A processing method of a semiconductor substrate according the present invention includes: cleaning a surface of the semiconductor substrate with a water-based cleaning liquid; and drying the semiconductor substrate by replacing the water-based cleaning liquid attached to the surface of the semiconductor substrate with a supercritical fluid, characterized by using as the supercritical fluid a C.sub.2-C.sub.6 fluoroalcohol-containing solvent whose Fe, Ni, Cr, Al, Zn, Cu, Mg, Li, K, Na and Ca contents are each 500 mass ppb or less. In this processing method, it is possible to reduce the amount of fluorine atoms released in the supercritical fluid.

A processing method of a semiconductor substrate according the present invention includes: cleaning a surface of the semiconductor substrate with a water-based cleaning liquid; and drying the semiconductor substrate by replacing the water-based cleaning liquid attached to the surface of the semiconductor substrate with a supercritical fluid, characterized by using as the supercritical fluid a C.sub.2-C.sub.6 fluoroalcohol-containing solvent whose Fe, Ni, Cr, Al, Zn, Cu, Mg, Li, K, Na and Ca contents are each 500 mass ppb or less. In this processing method, it is possible to reduce the amount of fluorine atoms released in the supercritical fluid.

A composition for pretreating surfaces of equipment for use with an uncured cementitious material, such as uncured concrete, and/or for cleaning cured cementitious material from the surfaces of such equipment includes an aqueous solution with colloidal silica. Pretreatment of a surface with such an aqueous solution may reduce or eliminate adhesion of uncured cementitious material to the surface. Cured cementitious material may be removed from equipment surfaces by wetting the cured cementitious material with the aqueous solution to chemically soften the cured cementitious material, along with abrading the cured cementitious material to mechanically remove the same from the equipment surfaces. Systems for removing cured cementitious material from the surfaces of equipment configured to use with uncured cementitious material include an abrasive element and an aqueous solution with colloidal silica.

A composition for pretreating surfaces of equipment for use with an uncured cementitious material, such as uncured concrete, and/or for cleaning cured cementitious material from the surfaces of such equipment includes an aqueous solution with colloidal silica. Pretreatment of a surface with such an aqueous solution may reduce or eliminate adhesion of uncured cementitious material to the surface. Cured cementitious material may be removed from equipment surfaces by wetting the cured cementitious material with the aqueous solution to chemically soften the cured cementitious material, along with abrading the cured cementitious material to mechanically remove the same from the equipment surfaces. Systems for removing cured cementitious material from the surfaces of equipment configured to use with uncured cementitious material include an abrasive element and an aqueous solution with colloidal silica.

A hand-held apparatus employing a non-liquid cleaning composition for cleaning touch screen is described. In one embodiment, the apparatus comprises a hand-held cleaning instrument and a cap. The hand-held cleaning instrument comprises a handle and a replaceable cleaning pad. The cleaning pad comprises an engagement mechanism for removably coupling the cleaning pad to the handle. When not in use, the cleaning pad may be folded and received in the cap in a stowed configuration. When in use, the cap is removed and the cleaning pad is deployed in an extended position. The cleaning composition on the cleaning pad comprises a combination of carbon black and a hemihydrate of calcium sulfate.

A hand-held apparatus employing a non-liquid cleaning composition for cleaning touch screen is described. In one embodiment, the apparatus comprises a hand-held cleaning instrument and a cap. The hand-held cleaning instrument comprises a handle and a replaceable cleaning pad. The cleaning pad comprises an engagement mechanism for removably coupling the cleaning pad to the handle. When not in use, the cleaning pad may be folded and received in the cap in a stowed configuration. When in use, the cap is removed and the cleaning pad is deployed in an extended position. The cleaning composition on the cleaning pad comprises a combination of carbon black and a hemihydrate of calcium sulfate.

A bleach catalyst suitable for use in automatic dishwashing comprising a mixed metal oxide.

A bleach catalyst suitable for use in automatic dishwashing comprising a mixed metal oxide.

A method of cleaning residue containing ruthenium (Ru) residue on at least one surface of a component of a semiconductor processing chamber is provided. The residue is exposed to a Ru cleaning composition comprising at least one of hypochlorite and 03 based chemistries, wherein the Ru cleaning composition removes the Ru residue.

A cleaning mixture for removing biofilm from surfaces. The cleaning mixture comprises water and silver particles or particles surface modified with silver. The mixture further comprises manganese oxide particles or particles surface modified with manganese oxide.