A composition exhibits excellent heat resistance and mounting reliability when bonding a semiconductor power element to a metal lead frame, which is also free of lead and thereby places little burden on the environment. An electrically conductive composition contains at least a sulfide compound represented by RSR (wherein R is an organic group containing at least carbon; R is an organic group that is the same as or different from R; and R and R may be bonded to each other to form a so-called cyclic sulfide) and metal particles containing at least Cu, Sn or Ni as its essential component. Further, a conductive paste and a conductive bonding film each are produced using the electrically conductive composition. A dicing die bonding film is obtained by bonding the conductive bonding film with an adhesive tape.

A simplified method for removing foreign matters formed on a substrate in a semiconductor device manufacturing process; and a composition for forming a coating film for foreign matter removal use, which can be used in the method. A coating film is formed on a semiconductor substrate using a composition preferably containing a polyamic acid produced from (a) a tetracarboxylic dianhydride compound and (b) a diamine compound having at least one carboxyl group or a polyamic acid produced from (a) a tetracarboxylic dianhydride compound, (b) a diamine compound having at least one carboxyl group and (c) a diamine compound, and then foreign matters occurring on the coating film are removed together with the coating film by the treatment with a developing solution.

Disclosed is a manufacturing method for an ultrathin white covering film. The ultrathin white covering film includes a protecting film, a white ink layer, an adhesive layer and a release material, wherein the manufacturing method for the ultrathin white covering film includes the following steps: S101: preparing white ink and an adhesive; S102: coating the white ink on the protecting film and drying to form a white ink layer; S103: coating the adhesive on the white ink layer and drying to form a adhesive layer; S104: compounding the release material on the adhesive layer and coiling under certain compound temperature and compound pressure; and S105: curing to obtain the ultrathin white covering film. The present invention reduces a polyimide film layer, reduces a use part from three layers to two layers, can greatly reduce the thickness of a product, make an appearance of the product better, and greatly reduces the price.

The present disclosure provides a case, a preparation method thereof and an electronic product. The case includes a glass cover plate, a plastic frame body and a metal substrate frame, where the glass cover plate, the plastic frame body and the metal substrate frame are sequentially bonded without steps. The method includes: (1) coating an edge of a glass cover plate with a first activator, and then drying; and (2) bonding the glass cover plate obtained in step (1) with a metal substrate frame by injection molding.

A method of producing a joined body includes: providing a composition for transient liquid phase sintering to at least one of a portion of a first member to which a second member is to be joined and a portion of the second member to which the first member is to be joined, so as to form a composition layer; bringing the portion of the first member to which the second member is to be joined and the portion of the second member to which the first member is to be joined into contact with each other via the composition layer; and sintering the composition layer by heating, and the composition for transient liquid phase sintering includes metal particles capable of transient liquid phase sintering and a thermoplastic resin.

A composition includes metal particles capable of transient liquid phase sintering and a polyamide imide resin.

A purpose of the present disclosure is to provide a multilayer wiring substrate capable of reducing transmission loss of electrical signals when using a fluororesin substrate, by using an adhesive layer capable of suppressing misalignment between layers and having excellent peel strength. Provided is a multilayer wiring substrate 1 including: a fluororesin substrate 30 having a conductor pattern 20 formed on at least one surface thereof; and an adhesive layer 10 for bonding the fluororesin substrate 30, wherein the adhesive layer 10 contains a cured product of a thermosetting resin, and has a breaking elongation rate of 20% or more and 300% or less.

A conductive adhesive that does not contain toxic substances such as solder (lead) and shows excellent adhesiveness. Specifically, it is a conductive adhesive composition, which includes: (A) a thermosetting resin; (C) a filler that contains a metal element; and (D) at least one catalyst or curing agent, wherein the reaction initiation temperature for the (A) thermosetting resin and the (D) at least one catalyst or curing agent is 180 C. or higher. More preferably, the reaction initiation temperature is 200 C. or higher. More preferably, it is a conductive adhesive composition that further includes (B) a flux and (E) a polymer component.

Provided is an adhesive composition sheet containing an organic compound and inorganic particles, the adhesive composition sheet including a structure obtained by stacking a layer A that contains at least an organic compound and a layer B that contains an organic compound and inorganic particles, the layer A having a content rate of the organic compound larger than the content rate of the organic compound in the layer B, and the layer A and/or the layer B containing anisotropically shaped inorganic particles. The present invention provides an adhesive composition sheet excellent in thermal conductivity and insulating properties after cured.

A compound and method of use thereof consisting of an A-staged thermoplastic-polyimide (TPI) adhesive, a viscous uncured liquid of polyamic-acid polymer (PAA), the TPI precursor, synthesized and dissolved in a polar aprotic organic solvent, and including, as appropriate, combinations of particulate ceramic and/or metallic thermally conducting, electrically insulating, and thermally conducting, electrically conducting fillers for interface-bonding to create a robust joint between surfaces with conventional lamination processes that utilize relatively moderate temperatures and applied pressures.