Methods of using a toner as a printable adhesive are provided. In embodiments, a method of adhering substrates is provided which comprises disposing a cold pressure fix toner comprising a phase change material on a first substrate via xerography to form an unfused layer of the cold pressure fix toner on the first substrate; placing a second substrate on the unfused layer of the cold pressure fix toner; and subjecting the cold pressure fix toner to a pressure to form a bonded article comprising the first substrate, an adhesive layer formed from the cold pressure fix toner, and the second substrate. Methods of applying an adhesive to a substrate and bonded articles are also provided.

Methods of using a toner as a printable adhesive are provided. In embodiments, a method of adhering substrates is provided which comprises disposing a cold pressure fix toner comprising a phase change material on a first substrate via xerography to form an unfused layer of the cold pressure fix toner on the first substrate; placing a second substrate on the unfused layer of the cold pressure fix toner; and subjecting the cold pressure fix toner to a pressure to form a bonded article comprising the first substrate, an adhesive layer formed from the cold pressure fix toner, and the second substrate. Methods of applying an adhesive to a substrate and bonded articles are also provided.

A thermal compensation layer includes a metal inverse opal (MIO) layer that includes a plurality of core-shell phase change (PC) particles encapsulated within a metal of the MIO layer. Each of the core-shell PC particles includes a core that includes a PCM having a PC temperature in a range of from 100 C. to 250 C., and a shell that includes a shell material having a melt temperature greater than the PC temperature of the PCM. A power electronics assembly includes a substrate having a thermal compensation layer formed proximate a surface of the substrate, the thermal compensation layer comprising an MIO layer that includes a plurality of core-shell PC particles encapsulated within a metal of the MIO layer. The power electronics assembly further includes an electronic device bonded to the thermal compensation layer at a first surface of the electronic device.

A thermal compensation layer includes a metal inverse opal (MIO) layer that includes a plurality of core-shell phase change (PC) particles encapsulated within a metal of the MIO layer. Each of the core-shell PC particles includes a core that includes a PCM having a PC temperature in a range of from 100 C. to 250 C., and a shell that includes a shell material having a melt temperature greater than the PC temperature of the PCM. A power electronics assembly includes a substrate having a thermal compensation layer formed proximate a surface of the substrate, the thermal compensation layer comprising an MIO layer that includes a plurality of core-shell PC particles encapsulated within a metal of the MIO layer. The power electronics assembly further includes an electronic device bonded to the thermal compensation layer at a first surface of the electronic device.

Described herein is the use of organic materials in methods of barocaloric cooling. The barocaloric effects may be exhibited where the organic material is near a non-isochoric phase transition, such as a non-isochoric first-order phase transition. The organic material has one or more carbon atoms and may be an organic compound or a salt thereof. In some cases that organic material is a soft matter material, such as a plastic crystal or a liquid crystal. The methods may be adapted for use of the organic material as a heating agent.

A method for preparing a composition with low corrosive effect and low freezing point including mixing an ammonium cation source with a carboxyl anion source in an appropriate molar or weight ratio for obtaining an organic ammonium carboxylate of formula [NR.sup.1R.sup.2R.sup.3R.sup.4].sup.+.sub.n [R.sup.5(COO).sub.n].sup.n in which R.sup.1, R.sup.2, and R.sup.3 are selected from the group comprising hydrogen, substituted and unsubstituted alkyls containing 1-6 carbon atoms, R.sup.4 is a substituted or unsubstituted alkyl containing 1-6 carbon atoms, R.sup.5 is hydrogen, a substituted or unsubstituted hydrocarbon containing 1-6 carbon atoms and n is an integral of 1-6, and thereafter adding possible solvent and at the same time keeping alkali or alkali-earth metal content of the composition in a range of 0.001-30 wt % and halide content in a range of 0.001-1 wt %.

A method for preparing a composition with low corrosive effect and low freezing point including mixing an ammonium cation source with a carboxyl anion source in an appropriate molar or weight ratio for obtaining an organic ammonium carboxylate of formula [NR.sup.1R.sup.2R.sup.3R.sup.4].sup.+.sub.n [R.sup.5(COO).sub.n].sup.n in which R.sup.1, R.sup.2, and R.sup.3 are selected from the group comprising hydrogen, substituted and unsubstituted alkyls containing 1-6 carbon atoms, R.sup.4 is a substituted or unsubstituted alkyl containing 1-6 carbon atoms, R.sup.5 is hydrogen, a substituted or unsubstituted hydrocarbon containing 1-6 carbon atoms and n is an integral of 1-6, and thereafter adding possible solvent and at the same time keeping alkali or alkali-earth metal content of the composition in a range of 0.001-30 wt % and halide content in a range of 0.001-1 wt %.

An organic silicon compound is disclosed which is represented by a formula: (R.sup.1.sub.3SiO).sub.3SiR.sup.2[SiR.sup.3.sub.2O].sub.y[SiR.sup.3.sub.2].sub.wR.sup.4R.sup.5, wherein each of R.sup.1 and R.sup.3 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, R.sup.2 is a divalent hydrocarbon group or an oxygen atom, R.sup.4 is a divalent hydrocarbon group, or a direct bond to a silicon (Si) atom, R.sup.5 is a monovalent group represented by (R.sup.6O).sub.qR.sup.7.sub.(3-q)Si or a monovalent hydrocarbon group having 1 to 20 carbon atoms, and each of R.sup.6 and R.sup.7 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, and q is an integer between 1 and 3, y is an integer between 0 and 200, and w is 0 or 1.

An organic silicon compound is disclosed which is represented by a formula: (R.sup.1.sub.3SiO).sub.3SiR.sup.2[SiR.sup.3.sub.2O].sub.y[SiR.sup.3.sub.2].sub.wR.sup.4R.sup.5, wherein each of R.sup.1 and R.sup.3 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, R.sup.2 is a divalent hydrocarbon group or an oxygen atom, R.sup.4 is a divalent hydrocarbon group, or a direct bond to a silicon (Si) atom, R.sup.5 is a monovalent group represented by (R.sup.6O).sub.qR.sup.7.sub.(3-q)Si or a monovalent hydrocarbon group having 1 to 20 carbon atoms, and each of R.sup.6 and R.sup.7 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, and q is an integer between 1 and 3, y is an integer between 0 and 200, and w is 0 or 1.

A method of producing a temperature regulating article is disclosed. The method includes combining a functional polymeric phase change material with a substrate. The functional polymeric PCM has the capability of absorbing or releasing heat to adjust heat transfer at or within a temperature stabilizing range and having at least one phase change temperature in the range between 10 C. and 100 C. and a phase change enthalpy of at least 5 Joules per gram, the functional polymeric PCM has a backbone chain, side chains, and a crystallizable section. The side chains form the crystallizable section. The functional PCM carries at least one reactive function on at least one of the side chains or the backbone chain. The reactive function is capable of forming at least a first covalent bond with the second material or with a connecting compound capable of reacting with reactive functions of the second material.