C11D1/008

Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrate
11851638 · 2023-12-26 · ·

Provided is a means capable of sufficiently removing organic residues on the surface of an object to be polished after polishing. A surface treatment composition includes a polymer having a building block represented by Formula (1) in [Chemical Formula 1], a chelating agent, and water and is used to treat the surface of an object to be polished after polishing, and the chelating agent has at least one of a phosphonic acid group and a carboxylic acid group. ##STR00001## In Formula (1), R.sup.1 is a hydrocarbon group having 1 to 5 carbon atoms; and R.sup.2 is a hydrogen atom or a hydrocarbon group having 1 to 3 carbon atoms.

Cleaning composition for semiconductor substrate

A composition for cleaning a semiconductor substrate contains: a novolak resin; an organic acid not being a polymeric compound; and a solvent. A solid content concentration of the composition is no greater than 20% by mass. The organic acid is preferably a carboxylic acid. The carboxylic acid is preferably a monocarboxylic acid, polycarboxylic acid or a combination thereof. The molecular weight of the organic acid is preferably from 50 to 500. The content of the organic acid with respect to 10 parts by mass of the novolak resin is preferably from 0.001 parts by mass to 10 parts by mass. The solvent includes preferably an ether solvent, an alcohol solvent, or a combination thereof. The proportion of the ether solvent, the alcohol solvent, or the combination thereof in the solvent is preferably no less than 50% by mass.

LOW-VOC CLEANING SUBSTRATES AND COMPOSITIONS

The present invention is directed to a cleaning composition for sanitizing or disinfecting hard surfaces containing a cationic biocide, surfactant and low levels of VOC solvents. The cleaning composition is adapted to clean a variety of hard surfaces without leaving behind a visible residue and creates low levels of streaking and filming on the treated surface. The cleaning composition contains less than 5% by weight of VOCs. The cleaning composition may be used alone as a liquid or spray formulation or in combination with a substrate, for example, a pre-loaded cleaning wipe.

(METH)ACRYLIC ACID COPOLYMER-CONTAINING COMPOSITION AND METHOD FOR PRODUCING (METH)ACRYLIC ACID COPOLYMER
20210009739 · 2021-01-14 ·

The present invention provides a (meth)acrylic acid copolymer-containing composition which can sufficiently exhibit both stability at low temperatures and a calcium phosphate scale inhibition ability. The present invention relates to a (meth)acrylic acid copolymer-containing composition containing a (meth)acrylic acid copolymer including: a structural unit (a) derived from at least one selected from the group consisting of (meth)acrylic acid and salts thereof; and a structural unit (b) derived from a sulfonic acid monomer (B), the copolymer containing the structural unit (b) in a proportion of 5 to 90 mol % based on 100 mol % of all structural units, and having a weight average molecular weight of 4,500 to 18,000, the composition containing a sulfur-containing inorganic component not incorporated into the copolymer at a concentration of 6,000 ppm or lower in terms of sulfur atoms.

LIQUID DISHWASHING DETERGENT COMPOSITION

The need for a liquid hand dishwashing composition which provides for uniform dosing, even when the bottle is shaken or when the user dispenses using multiple successive squeezes, is met by formulating the liquid hand dishwashing composition with an anionic surfactant, a co-surfactant, and microfibrous cellulose derived from wood.

Composition for removing resist
10844334 · 2020-11-24 · ·

Problem to be Solved To provide a composition that can efficiently remove a photoresist adhering to an edge portion and a back surface of a substrate, in a process of producing a mask which is used when the substrate is subjected to etching treatment to have an element, a circuit etc., formed thereon using the photoresist. Solution The composition for removing a resist of the present invention is a composition comprising a surfactant and a solvent, wherein the composition contains, as the surfactant, at least the following component (A). Component (A): a polyglycerol derivative represented by the following formula (a):
R.sup.aO(C.sub.3H.sub.5O.sub.2R.sup.a).sub.nR.sup.a(a)
wherein n represents the number of the repeating units, and is an integer of 2 to 60; and R.sup.a identically or differently represents a hydrogen atom, a C.sub.1-18 hydrocarbon group or a C.sub.2-24 acyl group, provided that at least two of the (n+2) number of R.sup.a are C.sub.1-18 hydrocarbon groups and/or C.sub.2-24 acyl groups.

Fast drying and fast draining rinse aid

The present invention is directed to rinse aid compositions and methods for making and using the rinse aid compositions. The compositions of the invention include a sheeting agent, a defoaming agent, and an association disruption agent. The rinse aid compositions of the present invention result in a faster draining/drying time on most substrates compared to conventional rinse aids. The rinse aid compositions of the present invention are especially suitable for use on plastic substrates.

Low-VOC cleaning substrates and compositions containing a quaternary ammonium compound

A cleaning composition for sanitizing and/or disinfecting hard surfaces, comprising: a cationic biocide, surfactant and low levels of VOC solvents. The cleaning composition is adapted to clean a variety of hard surfaces without leaving behind a visible residue and creates low levels of streaking and filming on the treated surface. The cleaning composition contains less than 5% by weight of VOCs. The cleaning composition may be used alone as a liquid or spray formulation or in combination with a substrate, for example, a pre-loaded cleaning wipe.

Low-VOC cleaning substrates and compositions comprising a mixed ethoxy/propoxy alcohol or fatty acid

A cleaning composition for sanitizing and/or disinfecting hard surfaces, comprising: a cationic biocide, surfactant and low levels of VOC solvents. The cleaning composition is adapted to clean a variety of hard surfaces without leaving behind a visible residue and creates low levels of streaking and filming on the treated surface. The cleaning composition contains less than 5% by weight of VOCs. The cleaning composition may be used alone as a liquid or spray formulation or in combination with a substrate, for example, a pre-loaded cleaning wipe.

CLEANING SOLUTION AND METHOD OF CLEANING WAFER
20200328075 · 2020-10-15 ·

A cleaning solution includes first solvent having Hansen solubility parameters 25>.sub.d>13, 25>.sub.p>3, and 30>.sub.h>4; acid having acid dissociation constant, pKa, of 11<pKa<4, or base having pKa of 40>pKa>9.5; and surfactant. Surfactant is one or more of ionic surfactant, polyethylene oxide and polypropylene oxide, non-ionic surfactant, and combinations. Ionic surfactant is selected from group consisting of

##STR00001##

R is substituted or unsubstituted aliphatic, alicyclic, or aromatic group, and non-ionic surfactant has A-X or A-X-A-X structure, A is unsubstituted or substituted with oxygen or halogen, branched or unbranched, cyclic or non-cyclic, saturated C2-C100 aliphatic or aromatic group, and X includes polar functional groups selected from OH, O, S P, P(O.sub.2), C(O)SH, C(O)OH, C(O)OR, O; N, C(O)NH, SO.sub.2OH, SO.sub.2SH, SOH, SO.sub.2, CO, CN, SO, CON, NH, SO.sub.3NH, SO.sub.2NH.