C11D1/88

Viscoelastic amphoteric surfactant based cleaning compositions

Alkaline or neutral viscoelastic cleaning compositions are disclosed which use non polymer thickening agents. According to the invention, cleaning compositions have been developed using viscoelastic surfactants in a neutral, acidic or alkaline cleaning formulations. These provide the dual benefit of thickening as well as an additional cleaning, thereby improving performance. Applicants have also identified several pseudo linking agents which when, used with viscoelastic surfactants provide viscoelasticity in alkaline cleaning compositions.

Viscoelastic amphoteric surfactant based cleaning compositions

Alkaline or neutral viscoelastic cleaning compositions are disclosed which use non polymer thickening agents. According to the invention, cleaning compositions have been developed using viscoelastic surfactants in a neutral, acidic or alkaline cleaning formulations. These provide the dual benefit of thickening as well as an additional cleaning, thereby improving performance. Applicants have also identified several pseudo linking agents which when, used with viscoelastic surfactants provide viscoelasticity in alkaline cleaning compositions.

Acidic amphoteric viscoelastic surfactant based cleaning compositions

Acidic viscoelastic cleaning compositions are disclosed which use non polymer thickening agents. According to the invention, cleaning compositions have been developed using viscoelastic surfactants in acidic cleaning formulations. These provide the dual benefit of thickening as well as an additional cleaning, thereby improving performance. Applicants have also identified several pseudo linking agents which when, used with viscoelastic surfactants provide enhanced viscoelasticity and cleaning.

Acidic amphoteric viscoelastic surfactant based cleaning compositions

Acidic viscoelastic cleaning compositions are disclosed which use non polymer thickening agents. According to the invention, cleaning compositions have been developed using viscoelastic surfactants in acidic cleaning formulations. These provide the dual benefit of thickening as well as an additional cleaning, thereby improving performance. Applicants have also identified several pseudo linking agents which when, used with viscoelastic surfactants provide enhanced viscoelasticity and cleaning.

SEMICONDUCTOR AQUEOUS COMPOSITION AND USE OF THE SAME
20210403829 · 2021-12-30 ·

[Problem] To provide a semiconductor aqueous composition capable of preventing a pattern collapse and suppressing a bridge defect. [Means for Solution] A semiconductor aqueous composition comprising a single or plurality of surfactant(s) having a monovalent anion part represented by formula (I): Chain 1-X.sup.1—X.sup.2-Chain 2 (I) wherein, X.sup.1 and X.sup.2 are each independently —C(=0)- or —S(=0).sub.2-, and Chain 1 and Chain 2 are each independently a linear or branched C.sub.1-20 alkyl, wherein one or more H in said C.sub.1-20 alkyl are replaced by F, and one or more methylenes in Chain 1 may be replaced by -0-, with the proviso that Chain 1 and Chain 2 may be bonded to form a ring structure) and a monovalent cation part other than hydrogen ion; and water.

SEMICONDUCTOR AQUEOUS COMPOSITION AND USE OF THE SAME
20210403829 · 2021-12-30 ·

[Problem] To provide a semiconductor aqueous composition capable of preventing a pattern collapse and suppressing a bridge defect. [Means for Solution] A semiconductor aqueous composition comprising a single or plurality of surfactant(s) having a monovalent anion part represented by formula (I): Chain 1-X.sup.1—X.sup.2-Chain 2 (I) wherein, X.sup.1 and X.sup.2 are each independently —C(=0)- or —S(=0).sub.2-, and Chain 1 and Chain 2 are each independently a linear or branched C.sub.1-20 alkyl, wherein one or more H in said C.sub.1-20 alkyl are replaced by F, and one or more methylenes in Chain 1 may be replaced by -0-, with the proviso that Chain 1 and Chain 2 may be bonded to form a ring structure) and a monovalent cation part other than hydrogen ion; and water.

Cleaning compositions and methods of use

A composition comprises from 0.1 to 30 wt-% of one or more amino acids, 0.1 to 30 wt-% of one or more surfactants, and optionally one or more hydrotropes. The amino acids may be selected from arginine (“ARG”), lysine (“LYS”), histidine (“HIS”), glycine (“GLY”), or combinations thereof. The composition can be formulated as a cleaning composition, such as a hard surface cleaner, a floor cleaner, or a degreaser. The composition can be used in a method for treating a surface, where the composition is applied to the surface and allowed to remain on the surface for a length of time, and the surface is then wiped.

Cleaning compositions and methods of use

A composition comprises from 0.1 to 30 wt-% of one or more amino acids, 0.1 to 30 wt-% of one or more surfactants, and optionally one or more hydrotropes. The amino acids may be selected from arginine (“ARG”), lysine (“LYS”), histidine (“HIS”), glycine (“GLY”), or combinations thereof. The composition can be formulated as a cleaning composition, such as a hard surface cleaner, a floor cleaner, or a degreaser. The composition can be used in a method for treating a surface, where the composition is applied to the surface and allowed to remain on the surface for a length of time, and the surface is then wiped.

FLUORINATED SURFACTANT COMPOSITION

Disclosed is a surfactant composition in which at least one of surface tension and interfacial tension is superior, the composition including a fluorinated surfactant and a phospholipid-based surfactant, and optionally further including a sulfosuccinate-based surfactant.

LIQUID HAND DISHWASHING DETERGENT COMPOSITION

A liquid hand dishwashing detergent composition containing a cationically modified inulin compound, methods of making the liquid hand dishwashing detergent compositions, and methods of using said liquid hand dishwashing detergent compositions, which provide improved rinsing, solution feel, and finished product viscosity control.