A DC high-voltage relay including at least one contact pair including a movable contact and a fixed contact, having a contact force and/or opening force of 100 gf or more, the DC high-voltage relay of 48 V or more. The movable contact and/or the fixed contact includes Ag oxide-based contact material. Metal components in the contact material includes at least one metal M essentially containing Sn, and a balance including Ag and inevitable impurity metals. The content of the metal M is 0.2% by mass or more and 8% by mass or less based on the total mass of all metal components in the contact material. The contact material has a material structure in which one or more oxides of the metal M are dispersed in a matrix including Ag or a Ag alloy. As metal M, In, Bi, Ni and Te can be added.

The invention is directed to a composition of metal particles and methods of manufacturing and using the composition in the treatment of microbial infections and cancer. The particles can be nanoparticles having coupled thereto at least one of a surfactant, an antibiotic, and a drug. The particles of the invention achieve enhanced stability, enhanced cytotoxicity, and enhanced antimicrobial activity through novel combinations of metals, surfactants, antibiotics, and drugs.

There is provided an electrically conductive paste which can prevent the increase of the volume resistivity of an electrically conductive film formed from the electrically conductive paste even if the electrically conductive film is heated to a soldering temperature of about 380° C. when the electrically conductive paste is a resin type electrically conductive paste using a silver powder and a silver-coated copper powder. In an electrically conductive paste containing a resin, a silver powder and a silver-coated copper powder having a copper powder, the surface of which is coated with a silver layer, the resin is an epoxy resin having a naphthalene skeleton, and there is added a dicarboxylic acid, preferably a dicarboxylic acid having a rational formula of HOOC—(CH.sub.2).sub.n—COOH (n=1-8), and more preferably a dicarboxylic acid having a rational formula of HOOC—(CH.sub.2).sub.n—COOH (n=4-7).

The present invention provides a silver paste containing at least a silver powder, a binder resin, and an organic solvent, in which a value C.sub.BND/S.sub.BET is 2.0 to 3.4 where S.sub.BET (m.sup.2/g) represents a specific surface area of the silver powder, and C.sub.BND (% by mass) represents a content percentage of the binder resin based on the silver powder, a copper content of the silver powder is 10 to 5000 ppm by mass, and the silver paste has a dry film density of 7.50 g/cm.sup.3 or more. The present invention can provide a silver paste containing a powder in a high concentration and excellent in printability, and accordingly provide a silver conductor film that has a high filling factor and a high film density, exhibits high electrical conductivity, and is excellent in migration resistance.

A metal sintering preparation containing (A) 50 to 90% by weight of at least one metal that is present in the form of particles having a coating that contains at least one organic compound, and (B) 6 to 50% by weight organic solvent. The mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 40,000 to 80,000 cm.sup.−1.

A metal sintering preparation containing (A) 50 to 90% by weight of at least one metal that is present in the form of particles having a coating that contains at least one organic compound, and (B) 6 to 50% by weight organic solvent. The mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 40,000 to 80,000 cm.sup.−1.

The present invention is directed to the electrolytic deposition of an alloy predominantly containing silver. Further constituents of the deposited alloy layer are palladium, tellurium and one or more of the metals Ce, Dy, Pb, Bi, Al, Ga, Ge, Fe, In, Co, Ni, Cu, Sn, Sb, Rh, Ru, Ir, Pt, Au. The present invention also relates to a method for the electrolytic deposition of a corresponding layer using a suitable electrolyte. The use of the electrolytically deposited alloy layer is also claimed.

The present invention is directed to the electrolytic deposition of an alloy predominantly containing silver. Further constituents of the deposited alloy layer are palladium, tellurium and one or more of the metals Ce, Dy, Pb, Bi, Al, Ga, Ge, Fe, In, Co, Ni, Cu, Sn, Sb, Rh, Ru, Ir, Pt, Au. The present invention also relates to a method for the electrolytic deposition of a corresponding layer using a suitable electrolyte. The use of the electrolytically deposited alloy layer is also claimed.

A low voltage circuit breaker is provided. The low voltage circuit breaker includes a contact system with a first contact and a second contact that are electrically connectable and disconnectable relative to one another. The first contact includes a body having a first layer and a second layer, wherein the first layer is arranged on the second layer and is configured to come in contact with the second contact for providing the electrical connection with the second contact. The first layer has a first material composition having an Ag content that is higher than an Ag content of a second material composition of the second layer. Further, the first material composition has a WC content that is lower than a WC content of the second material composition.

A low voltage circuit breaker is provided. The low voltage circuit breaker includes a contact system with a first contact and a second contact that are electrically connectable and disconnectable relative to one another. The first contact includes a body having a first layer and a second layer, wherein the first layer is arranged on the second layer and is configured to come in contact with the second contact for providing the electrical connection with the second contact. The first layer has a first material composition having an Ag content that is higher than an Ag content of a second material composition of the second layer. Further, the first material composition has a WC content that is lower than a WC content of the second material composition.