The present invention addresses the problem of providing a novel, sold metal alloy. Provided is a metal alloy containing two or more types of metal, wherein an equilibrium diagram of the metal alloy shows the two or more types of metal in a finely mixed state at the nanolevel in a specific region where the two types of metal are unevenly distributed. This metal alloy has a substitutional solid solution of the two or more types of metal as the principal constituent thereof. This metal alloy is preferably one obtained by precipitation after mixing ions of two or more types of metal and a reducing agent in a thin-film fluid formed between processing surfaces, at least one of which rotates relative to the other, which are arranged so as to face one another and are capable of approaching and separating from one another.

The present invention addresses the problem of providing a novel, sold metal alloy. Provided is a metal alloy containing two or more types of metal, wherein an equilibrium diagram of the metal alloy shows the two or more types of metal in a finely mixed state at the nanolevel in a specific region where the two types of metal are unevenly distributed. This metal alloy has a substitutional solid solution of the two or more types of metal as the principal constituent thereof. This metal alloy is preferably one obtained by precipitation after mixing ions of two or more types of metal and a reducing agent in a thin-film fluid formed between processing surfaces, at least one of which rotates relative to the other, which are arranged so as to face one another and are capable of approaching and separating from one another.

A filler for vacuum brazing of TU1 oxygen-free copper is an Au—Cu—Ni filler including the following elemental compositions in a specified proportion: 69% to 90% of Au, 9% to 30% of Cu, and 1% to 5% of Ni. The filler has a melting temperature of 900° C. to 910° C. The filler for vacuum brazing of TU1 oxygen-free copper can be used for brazing X-ray tube anodes, thereby realizing effective vacuum brazing.

A filler for vacuum brazing of TU1 oxygen-free copper is an Au—Cu—Ni filler including the following elemental compositions in a specified proportion: 69% to 90% of Au, 9% to 30% of Cu, and 1% to 5% of Ni. The filler has a melting temperature of 900° C. to 910° C. The filler for vacuum brazing of TU1 oxygen-free copper can be used for brazing X-ray tube anodes, thereby realizing effective vacuum brazing.

Light, precious gold-titanium based alloy containing, by mass, at least 750% of gold, characterized in that said alloy has the following composition formula:

Ti.sub.aAu.sub.bM.sub.cT.sub.d

where a, b, c, d are atomic proportions such that:

a+b+c+d=1,

0.45≦a≦0.55; 0.41≦b≦0.495; 0.025≦c≦0.13; 0.001≦d≦0.025,

where M represents one or more elements taken from among a first group including Nb, V, Pd, Pt, Fe,
and where T represents a maximum of two elements taken from among a second group including Nb, V, Pd, Pt, Fe, Mo, Ta, W, Co, Ni, Ru, Rh, Ir, Cr, Mn, Cu, Zn, Ag, Al, B, Si, Ge, Sn, Sb, In, with the exception of said metals M comprised in said alloy.

Component for timepiece or for jewellery made from such a light, precious gold-titanium based alloy.

Light, precious gold-titanium based alloy containing, by mass, at least 750% of gold, characterized in that said alloy has the following composition formula:

Ti.sub.aAu.sub.bM.sub.cT.sub.d

where a, b, c, d are atomic proportions such that:

a+b+c+d=1,

0.45≦a≦0.55; 0.41≦b≦0.495; 0.025≦c≦0.13; 0.001≦d≦0.025,

where M represents one or more elements taken from among a first group including Nb, V, Pd, Pt, Fe,
and where T represents a maximum of two elements taken from among a second group including Nb, V, Pd, Pt, Fe, Mo, Ta, W, Co, Ni, Ru, Rh, Ir, Cr, Mn, Cu, Zn, Ag, Al, B, Si, Ge, Sn, Sb, In, with the exception of said metals M comprised in said alloy.

Component for timepiece or for jewellery made from such a light, precious gold-titanium based alloy.

The present invention relates to a medical Au—Pt—Pd alloy including Au, Pt, Pd, and inevitable impurities. The alloy has an alloy composition inside a polygon (A1-A2-A3-A4-A5-A6) surrounded by straight lines connected at point A1 (Au: 37.9 atom %, Pt: 0.1 atom %, and Pd: 62 atom %), point A2 (Au: 79.9 atom %, Pt: 0.1 atom %, and Pd: 20 atom %), point A3 (Au: 79.9 atom %, Pt: 20 atom %, and Pd: 0.1 atom %), point A4 (Au: 69.9 atom %, Pt: 30 atom %, and Pd: 0.1 atom %), point A5 (Au: 49 atom %, Pt: 30 atom %, and Pd: 21 atom %), and point A6 (Au: 39 atom %, Pt: 40 atom %, and Pd: 21 atom %) in a Au—Pt—Pd ternary state diagram. The metal structure of the alloy is optimized, and the metal structure is close to a single-phase structure, and has little precipitation of a Au-rich phase and a Pt-rich phase different in composition from a mother phase.

The present invention relates to a medical Au—Pt—Pd alloy including Au, Pt, Pd, and inevitable impurities. The alloy has an alloy composition inside a polygon (A1-A2-A3-A4-A5-A6) surrounded by straight lines connected at point A1 (Au: 37.9 atom %, Pt: 0.1 atom %, and Pd: 62 atom %), point A2 (Au: 79.9 atom %, Pt: 0.1 atom %, and Pd: 20 atom %), point A3 (Au: 79.9 atom %, Pt: 20 atom %, and Pd: 0.1 atom %), point A4 (Au: 69.9 atom %, Pt: 30 atom %, and Pd: 0.1 atom %), point A5 (Au: 49 atom %, Pt: 30 atom %, and Pd: 21 atom %), and point A6 (Au: 39 atom %, Pt: 40 atom %, and Pd: 21 atom %) in a Au—Pt—Pd ternary state diagram. The metal structure of the alloy is optimized, and the metal structure is close to a single-phase structure, and has little precipitation of a Au-rich phase and a Pt-rich phase different in composition from a mother phase.

Contacts that may be highly corrosion resistant, may be readily manufactured, and may conserve precious materials. One example may provide contacts having a layer of a precious-metal alloy to improve corrosion resistance. The precious-metal-alloy layer may be plated with a hard, durable, wear and corrosion resistant plating stack for further corrosion resistance and wear improvement. The resources consumed by a contact may be reduced by forming a bulk or substrate region of the contact using a more readily available material, such as copper or a material that is primarily copper based.

Disclosed are multi-junction light emitting diode (LED) formed by using eutectic bonding and method of manufacturing the multi-junction LED. The multi-junction LED is formed by stacking a separately formed light emitting structure on another light emitting structure by using eutectic bonding. Since separately grown light emitting structure is stacked on the light emitting structure using the eutectic metal alloy bonding, it is possible to prevent crystal defects occurring between the light emitting structures when sequentially grown. Further, since the eutectic metal alloy can be formed in various patterns, it is possible to control and optimize adhesive strength, transmittance of the light generated in the upper light emitting structure, and resistance.