C22C9/01

Cylindrical sputtering target material

Provided is a cylindrical sputtering target material formed of copper or a copper alloy, in which an average value of the special grain boundary length ratios Lσ.sub.N/L.sub.N which are measured with respect to the outer peripheral surfaces of both end portions and the outer peripheral surface of the center portion in an axis O direction is set to be equal to or greater than 0.5, and each measured value is in a range of ±20% with respect to the average value of the special grain boundary length ratios Lσ.sub.N/L.sub.N, and the total amount of Si and C which are impurity elements is equal to or smaller than 10 mass ppm and the amount of O is equal to or smaller than 50 mass ppm.

Methods of making metal matrix composite and alloy articles

In one aspect, methods of making freestanding metal matrix composite articles and alloy articles are described. A method of making a freestanding composite article described herein comprises disposing over a surface of the temporary substrate a layered assembly comprising a layer of infiltration metal or alloy and a hard particle layer formed of a flexible sheet comprising organic binder and the hard particles. The layered assembly is heated to infiltrate the hard particle layer with metal or alloy providing a metal matrix composite, and the metal matrix composite is separated from the temporary substrate. Further, a method of making a freestanding alloy article described herein comprises disposing over the surface of a temporary substrate a flexible sheet comprising organic binder and powder alloy and heating the sheet to provide a sintered alloy article. The sintered alloy article is then separated from the temporary substrate.

Methods of making metal matrix composite and alloy articles

In one aspect, methods of making freestanding metal matrix composite articles and alloy articles are described. A method of making a freestanding composite article described herein comprises disposing over a surface of the temporary substrate a layered assembly comprising a layer of infiltration metal or alloy and a hard particle layer formed of a flexible sheet comprising organic binder and the hard particles. The layered assembly is heated to infiltrate the hard particle layer with metal or alloy providing a metal matrix composite, and the metal matrix composite is separated from the temporary substrate. Further, a method of making a freestanding alloy article described herein comprises disposing over the surface of a temporary substrate a flexible sheet comprising organic binder and powder alloy and heating the sheet to provide a sintered alloy article. The sintered alloy article is then separated from the temporary substrate.

Copper alloy sputtering target, process for producing the same and semiconductor element wiring
09765425 · 2017-09-19 · ·

A copper alloy sputtering target is provided and contains 0.01 to (less than) 0.5 wt % of at least one element selected from Al or Sn, and containing Mn or Si in a total amount of 0.25 wtppm or less. The above copper alloy sputtering target allows the formation of a wiring material for a semiconductor element, in particular, a seed layer being stable, uniform and free from the occurrence of coagulation during electrolytic copper plating and exhibits excellent sputtering film formation characteristics. A semiconductor element wiring formed with this target is also provided.

Copper alloy sputtering target, process for producing the same and semiconductor element wiring
09765425 · 2017-09-19 · ·

A copper alloy sputtering target is provided and contains 0.01 to (less than) 0.5 wt % of at least one element selected from Al or Sn, and containing Mn or Si in a total amount of 0.25 wtppm or less. The above copper alloy sputtering target allows the formation of a wiring material for a semiconductor element, in particular, a seed layer being stable, uniform and free from the occurrence of coagulation during electrolytic copper plating and exhibits excellent sputtering film formation characteristics. A semiconductor element wiring formed with this target is also provided.

METHOD TO ATTACH COPPER ALLOY VALVE INSERTS TO ALUMINUM CYLINDER HEAD
20210404353 · 2021-12-30 ·

A system to attach valve seat inserts to an aluminum cylinder head of an automobile vehicle includes a cylinder head of an automobile vehicle engine having a valve seat portion. A valve seat insert is positioned in the valve seat portion of the cylinder head. A fusion bond is created between the valve seat insert and the valve seat portion by laser welding thereby fusing the valve seat insert to the valve seat portion.

METHOD TO ATTACH COPPER ALLOY VALVE INSERTS TO ALUMINUM CYLINDER HEAD
20210404353 · 2021-12-30 ·

A system to attach valve seat inserts to an aluminum cylinder head of an automobile vehicle includes a cylinder head of an automobile vehicle engine having a valve seat portion. A valve seat insert is positioned in the valve seat portion of the cylinder head. A fusion bond is created between the valve seat insert and the valve seat portion by laser welding thereby fusing the valve seat insert to the valve seat portion.

Sintered bearing and manufacturing method for same

Provided is a sintered bearing (1), including 3 to 12% by mass of aluminum, 0.05 to 0.5% by mass of phosphorus, and the balance including copper as a main component, and inevitable impurities, the sintered bearing (1) having a structure in which an aluminum-copper alloy is sintered with a sintering aid added to raw material powder, a pore (db, do) in a surface layer portion of the sintered bearing (1) being formed smaller than an internal pore (di).

Sintered bearing and manufacturing method for same

Provided is a sintered bearing (1), including 3 to 12% by mass of aluminum, 0.05 to 0.5% by mass of phosphorus, and the balance including copper as a main component, and inevitable impurities, the sintered bearing (1) having a structure in which an aluminum-copper alloy is sintered with a sintering aid added to raw material powder, a pore (db, do) in a surface layer portion of the sintered bearing (1) being formed smaller than an internal pore (di).

Vertical clutch device for a timepiece

A vertical clutch device for a timepiece includes along a vertical axis a first wheel rotatably mounted about the vertical axis, a clutch disc, a spring, and a second wheel rotatably mounted about the vertical axis. The vertical clutch device is able to assume a clutched position where the second wheel is rotated by the first wheel under the action of the spring exerting a vertical force Fe to press the clutch disc against the first wheel and a disengaged position where the clutch disc is subjected against the action of the spring to a vertical force Fd separating it from the first wheel so that the second wheel is not rotated by the first wheel. The spring of the vertical clutch device is made of a shape memory alloy.