Illustrative examples of forming and using suitably adapted material in an additive manufacturing process includes operations of: exposing a first polymer sheet to a first plasma, such that an amine-functionalized sheet surface is formed; exposing a second polymer sheet to a second plasma, such that an epoxide-functionalized sheet surface is formed; and combining the amine-functionalized sheet and the epoxide-functionalized sheet, such that the amine-functionalized sheet surface contacts the epoxide-functionalized sheet surface. The workpiece is subsequently heated to form a structure, where heating of the workpiece causes covalent chemical bonds to form between the plasma-treated first polymer sheet and the plasma-treaded second polymer sheet.

The present invention relates to an adhesive printing form attachment layer comprising a support, and a permanently sticky layer suitable for receiving a printing form and fixing a printing form during a printing operation provided on the support, wherein the permanently sticky layer comprises a crosslinked structure obtained by crosslinking a crosslinkable composition comprising at least one polyurethane-based polymeric compound that has two or more crosslinkable groups, which are preferably ethylenically unsaturated groups, and two or more NHC(O)O linkages. A method of preparing the adhesive printing form attachment layer and of operating a printing machine using the adhesive printing form attachment layer are also disclosed.

The present disclosure relates to an adhesive printing form attachment layer comprising a support, and a permanently sticky layer suitable for receiving a printing form and fixing a printing form during a printing operation provided on the support, wherein the permanently sticky layer comprises a crosslinked silicone-based material. The present disclosure further relates to a method for preparing an adhesive printing form attachment layer, as well as a printing cylinder comprising it, the use of the an adhesive printing form attachment layer for fixing a flexographic printing plate during a printing operation on a printing cylinder, and a method of operating a printing machine wherein the adhesive printing form attachment layer is used.

A component manufacturing method includes a step of obtaining a holding tool. The holding tool includes: a frame body having an opening; and a holding film placed on the frame body. The step is a step of placing the holding film on the frame body while stretching the holding film in at least three different directions or in all directions to the frame body. The holding film includes a base layer and a holding layer. The holding tool forming device includes: a mechanism that pushes a plain film from a base layer side to bring about a stretched state; a mechanism that fixes the plain film to the frame body such that the stretched state is maintained; and a mechanism that isolates an unnecessary portion from the plain film to obtain the holding film.

Disclosed is a temporary protective film for semiconductor sealing molding comprising: a support film; and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent, and the content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.

The invention provides a thermal adhesive laminated oriented film containing a substrate layer comprising a resin composition containing 99.9 to 60% by mass of a polyamide resin or a polymethylpentene resin and 0.1 to 40% by mass of a modified polyolefin resin; and a thermal adhesive layer containing a thermal adhesive polyolefin resin and provided on each of both surfaces of the substrate layer so as to be in direct contact therewith by coextrusion. When a machine direction is defined as an X axis, a transverse direction is defined as a Y axis, and a thickness direction is defined as a Z axis, the film is stretched and oriented in at least one direction of the X axis or the Y axis, and has a thermal deformation rate at 150 C. of 4% or less in both directions of the X axis and the Y axis.

The subject matter of the invention is an adhesive tape, in particular a wrapping tape for sheathing cables (1) in automobiles, comprising a strip-type fabric backing (2, 3) that has at least one first layer (2) made of a woven fabric and a second layer (3) made of a nonwoven, the two layers being coupled together by a polymer layer (4) and/or by threads that penetrate both layers (2, 3), and comprising an adhesive layer (5) applied to at least one side of the backing (2, 3), characterised in that the nonwoven is produced from an aromatic polyamide.

The subject matter of the invention is an adhesive tape, in particular a wrapping tape for sheathing cables in automobiles. The tape has a fabric backing (1, 3, 2, 4) in the form of a monoweave and an adhesive coating (7) on at least one side of the backing (1, 3, 2, 4). According to the invention, the monoweave is at least three-ply, and abrasion-resistant, non-connected warp threads (1, 3) form an outer layer and an inner layer. An intermediate layer made of weft threads (2, 4) is provided, the bonding points (5) of said layer coinciding with those of the outer layer and not with the bonding points (6) of the inner layer.

Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio RE (=E(160)/E(40)) of the elastic modulus of the base layer at 160 C. to the elastic modulus of the base layer at 40 C. is RE0.01, and the elastic modulus E(40) is 10 MPa to less than 1000 MPa. The method includes bonding the adhesive layer to a back surface of a semiconductor wafer, separating the semiconductor wafer into segments to obtain semiconductor parts, and separating the semiconductor parts from the adhesive layer, and includes a step of evaluating.

Described herein is a backing comprising a sorbent material entrapped in a non-woven fiber matrix, wherein the backing comprises a first and a second major surface; and a first adhesive layer contacting the first major surface of the backing, wherein the first adhesive layer comprises a pressure sensitive adhesive.