The present invention provides a non-cyanide based Au—Sn alloy plating solution capable of performing a Au—Sn alloy plating treatment by a plating solution composition that is neutral and does not contain cyanide. In the present invention, a non-cyanide soluble gold salt, a Sn compound composed of tetravalent Sn, and a thiocarboxylic acid-based compound are contained. The non-cyanide based Au—Sn alloy plating solution of the present invention can further contain sugar alcohols, and, in addition, can further contain a dithioalkyl compound.

A method of making dispersion-strengthened alloy particles involves melting an alloy having a corrosion and/or oxidation resistance-imparting alloying element, a dispersoid-forming element, and a matrix metal wherein the dispersoid-forming element exhibits a greater tendency to react with a reactive species acquired from an atomizing gas than does the alloying element. The melted alloy is atomized with the atomizing gas including the reactive species to form atomized particles so that the reactive species is (a) dissolved in solid solution to a depth below the surface of atomized particles and/or (b) reacted with the dispersoid-forming element to form dispersoids in the atomized particles to a depth below the surface of said atomized particles. The atomized alloy particles are solidified as solidified alloy particles or as a solidified deposit of alloy particles. Bodies made from the dispersion strengthened alloy particles, deposit thereof, exhibit enhanced fatigue and creep resistance and reduced wear as well as enhanced corrosion and/or oxidation resistance at high temperatures by virtue of the presence of the corrosion and/or oxidation resistance imparting alloying element in solid solution in the particle alloy matrix.

A method for the manufacturing a representative homotop of a binary metallic nanoparticle (A.sub.xB.sub.1-x).sub.N with a given composition A.sub.xB.sub.1-x, number of atoms N and shape, and at a given temperature, including generating a plurality of homotops, calculating an energy of the generate homotops using formula:

[00001]$\begin{array}{cc}{E}_{\mathrm{TOP}}=E_0\left(x,N\right)+{\mathrm{.Math.}}_{\mathrm{BOND}}^{A.Math.\text{-}.Math.B}\left(x\right).Math.N_{\mathrm{BOND}}^{A.Math.\text{-}.Math.B}+\underset{i}{.Math.}.Math..Math.{\mathrm{.Math.}}_{\mathrm{CORNER},i}^A\left(x\right).Math.N_{\mathrm{CORNER},i}^A+\underset{j}{.Math.}.Math..Math.{\mathrm{.Math.}}_{\mathrm{EDGE},j}^A\left(x\right).Math.N_{\mathrm{EDGE},j}^A+{.Math.}_{\left\{\mathrm{LMN}\right\}}.Math.{\mathrm{.Math.}}_{\left\{\mathrm{LMN}\right\}}^A\left(x\right).Math.N_{\left\{\mathrm{LMN}\right\}}^A& \left(1\right)\end{array}$

where E.sub.0(x, N) is constant for a given particle, ε.sub.BOND.sup.A-B(x) is related to an energy gain caused by the mixing of both metals, N.sub.BOND.sup.A-B is a number of heteroatomic

A method for the manufacturing a representative homotop of a binary metallic nanoparticle (A.sub.xB.sub.1-x).sub.N with a given composition A.sub.xB.sub.1-x, number of atoms N and shape, and at a given temperature, including generating a plurality of homotops, calculating an energy of the generate homotops using formula:

[00001]$\begin{array}{cc}{E}_{\mathrm{TOP}}=E_0\left(x,N\right)+{\mathrm{.Math.}}_{\mathrm{BOND}}^{A.Math.\text{-}.Math.B}\left(x\right).Math.N_{\mathrm{BOND}}^{A.Math.\text{-}.Math.B}+\underset{i}{.Math.}.Math..Math.{\mathrm{.Math.}}_{\mathrm{CORNER},i}^A\left(x\right).Math.N_{\mathrm{CORNER},i}^A+\underset{j}{.Math.}.Math..Math.{\mathrm{.Math.}}_{\mathrm{EDGE},j}^A\left(x\right).Math.N_{\mathrm{EDGE},j}^A+{.Math.}_{\left\{\mathrm{LMN}\right\}}.Math.{\mathrm{.Math.}}_{\left\{\mathrm{LMN}\right\}}^A\left(x\right).Math.N_{\left\{\mathrm{LMN}\right\}}^A& \left(1\right)\end{array}$

where E.sub.0(x, N) is constant for a given particle, ε.sub.BOND.sup.A-B(x) is related to an energy gain caused by the mixing of both metals, N.sub.BOND.sup.A-B is a number of heteroatomic

Methods of making solder preforms are disclosed. A ribbon of raw material is received, and a first annular solder preform is formed by laser cutting the ribbon. The edges of the first annular solder preform can then be cleaned. The cutout section removed from the middle of the first annular solder preform can then be laser cut to form a second annular solder preform that is smaller than the first annular solder preform.

Methods of making solder preforms are disclosed. A ribbon of raw material is received, and a first annular solder preform is formed by laser cutting the ribbon. The edges of the first annular solder preform can then be cleaned. The cutout section removed from the middle of the first annular solder preform can then be laser cut to form a second annular solder preform that is smaller than the first annular solder preform.

The present disclosure provides Au-based alloys comprising Si capable of forming metallic glass matrix composites, and metallic glass matrix composites formed thereof. The Au-based metallic glass matrix composites according to the present disclosure comprise a primary-Au crystalline phase and a metallic glass phase and are free of any other phase. In certain embodiments, the metallic glass matrix composites according to the present disclosure satisfy the 18-Karat Gold Alloy Hallmark.

The present disclosure provides Au-based alloys comprising Si capable of forming metallic glass matrix composites, and metallic glass matrix composites formed thereof. The Au-based metallic glass matrix composites according to the present disclosure comprise a primary-Au crystalline phase and a metallic glass phase and are free of any other phase. In certain embodiments, the metallic glass matrix composites according to the present disclosure satisfy the 18-Karat Gold Alloy Hallmark.

The present invention is directed to an alloy usable for jewelry applications in which the color can be classified as white, the alloy contains both platinum and palladium and is at a metal cost or lower than that of traditional palladium-containing jewelry alloys, and is commercially age hardenable through heat treatment.

The present invention is directed to an alloy usable for jewelry applications in which the color can be classified as white, the alloy contains both platinum and palladium and is at a metal cost or lower than that of traditional palladium-containing jewelry alloys, and is commercially age hardenable through heat treatment.