The present application pertains to liquid-liquid phase transition compositions and processes. In one embodiment a liquid-liquid phase transition process comprises first forming a composition comprising a glycol polymer and water and then phase transitioning the composition at or above the composition's cloud point temperature to form at least two liquid phases. The enthalpy of liquid-liquid phase transition may be greater than 5 kJ per kg as measured by a calorimeter and each liquid phase may have unique and advantageous properties. In another embodiment the application pertains to compositions suitable for liquid-liquid phase transition compositions.

Systems and cosmetic kits including a formulation for removing eye makeup from a region of an eye; and a brush including a plurality of bristles shaped to apply the formulation to the region of the eye are described. In an example, the system includes a formulation for removing eye makeup from a region of an eye; and a brush including a plurality of bristles shaped to apply the formulation to the region of the eye.

Systems and cosmetic kits including a formulation for removing eye makeup from a region of an eye; and a brush including a plurality of bristles shaped to apply the formulation to the region of the eye are described. In an example, the system includes a formulation for removing eye makeup from a region of an eye; and a brush including a plurality of bristles shaped to apply the formulation to the region of the eye.

An atomizing liquid gel with reversible phase transition characteristics includes: a sugar-based gelling agent, 0.1-3.0 wt %; an atomizing agent, 97.0-99.9 wt %; a molecule of the sugar-based gelling agent is a sugar molecule introduced with an amide group and/or an aryl group, and the sugar molecule optionally further includes at least one hydrophobic structural part selected from —C.sub.xH.sub.y, —O—C.sub.xB.sub.y and

##STR00001##

and x>2 and y>2. The atomizing liquid gel has characteristics of thermal reversible phase transition and/or shear reversible phase transition, a temperature of gel-sol phase transition is 100° C.-248° C., and a critical shear stress of the gel-sol phase transition is 40-800 Pa. Under heating and/or oscillation, the atomizing liquid gel converts from the gel state to a sol state, when the heating and/or oscillation are stopped, the atomizing liquid gel is quickly recovered from the sol state to the gel state.

In an embodiment, an article of manufacture includes a first component, a second component, and a thermal interface material. The thermal interface material is disposed between the first component and the second component and includes a polymeric phase-change material. In another embodiment, an article of manufacture includes a first component, a second component, and a thermal interface material disposed between the first component and the second component, the thermal interface material including a polymeric phase-change material, the polymeric phase-change material including a block copolymer formed from a diene, the diene formed from a vinyl-terminated fatty acid monomer having a chemical formula C.sub.2H.sub.4—R—C(O)OH and an ethylene glycol monomer having a chemical formula C.sub.2nH.sub.4n+2O.sub.n+1.

In an embodiment, an article of manufacture includes a first component, a second component, and a thermal interface material. The thermal interface material is disposed between the first component and the second component and includes a polymeric phase-change material. In another embodiment, an article of manufacture includes a first component, a second component, and a thermal interface material disposed between the first component and the second component, the thermal interface material including a polymeric phase-change material, the polymeric phase-change material including a block copolymer formed from a diene, the diene formed from a vinyl-terminated fatty acid monomer having a chemical formula C.sub.2H.sub.4—R—C(O)OH and an ethylene glycol monomer having a chemical formula C.sub.2nH.sub.4n+2O.sub.n+1.

A thermal compensation layer includes a metal inverse opal (MIO) layer that includes a plurality of core-shell phase change (PC) particles encapsulated within a metal of the MIO layer. Each of the core-shell PC particles includes a core that includes a PCM having a PC temperature in a range of from 100° C. to 250° C., and a shell that includes a shell material having a melt temperature greater than the PC temperature of the PCM. A power electronics assembly includes a substrate having a thermal compensation layer formed proximate a surface of the substrate, the thermal compensation layer comprising an MIO layer that includes a plurality of core-shell PC particles encapsulated within a metal of the MIO layer. The power electronics assembly further includes an electronic device bonded to the thermal compensation layer at a first surface of the electronic device.

A thermal compensation layer includes a metal inverse opal (MIO) layer that includes a plurality of core-shell phase change (PC) particles encapsulated within a metal of the MIO layer. Each of the core-shell PC particles includes a core that includes a PCM having a PC temperature in a range of from 100° C. to 250° C., and a shell that includes a shell material having a melt temperature greater than the PC temperature of the PCM. A power electronics assembly includes a substrate having a thermal compensation layer formed proximate a surface of the substrate, the thermal compensation layer comprising an MIO layer that includes a plurality of core-shell PC particles encapsulated within a metal of the MIO layer. The power electronics assembly further includes an electronic device bonded to the thermal compensation layer at a first surface of the electronic device.

A thermal compensation layer includes a metal inverse opal (MIO) layer that includes a plurality of core-shell phase change (PC) particles encapsulated within a metal of the MIO layer. Each of the core-shell PC particles includes a core that includes a PCM having a PC temperature in a range of from 100° C. to 250° C., and a shell that includes a shell material having a melt temperature greater than the PC temperature of the PCM. A power electronics assembly includes a substrate having a thermal compensation layer formed proximate a surface of the substrate, the thermal compensation layer comprising an MIO layer that includes a plurality of core-shell PC particles encapsulated within a metal of the MIO layer. The power electronics assembly further includes an electronic device bonded to the thermal compensation layer at a first surface of the electronic device.

A thermal compensation layer includes a metal inverse opal (MIO) layer that includes a plurality of core-shell phase change (PC) particles encapsulated within a metal of the MIO layer. Each of the core-shell PC particles includes a core that includes a PCM having a PC temperature in a range of from 100° C. to 250° C., and a shell that includes a shell material having a melt temperature greater than the PC temperature of the PCM. A power electronics assembly includes a substrate having a thermal compensation layer formed proximate a surface of the substrate, the thermal compensation layer comprising an MIO layer that includes a plurality of core-shell PC particles encapsulated within a metal of the MIO layer. The power electronics assembly further includes an electronic device bonded to the thermal compensation layer at a first surface of the electronic device.