Patent classifications
C09J2475/006
Thin-Film Catechol Containing Materials
The disclosure relates to thin layers comprising a catechol containing polymer or oligomer, as well as methods of making and using the thin layers comprising the catechol containing polymer or oligomer. The layers demonstrate improved adhesion between two materials without substantial modification of the adhesive matrix.
Polymers For Bonding Coral
The disclosure relates to a thin layer comprising a catechol containing polymer or oligomer, as well as methods of making and using the thin layer comprising the catechol containing polymer or oligomer. The disclosure also relates to a thin layer comprising a catechol containing polymer or oligomer adjacent to and in contact with a bulk adhesive layer. The layers demonstrate improved adhesion between coral and coral-like materials.
Polymers For Bonding Coral
The disclosure relates to a thin layer comprising a catechol containing polymer or oligomer, as well as methods of making and using the thin layer comprising the catechol containing polymer or oligomer. The disclosure also relates to a thin layer comprising a catechol containing polymer or oligomer adjacent to and in contact with a bulk adhesive layer. The layers demonstrate improved adhesion between coral and coral-like materials.
SAFETY WINDOW FILM INCLUDING POLYURETHANE
Safety window films are described. In particular, safety window films including a substrate including polyurethane—the substrate having a first and second major surface, an optically clear pressure sensitive adhesive, and a polymeric liner are described. The first major surface of the substrate is the top surface of the safety film, and the polyurethane has a Shore hardness of less than 80 D. Such films may provide improved physical and optical performance over conventional safety window films, while being easier to install.
Skin-adhesive item
A skin-adhesive item is described that can include a substrate F coated continuously or discontinuously on at least one of the two faces thereof by a pressure-sensitive silicone adhesive Z that has been previously sterilized by means of gamma radiation and demonstrates good tack on the skin even after sterilization.
Laterally-coiled adhesively-retained low-force backer for sealant application
A laterally-coiled adhesively-retained low force backer for installation prior to application of a liquid sealant with sufficient surface adhesion to remain in place for such application and curing.
PROCESS FOR COATING VEGETABLE-TANNED LEATHERS
A process for coating vegetable-tanned leathers is provided. The process includes depositing a coating layer composed of an aqueous dispersion of polyurethane resin on a support having anti-adhesion properties, curing the coating layer on the support, depositing an adhesive layer composed of an aqueous dispersion of polyurethane resin onto the cured coating layer, applying a leather piece onto the adhesive layer, the leather piece being a vegetable-tanned leather piece, in a continuous oven curing the adhesive layer to attach the leather piece to the coating layer, and removing the coated leather piece from the support. Within the continuous oven the leather piece reaches a maximum temperature comprised between 65° C. and 75° C., with a dwell time in the oven comprised between 180 and 210 seconds.
DILUTE FORMIC ACID SOLUTIONS AND THEIR USE IN APPLYING FILMS TO SUBSTRATES
The present invention is directed to tack solutions comprising dilute formic acid, and their use in applying adhesive-coated films to substrates.
Adhesive tape for semiconductor processing, and semiconductor device manufacturing method
A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [μm] is a thickness of the pressure sensitive adhesive layer and (C) [μm] is a creep amount.
Adhesive tape for semiconductor processing, and semiconductor device manufacturing method
A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [μm] is a thickness of the pressure sensitive adhesive layer and (C) [μm] is a creep amount.