A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23 C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)(C) of (N) and (C) is 500 or more at 30 C., and 9000 or less at 60 C., where (N) [m] is a thickness of the pressure sensitive adhesive layer and (C) [m] is a creep amount.

A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23 C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)(C) of (N) and (C) is 500 or more at 30 C., and 9000 or less at 60 C., where (N) [m] is a thickness of the pressure sensitive adhesive layer and (C) [m] is a creep amount.

Brittle acrylic films are made from impact-modified polyalkyl (meth)acrylate and are useful in forgery prevention labels containing the same. The films can be advantageously prepared by extrusion and, depending on the desired purpose, can be designed to be translucent or entirely non-transparent e.g. white. Ideally, the brittle acrylic films and the forgery prevention labels have no intended break points such as slits, perforation etc.

Illustrative examples of forming and using suitably adapted material in an additive manufacturing process includes operations of: exposing a first polymer sheet to a first plasma, such that an amine-functionalized sheet surface is formed; exposing a second polymer sheet to a second plasma, such that an epoxide-functionalized sheet surface is formed; and combining the amine-functionalized sheet and the epoxide-functionalized sheet, such that the amine-functionalized sheet surface contacts the epoxide-functionalized sheet surface. The workpiece is subsequently heated to form a structure, where heating of the workpiece causes covalent chemical bonds to form between the plasma-treated first polymer sheet and the plasma-treaded second polymer sheet.

A polymer foam adhesive tape including: a substrate film; a polymer foam layer provided on one surface of the substrate film; a first adhesive layer provided on the polymer foam layer; and a second adhesive layer provided on the other surface of the substrate film, in which the polymer foam layer has a density of 0.3 g/cm.sup.3 or less, and a thickness ratio of the substrate film to the polymer foam layer is 1:3 to 1:10.

The present invention relates to a double-sided adhesive tape used for applications including the attachment of front glass for mobile devices. A core layer of the double-sided adhesive tape is prepared by adding an acrylic elastomer free of carbon-carbon double bonds while being highly miscible with an acrylic resin to an acrylic monomer(s) and performing curing, and thus can improve the impact resistance of the final double-sided adhesive tape. Also, the core layer may take a form of foam due to the introduced filler such as glass bubbles or organic microspheres, and thus can further contribute to improving the impact resistance of the final double-sided adhesive tape.

An adhesive tape for semiconductor processing, which includes a base material, a buffer layer that is provided on at least one surface side of the base material, and an adhesive layer that is provided on the other surface side of the base material. This adhesive tape is configured such that: the buffer layer has a Young's modulus of 10-400 MPa at 23 C. and a rupture energy of 1-9 MJ/m.sup.3; and the Young's modulus of the base material at 23 C. is higher than the above-mentioned Young's modulus of the buffer layer.

Gradient permittivity films are described. In particular, gradient permittivity films that include a first continuous matrix of a first component having a first relative permittivity and a second component disposed within the continuous matrix having a second relative permittivity. The first permittivity is greater than the second permittivity for at least one wavelength between 20 GHz and 300 GHz. Such films may be useful in improving the signal to noise ratio for transmitting and receiving units behind a protective cover.

The present invention relates to a substrate for release sheet including a support, an adhesion layer (X1), and a resin layer (Y1) containing polyethylene having a density of 930 kg/m.sup.3 or more and 960 kg/m.sup.3 or less in this order, wherein convex portions are present on the surface of the resin layer (Y1), and a difference in height of the convex portions is 0.5 m or more.

A protective film for an electronic device is introduced. The protective film may comprises a deformable outer layer formed with a synthetic resin; a deformable modified material layer attached with a lower surface of the deformable outer layer, wherein the deformable modified layer is configured to be hardened responsive to receipt of an external stimuli; a deformable inner layer formed with a synthetic resin, attached with a lower surface of the deformable modified material layer; and an adhesive layer adhering to a lower surface of the deformable inner layer. Further, various embodiments can be implemented according to the present disclosure.