Disclosed are multi-junction light emitting diode (LED) formed by using eutectic bonding and method of manufacturing the multi-junction LED. The multi-junction LED is formed by stacking a separately formed light emitting structure on another light emitting structure by using eutectic bonding. Since separately grown light emitting structure is stacked on the light emitting structure using the eutectic metal alloy bonding, it is possible to prevent crystal defects occurring between the light emitting structures when sequentially grown. Further, since the eutectic metal alloy can be formed in various patterns, it is possible to control and optimize adhesive strength, transmittance of the light generated in the upper light emitting structure, and resistance.

The present invention provides an alloy fine particle including palladium and ruthenium, the alloy fine particle including at least one first phase in which the palladium is more abundant than the ruthenium and at least one second phase in which the ruthenium is more abundant than the palladium, the at least one first phase and the at least one second phase being separated by a phase boundary, the palladium and the ruthenium being distributed in the phase boundary in such a manner that the molar ratio of the palladium and the ruthenium continually changes, a plurality of crystalline structures being present together in the phase boundary.

The present invention is related to a preferably oriented nanotwinned Au film, a method of preparing the same, and a bonding structure comprising the same. The nanotwinned Au film has a thickness direction. The nanotwinned Au film is stacked along a [220] crystallographic axis orientation in the thickness direction. At least 50% by volume of the nanotwinned Au film is composed of a plurality of nanotwinned Au grains which are adjacent to each other, arranged in a direction perpendicular to the thickness direction, and stacked along a [111] crystallographic axis orientation.

The present invention is related to a preferably oriented nanotwinned Au film, a method of preparing the same, and a bonding structure comprising the same. The nanotwinned Au film has a thickness direction. The nanotwinned Au film is stacked along a [220] crystallographic axis orientation in the thickness direction. At least 50% by volume of the nanotwinned Au film is composed of a plurality of nanotwinned Au grains which are adjacent to each other, arranged in a direction perpendicular to the thickness direction, and stacked along a [111] crystallographic axis orientation.

A method for manufacturing a part by alloying a precious metal with boron, wherein: a quantity of precious metal reduced to powder form is provided; a quantity of a nano-structured micrometric boron powder is provided; the precious metal powder is mixed with the nano-structured micrometric boron powder to obtain a mixture; the mixture is compacted by applying a uniaxial pressure; the mixture is subjected to a spark plasma sintering or flash sintering treatment, or to a hot isostatic pressing (HIP) treatment, to obtain an ingot of a precious metal/boron alloy, and the ingot is machined to obtain the part, or the ingot is reduced to powder form by a micronisation treatment and the powder is treated to obtain the part. Additionally, a gold/boron alloy.

A method for manufacturing a part by alloying a precious metal with boron, wherein: a quantity of precious metal reduced to powder form is provided; a quantity of a nano-structured micrometric boron powder is provided; the precious metal powder is mixed with the nano-structured micrometric boron powder to obtain a mixture; the mixture is compacted by applying a uniaxial pressure; the mixture is subjected to a spark plasma sintering or flash sintering treatment, or to a hot isostatic pressing (HIP) treatment, to obtain an ingot of a precious metal/boron alloy, and the ingot is machined to obtain the part, or the ingot is reduced to powder form by a micronisation treatment and the powder is treated to obtain the part. Additionally, a gold/boron alloy.

Described includes an alloy consisting of at least 33 wt. % to at most 75.5 wt. % gold, at least 1.5 wt. % to at most 45 wt. % silver, at least 8 wt. % to at most 45 wt. % copper, the remainder being zinc. The invention also relates to a semi-finished product made from such an alloy, a piece of jewelry having at least one such semi-finished product, and a method for producing such a semi-finished product.

Described includes an alloy consisting of at least 33 wt. % to at most 75.5 wt. % gold, at least 1.5 wt. % to at most 45 wt. % silver, at least 8 wt. % to at most 45 wt. % copper, the remainder being zinc. The invention also relates to a semi-finished product made from such an alloy, a piece of jewelry having at least one such semi-finished product, and a method for producing such a semi-finished product.

An electrical contact element for a plug-in connector has a metallic base body and a wear layer applied to the base body. The wear layer consists of pure ruthenium or of an alloy with the components 50-100% w/w ruthenium, 0-30% w/w nickel, 0-20% w/w chromium, 0-20% w/w cobalt, 0-20% w/w platinum and 0-1% w/w further alloy elements. A metallic intermediary layer is arranged between the base body and the wear layer, which has a thickness ranging from 1.5 μm to 4.0 μm.

An electrical contact element for a plug-in connector has a metallic base body and a wear layer applied to the base body. The wear layer consists of pure ruthenium or of an alloy with the components 50-100% w/w ruthenium, 0-30% w/w nickel, 0-20% w/w chromium, 0-20% w/w cobalt, 0-20% w/w platinum and 0-1% w/w further alloy elements. A metallic intermediary layer is arranged between the base body and the wear layer, which has a thickness ranging from 1.5 μm to 4.0 μm.