A shaped abrasive particle is presented. The shaped abrasive particle has a first and second surface. The first and second surfaces are substantially parallel to each other and separated by a thickness. Each of the first and second surfaces have a surface profile, which includes a plurality of corners and a plurality of edges connecting the plurality of corners. The shaped abrasive particle also includes a recess included wholly within one of the plurality of edges, wherein the recess is a concave void extending into the surface profile. The shaped abrasive particle also includes a magnetically responsive coating. The magnetically responsive coating causes the shaped abrasive particle to be responsive to a magnetic field. The shaped abrasive particle, when exposed to the magnetic field, experiences a net torque that causes the shaped abrasive particle to orient with respect to the magnetic field such that each of the first and second surfaces are substantially perpendicular to a backing.

Blends of abrasive media are described that can be propelled via a pressurized air stream into a surface to remove contaminants or other undesired material from the surface. In addition to other advantageous properties, the disclosed abrasive media blends are capable of providing faster abrasion than conventional composite abrasives, but with significantly less dust than raw abrasives generate. The disclosed abrasive media blends include sponge abrasive media formed of a flexible, open-cell polymeric material bonded to one or more abrasive materials.

Provided herein are compositions comprising a first colloidal silica particle that is not surface-modified and a second colloidal silica particle that is surface modified to carry a negative charge. Also provided herein are methods for selectively removing HfO.sub.2 or SiO.sub.2 from a surface.

An abrasive solution for finishing a metal part is provided. The abrasive solution includes abrasive particles suspended in a solution. The abrasive particles are configured to abrade a surface of the metal part. The abrasive particles are substantially non-responsive to a magnetic field. The abrasive solution also includes magnetic particles suspended in the solution. The magnetic particles are configured to respond to a magnetic field by aggregating together such that a local flow pattern of the solution changes in response to the aggregated magnetic particles.

The polishing particles of the present disclosure has controlled particle size and particle size distribution of cerium oxide particles comprised in the polishing particles, and thereby can suppress the formation of a scratch which may occur in a polishing process while having a characteristic of a high polishing rate.

Provided are a chemical mechanical polishing composition and a chemical mechanical polishing method that can polish a semiconductor substrate containing an electric conductor metal, such as tungsten or cobalt, flat and at high speed, and reduce post-polishing surface defects. The chemical mechanical polishing composition contains (A) silica particles having the functional group represented by general formula (1), and (B) at least one selected from the group consisting of a carboxylic acid having an unsaturated bond and a salt thereof. (1): —COO-M+ (M+ represents a monovalent cation.)

Provided are a chemical-mechanical polishing composition and a chemical-mechanical polishing method capable of polishing a semiconductor substrate containing a conductive metal such as tungsten or cobalt flatly and at high speed as well as reducing surface defects after polishing. The composition for chemical-mechanical polishing contains (A) silica particles having a functional group represented by general formula (1) and (B) a silane compound. —COO-M+ . . . (1) (M+ represents a monovalent cation.)

An adhesive anti-slip pad for placement on the finger, thumb, or palm of a wearer. The adhesive anti-slip includes a first side having a first surface comprising a textured material and a second side having a second surface comprising an adhesive. The adhesive anti-slip pad is configured to be placed on a thumb, finger, or a palm of the wearer. The adhesive anti-slip pad further comprises a thickness so that if the adhesive anti-slip pad contacts the surface of another object after placement of the adhesive anti-slip pad on the thumb, finger, or palm, the wearer receives a tactile response.

A method for producing a body obtained by processing a solid carbon-containing material, the method includes: preparing the solid carbon-containing material composed of a material having at least a surface containing solid carbon; forming a gas phase fluid containing at least one of an active gas or an active plasma which are active against the solid carbon; and processing the solid carbon-containing material by injecting the gas phase fluid onto at least a part of the surface of the solid carbon-containing material.

A method for producing a body obtained by processing a solid carbon-containing material, the method includes: preparing the solid carbon-containing material composed of a material having at least a surface containing solid carbon; forming a gas phase fluid containing at least one of an active gas or an active plasma which are active against the solid carbon; and processing the solid carbon-containing material by injecting the gas phase fluid onto at least a part of the surface of the solid carbon-containing material.