, branched or cyclic alkyl group, or R.sub.2 is linked with R.sub.3, thereby forming a cyclic alkyl group, R.sub.4, R.sub.5 and R.sub.6 are each independently hydrogen, an alkyl group or an alkoxy group, at least one of R.sub.4, R.sub.5, and R.sub.6 is an alkoxy group, and n is an integer of 1 or more.

4. The film according to claim 3, wherein the silane compound satisfying Formula 2 is included at 0.1 to 10 parts by weight relative to 100 parts by weight of the encapsulating resin.

5. The film according to claim 1, wherein the pressure-sensitive adhesive composition further comprises a tackifier.

6. The film according to claim 5, wherein the tackifier is a hydrogenated cyclic olefin-based polymer.

7. The film according to claim 5, wherein the tackifier is included at 5 to 100 parts by weight relative to 100 parts by weight of the encapsulating resin.

8. The film according to claim 1, wherein the pressure-sensitive adhesive composition further comprises a radical initiator.

9. The film according to claim 7, wherein the radical initiator is included at 0.2 to 20 parts by weight relative to 100 parts by weight of the active energy ray-polymerizable compound.

10. The film according to claim 1, wherein the pressure-sensitive adhesive composition further comprises a moisture absorbent.

11. The film according to claim 1, comprising: a first layer comprising the pressure-sensitive adhesive and a second layer comprising a pressure-sensitive adhesive resin or an adhesive resin.

12. The film according to claim 1, which has a light transmittance of 85% or more with respect to the visible-ray region.

13. The film according to claim 1, which has a haze of 3% or less.

14. An organic electronic device comprising a substrate; an organic electronic element formed on the substrate; and the pressure-sensitive adhesive film according to claim 1 encapsulating the organic electronic element.

15. A method of manufacturing an organic electronic device, comprising: applying the pressure-sensitive adhesive film of claim 1 to a substrate on which an organic electronic element is formed in order to cover the organic electronic element; and curing the pressure-sensitive adhesive film.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIGS. 1 and 2 are cross-sectional views of pressure-sensitive adhesive films according to exemplary embodiments of the present invention; and

(2) FIG. 3 is a cross-sectional view of a product for encapsulating an organic electronic device according to an exemplary embodiment of the present invention.

DESCRIPTION OF REFERENCE NUMERALS

(3) 1, 2: pressure-sensitive adhesive film

(4) 11: pressure-sensitive adhesive

(5) 12: first film

(6) 21: second film

(7) 3: organic electronic device

(8) 31: substrate

(9) 32: organic electronic element

(10) 33: pressure-sensitive adhesive or encapsulating layer

(11) 34: cover substrate

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

(12) Hereinafter, the present invention will be described in detail with reference to Examples and Comparative Examples, but the scope of the present invention is not limited to the following Examples.

EXAMPLE 1

(13) A coating solution was prepared by adding 90 g of a butyl rubber (Br268, EXXON) as an encapsulating resin, 10 g of a hydrogenated DCPD-based tackifier resin (SU-525, Kolon) as a tackifier, 6 g of tricyclodecane dimethanol diacrylate (SR833S, Sartomer) as an active energy ray-polymerizable compound, 3 g of 3-methacryloxypropyl trimethoxysilane (Sigma Aldrich.) as a silane compound, and 0.5 g of 2,2-dimethoxy-1,2-diphenylethane-1-one (Irgacure651, Ciba) as a radical initiator, and diluting the mixture in toluene to have a solid content of approximately 20 wt %.

(14) The prepared solution was coated on a released surface of release polyethyleneterephthalate (PET), and dried in an oven at 100 C. for 15 minutes, thereby manufacturing a pressure-sensitive adhesive film including a pressure-sensitive adhesive layer having a thickness of 20 m. Physical properties of the sample were measured after UV rays were irradiated at 2 J/cm.sup.2 onto the manufactured film.

EXAMPLE 2

(15) A pressure-sensitive adhesive film was manufactured by the same method as described in Example 1, except that 10 g of tricyclodecane dimethanol diacylate was used.

EXAMPLE 3

(16) A pressure-sensitive adhesive film was manufactured by the same method as described in Example 1, except that 20 parts by weight of CaO (Aldrich) was further included as a moisture adsorbent relative to 100 parts by weight of an encapsulating resin and a tackifier resin.

COMPARATIVE EXAMPLE 1

(17) A pressure-sensitive adhesive film was manufactured by the same method as described in Example 1, except that 90 g of butyl acrylate and 10 g of acrylic acid were used instead of the butyl rubber and hydrogenated DCPD-based tackifier resin.

COMPARATIVE EXAMPLE 2

(18) A pressure-sensitive adhesive film was manufactured by the same method as described in Example 1, except that the butyl rubber of Example 1 was replaced by B80/B10 (BASF Schweiz AG) in which a PIB resin was blended in 2:1 as an encapsulating resin.

(19) Hereinafter, physical properties of Example and Comparative Example were evaluated by the following methods.

(20) 1. Measurement of Dimension Variation of Pressure-sensitive Adhesive Film Through TMA Analysis

(21) A sample coated with the pressure-sensitive adhesive film according to Examples or Comparative Examples was prepared to a thickness of 600 m at room temperature. After a releasing film was removed, and the sample was cut to a size of 5 mm 80 mm, the film was fastened to a TMA jig. When the film was treated with heat at 80 C. for 120 minutes under a load of approximately 0, a dimension variation with respect to a longitudinal direction of the film was measured between 40 to 120 minutes, and length variation (m/min) per minute was represented as S.

(22) 2. Water Vapor Transmission Rate (WVTR)

(23) A resin composition was prepared by dissolving the resin used in Examples or Comparative Examples in a solvent. The resin composition was applied to a base film (release polyester film, RS-21G, SKC) having a thickness of 38 m. Subsequently, the composition was dried at 110 C. for 10 minutes, thereby forming a film-type layer having a thickness of 100 m. Afterward, the base film was peeled, and then a WVTR of the film-type layer was measured in a thickness direction, while the layer was maintained at 100 F. and a relative humidity of 100%. The WVTR was measured according to a specification of ASTM F1249.

(24) 3. Evaluation of Reliability

(25) A specimen was manufactured by laminating the film manufactured in Examples or Comparative Examples on a barrier film (serving as a cover substrate), laminating a polarizing plate on the barrier film, laminating the resulting laminate between glass substrates, and compressing the resulting product with a pressure and heat using an autoclave at 50 C. under 5 atm. Afterward, the specimen was maintained at 80 C. for 240 hours, and then whether lifting or bubbling was generated at an interface between the glass substrate and the pressure-sensitive adhesive layer was observed. When being viewed with the naked eye, at the interface between the glass substrate and the pressure-sensitive adhesive, if at least one of lifting or bubbling was generated, it was represented as X, and if neither lifting nor bubbling was generated, it was represented as O.

(26) TABLE-US-00001 TABLE 1 S Evaluation of WVTR (m/min) reliability (g/m.sup.2 .Math. day) Example 1 0.36 3 Example 2 0.22 3 Example 3 0.63 5 Comparative 0.58 1200 Example 1 Comparative 3.98 X 3 Example 2

(27) In Comparative Examples 1 and 2, due to excellent reliability at a high temperature, there was no bubbling and moisture permeability was low, but in Comparative Example 1, moisture permeability was considerably higher, and in Comparative Example 2, reliability at a high temperature was considerably lower.