Patent classifications
C11D1/008
USE OF PROPOXYLATED SURFACTANT OR POLYMER IN FOAMING APPLICATIONS TO CONTROL VISCOELASTICITY IN HIGHLY ACTIVE LIQUID FORMULATIONS
Antimicrobial or non-antimicrobial compositions, sanitizing compositions and other compositions combining use of a propoxylated EO/PO block copolymer surfactant and/or propoxylated polymer in combination with at least one additional anionic and/or nonionic surfactant to provide concentrated compositions having a desired viscoelasticity at an active level of at least 18% are disclosed. Non-antimicrobial applications combining use of a propoxylated surfactant and/or propoxylated polymer in combination with at least one additional anionic and/or nonionic surfactant to provide compositions having a desired viscoelasticity are also disclosed. Methods of using concentrated and use compositions having desired foaming enhancement and stabilization are also disclosed.
INTERACTION BETWEEN QUATERNARY COMPOUNDS AND ANIONIC SURFACTANTS - FOAM ENHANCEMENT AND STABILIZATION AND PREFERRED FOAMING ANTIMICROBIAL COMPOSITIONS
The present disclosure describes antimicrobial, sanitizing and other applications employing a synergistic combination of a quaternary ammonium compound and an anionic surfactant. The present disclosure is also related to non-antimicrobial applications employing a synergistic combination of a quaternary ammonium compound and an anionic and/or nonionic surfactant. The present disclosure is related to various forms of concentrated or use compositions containing the quaternary ammonium compound and an anionic surfactant (and in certain embodiments nonionic surfactants). In particular, the present disclosure provides compositions having desired foaming enhancement and methods employing the same for applications such as pot and pan compositions, hand soaps, facility sanitizing, and other soil removal applications with foam stabilization.
PARTICULATE LAUNDRY COMPOSITION
A laundry composition including a plurality of granules, where each of said granules has a longest dimension of no less than 3 mm and no more than 12 mm, and an aspect ratio of no more than 5, and each of said granules has a mass from 1 mg to 1 g; wherein said granules comprise 25% to 99.9% of a water soluble carrier by weight of the granules. The laundry composition also includes from 0.1% to 10% of a plurality of fine particles, by weight of the laundry composition, said fine particles having an average particle size of 0.05 μm to 50 μm.
Cleaning compositions and methods of use thereof
The present disclosure relates to cleaning compositions that can be used to clean semiconductor substrates. These cleaning compositions can be used to remove defects arising from previous processing steps on these semiconductor substrates. These cleaning compositions can remove the defects/contaminants from the semiconductor substrates and thereby make the substrates appropriate for further processing. The cleaning compositions described herein primarily contain at least one organic acid and at least one anionic polymer.
Surface treatment composition, method for producing surface treatment composition, surface treatment method, and method for producing semiconductor substrate
To provide a means capable of sufficiently removing organic residues present on the surface of a polishing object after polishing containing silicon oxide or polysilicon. A surface treatment composition contains a polymer having a constituent unit represented by Formula (1) below and water and is used for treating the surface of a polishing object after polishing, ##STR00001## in which, in Formula (1) above, R.sup.1 is a hydrocarbon group having 1 to 5 carbon atoms and R.sup.2 is a hydrogen atom or a hydrocarbon group having 1 to 3 carbon atoms.
WATER-BASED SILICONE COMBINATION SURFACE MODIFICATION COMPOSITIONS AND METHODS OF USE THEREOF
Described herein are compositions and methods for use in automotive care. In particular, the present disclosure is directed to water-based compositions comprising silicone combinations that delivery cleaning, protective, preservative and shine qualities.
PARAFFIN DEPOSITION INHIBITOR COATINGS
A containment for crude oil that inhibits paraffin deposition thereon is described. One to twenty coatings of a composition including a polyacrylate are applied to a crude oil contact surface of a crude oil containment; the polyacrylate includes at least about 50 mole % acrylic acid residues or the conjugate base thereof. The coating compositions are suitably delivered from a water dispersion, solution, or emulsion and dried before applying a subsequent coating. Each of the one to twenty coatings are formed from the same or from different polyacrylate coating compositions. The coated containment surfaces inhibit deposition of at least 10 wt % and as much as 90 wt % of paraffin solids from a crude oil compared to the same crude oil contact in the absence of the one to twenty coatings. The coatings inhibit paraffin deposition at temperatures between about 60° C. and −40° C.
AUTOMATIC DISHWASHING DETERGENT COMPOSITION
An automatic dishwashing detergent composition having a pH as measured in 1% weight aqueous solution at 25° C. of from about 5 to about 7.5, the composition including an esterified alkyl alkoxylated surfactant of general formula (I)
##STR00001## wherein R is a branched or unbranched alkyl radical having 8 to 16 carbon atoms; R.sup.3, R.sup.1 independently of one another, are hydrogen or a branched or unbranched alkyl radical having 1 to 5 carbon atoms; R.sup.2 is an unbranched alkyl radical having 5 to 17 carbon atoms; 1, n independently of one another, are a number from 1 to 5 and m is a number from 13 to 35.
Cleaning composition after chemical mechanical polishing of organic film and cleaning method using the same
A cleaning composition includes an organic solvent, an organic acid, a chelating agent, a surfactant containing at least one hydroxyl group (OH) at the end, and an ultra pure water, wherein a pH value of the cleaning composition is equal to or higher than 12.
CLEANER FOR ELECTRONIC DEVICE COMPONENTS
A cleaner useful in removing undesirable polymeric material deposits adhered within small bore holes of electronic components is provided, as well as apparatus and methods for carrying out cleaning of such components.