Provided is a PSA sheet with which good air release properties can be obtained while whose quality can be further enhanced. This invention provides a PSA sheet comprising a substrate film and a PSA layer provided to at least one face of the substrate film. The PSA sheet further comprises a coating layer partially covering the PSA layer surface. The PSA sheet's adhesive is formed of the PSA layer and the coating layer. The coating layer has a linearly extending part running from one edge to another edge of the adhesive face. The linearly extending part has a first face forming the PSA sheet's adhesive face and a second face located on the PSA layer side relative to the first face. The second face of the linearly extending part forms an overall gently curved line in a cross section perpendicularly intersecting the length direction of the linearly extending part.

The present invention relates to a dicing film including: a substrate film; and a cohesive layer, wherein a storage modulus of the cohesive layer at 30° C. is 3*10.sup.5 to 4*10.sup.6 Pa, and the cohesive layer has a degree of cross-linking of 80% to 99%, a dicing die-bonding film including the dicing film, and a dicing method of a semiconductor wafer using the dicing die-bonding film.

Disclosed are powerful adhesive tapes, which rapidly coat rough and/or curved surfaces with different surface energies and thereby build up high adhesion. The adhesive joints formed in this way furthermore have good shear strength, even at elevated temperatures. Finally, enduring mechanical loading on the adhesive joints does not lead to the adhesive tape peeling from the surface. This is achieved with an adhesive tape comprising at least one foamed layer and at least one adhesive compound layer, wherein the adhesive compound layer contains at least one poly(meth)acrylate, and the poly(meth)acrylate is cross-linked with at least one covalent and at least one coordinative cross-linker.

The present invention relates to an anti-scattering film and a method for manufacturing the same, the anti-scattering film including: a transparent film; and a hard coating layer formed on top of the transparent film, in which the hard coating layer is formed of a composition which includes a UV-curable acrylate resin, first inorganic nanoparticles, second inorganic nanoparticles, a photoinitiator, and a mixed solvent comprising a ketone-based solvent and an alcohol-based solvent, and a plurality of protruding parts is formed on an upper surface of the hard coating layer.

A resin composition for a sealant has excellent heat-sealing strength with respect to a substrate, and a reduced elution amount thereof into normal heptane.

A resin composition for a sealant includes: a resin (A) which is an ethylene-(meth)acrylic acid ester copolymer in which a content of a (meth)acrylic acid ester unit is from 10% by mass to 25% by mass; and a tackifying resin (B), in which a content of the resin (A) is more than 45% by mass with respect to a total amount of resin components in the resin composition for a sealant, and a content of the tackifying resin (B) is from 0.1% by mass to 10% by mass with respect to the total amount of the resin components in the resin composition for a sealant.

A resin composition for a sealant has excellent heat-sealing strength with respect to a substrate, and a reduced elution amount thereof into normal heptane.

A resin composition for a sealant includes: a resin (A) which is an ethylene-(meth)acrylic acid ester copolymer in which a content of a (meth)acrylic acid ester unit is from 10% by mass to 25% by mass; and a tackifying resin (B), in which a content of the resin (A) is more than 45% by mass with respect to a total amount of resin components in the resin composition for a sealant, and a content of the tackifying resin (B) is from 0.1% by mass to 10% by mass with respect to the total amount of the resin components in the resin composition for a sealant.

The present invention relates to a method for producing a single-sided adhesive film (1) for securing a load, comprising providing a backing layer (2) and coating a first side of the backing layer (2) with an adhesive layer (3), wherein a plastic (4) is applied to a second side of the backing layer (2) in order to form a non-slip surface on the adhesive film (1). Moreover, the present invention relates to a single-sided adhesive film (1) produced by the above method.

An adhesive article comprising first and second tacky latent adhesive layers disposed on respective first and second opposed major surfaces of a substrate. Each of the first and second tacky latent adhesive layers independently comprises at least one polymerizable component, and a redox initiator system comprising a transition metal complex that participates in a redox cycle, an oxidizing agent, and a blocked reducing agent represented by the formula ((I). Each of R.sup.1 and R.sup.2 are independently H, an alkyl, an aryl, or RPhoto5 with the proviso that at least one of R1 and R.sup.2 is RPhoto. R.sup.Photo represents a photoremovable group. Each of R.sup.3 and R.sup.4 independently represents H, an alkyl group, or an aryl group comprising a monovalent ester, ether, urethane, or carbonate group. Methods of making and using the adhesive articles are also disclosed. ##STR00001##

A laminated film exhibits a certain adhesive property to various adherends having shapes or different irregularity shapes. The laminated film includes a resin layer A on one surface of a substrate and a resin layer B on the other surface. The resin layer A has a ten-point average surface roughness Rz(a) of 1.5 μm or more and 5.0 μm or less and a storage elastic modulus G′ at 25° C. and 1 Hz of 3.0×10.sup.5 Pa or more.

A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [μm] is a thickness of the pressure sensitive adhesive layer and (C) [μm] is a creep amount.