The present invention relates to a peel detection label that is a laminate including a backing, a pattern layer formed in a part of the surface of the backing, and a pressure sensitive adhesive laminate having at least a pressure sensitive adhesive layer (X) and a substrate layer (Y) laminated in this order thereon, and satisfying the following requirement (1), wherein an elastic modulus of the substrate layer (Y) is 10 MPa or more and 800 MPa or less:

Requirement (1): On attaching the peel detection label onto an adherend and then peeling it from the adherend, interfacial peeling occurs between the backing and the pattern layer, whereby the presence or absence of peeling of the peel detection label from the adherend becomes visually detectable.

The present invention relates to a water resistant, UV resistant, vapor permeable, air barrier underlayment assembly comprising a substrate of permeable polyester, a permeable copolymer acrylate coating bonded to a permeable polyester substrate and a pressure sensitive permeable copolymer adhesive secured to the permeable acrylate coating. The underlayment is resistant to water and direct ultra-violet (UV) light for a period up to at least one year prior to coverage by cladding.

The pressure sensitive adhesive tape for semiconductor processing of the present invention is a pressure sensitive adhesive tape for semiconductor processing, which, in a step of grinding a back face of a semiconductor wafer having a groove formed on a front face thereof or having a modified region formed therein to singulate the semiconductor wafer into semiconductor chips, is stuck on the front face of the semiconductor wafer and used, the pressure sensitive adhesive tape for semiconductor processing including a base, a buffer layer provided on one face of the base, and a pressure sensitive adhesive layer provided on the other face of the base, and having a ratio (D2/D1) of a thickness (D2) of the buffer layer to a thickness (D1) of the base of 0.7 or less and an indentation depth (X) of the front face on the buffer layer side of 2.5 m or less.

The purpose of the present invention is to provide a transfer sheet capable of providing hard coat properties and excellent weather resistance to a resin molded article such as organic glass. The transfer sheet has, in order, a base material film for mold release, a hard coat layer, a primer layer, and an adhesive layer. The weather resistance and adhesiveness of the hard coat layer and the primer layer are improved and hard coat properties and excellent weather resistance can be provided to a resin molded article being the transfer object, as a result of: the hard coat layer being formed from a cured product of a resin composition including a curable resin; and the primer layer being formed from a binder resin including a polyurethane having a mass-average molecular weight of 40,000-100,000 and including 1-30% by mass of an acrylic component.

An article is provided. The article includes an acrylate layer; a substrate overlaying the acrylate layer; and an adhesive layer between the acrylate layer and the substrate, wherein the adhesive layer includes germanium; wherein a release value between the acrylate layer and the adhesive layer is more than 200 g/inch.

A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23 C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)(C) of (N) and (C) is 500 or more at 30 C., and 9000 or less at 60 C., where (N) [m] is a thickness of the pressure sensitive adhesive layer and (C) [m] is a creep amount.

A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23 C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)(C) of (N) and (C) is 500 or more at 30 C., and 9000 or less at 60 C., where (N) [m] is a thickness of the pressure sensitive adhesive layer and (C) [m] is a creep amount.

The present invention relates to a display protective film including no base film, and the display protective film includes a transparent coating layer and a surface-protective coating layer. The protective film of the present invention is attached to whole surfaces of a flat portion and a curved portion. Accordingly, there is no peeling phenomenon on the curved portion. The protective film is also excellent in preventing the breakage of glass due to impact and preventing contamination. Moreover, scratches that may occur in outdoor activities are restored, and indentation marks made by a stylus pen when writing with the stylus pen are immediately restored, so that a clean screen is always maintained.

The present invention relates to a display protective film including no base film, and the display protective film includes a transparent coating layer and a surface-protective coating layer. The protective film of the present invention is attached to whole surfaces of a flat portion and a curved portion. Accordingly, there is no peeling phenomenon on the curved portion. The protective film is also excellent in preventing the breakage of glass due to impact and preventing contamination. Moreover, scratches that may occur in outdoor activities are restored, and indentation marks made by a stylus pen when writing with the stylus pen are immediately restored, so that a clean screen is always maintained.

A heating tape comprises an insulated heating element that includes a heating element layer comprising a polymer composite having conductive particles and at least one set of conductive electrodes at least partially embedded in the polymer composite and extending along at least a substantial portion of the length of the heating tape. A heating tape system for a pipe or other surface, further includes a power ramp controller having a solid state relay component to regulate an in-rush of current to the heating element. The heating tape system also includes a connector having multiple contact points.