The present disclosure provides a thermal spray alloy system that is more resistant to corrosion than conventional alloy compositions. The disclosed alloy comprises copper as the main component and also potentially nickel, tin, boron, and/or carbon as other principle elements. The alloy composition may utilize a cored wire, and an outer sheath of the cored wire may comprise unalloyed copper. The alloy has superior corrosion resistance to a wide number of corrosive materials, such as hydrogen sulfide, carbon dioxide/carbonic acid, sodium chloride/potassium chloride (salts), bio-fouling, and micro-biologicals. The alloy demonstrates superior thermal conductivity compared to nickel based alloys and stainless steels. The alloy may form an anti-corrosive coating that may be applied to any number of substrates. The disclosed alloy may be applied to a substrate in thick layers, such as between 0.100 inches and 3.0 inches, and may be used to form shapes, such as centralizers.

The present disclosure provides a thermal spray alloy system that is more resistant to corrosion than conventional alloy compositions. The disclosed alloy comprises copper as the main component and also potentially nickel, tin, boron, and/or carbon as other principle elements. The alloy composition may utilize a cored wire, and an outer sheath of the cored wire may comprise unalloyed copper. The alloy has superior corrosion resistance to a wide number of corrosive materials, such as hydrogen sulfide, carbon dioxide/carbonic acid, sodium chloride/potassium chloride (salts), bio-fouling, and micro-biologicals. The alloy demonstrates superior thermal conductivity compared to nickel based alloys and stainless steels. The alloy may form an anti-corrosive coating that may be applied to any number of substrates. The disclosed alloy may be applied to a substrate in thick layers, such as between 0.100 inches and 3.0 inches, and may be used to form shapes, such as centralizers.

The present disclosure relates generally to wires and more particularly to textured powder wires containing nanoscale metallic silver powder. The invention presents an improvement of the process of making compressed cores of textured-powder high-temperature superconductor previously using the micaceous high-temperature superconductor Bi-2212. Embodiments of the claimed methods are useful with the micaceous high-temperature superconductors, notably Bi2Sr2CaCu208+x (Bi-2212) and Bi2Sr2Ca2Cu3O10+x (Bi-2223) and rare earth barium copper oxide (REBCO).

The present disclosure relates generally to wires and more particularly to textured powder wires containing nanoscale metallic silver powder. The invention presents an improvement of the process of making compressed cores of textured-powder high-temperature superconductor previously using the micaceous high-temperature superconductor Bi-2212. Embodiments of the claimed methods are useful with the micaceous high-temperature superconductors, notably Bi2Sr2CaCu208+x (Bi-2212) and Bi2Sr2Ca2Cu3O10+x (Bi-2223) and rare earth barium copper oxide (REBCO).

A copper alloy disclosed in the present description has a basic alloy composition represented by Cu.sub.100(x+y)Sn.sub.xAl.sub.y (where 8x12 and 8y9 are satisfied), in which a main phase is a CuSn phase with Al dissolved therein, and the CuSn phase undergoes martensitic transformation when heat-treated or worked. A method for producing a copper alloy disclosed in the present description is a casting step of melting and casting a raw material containing Cu, Sn, and Al and having a basic alloy composition represented by Cu.sub.100(x+y)Sn.sub.xAl.sub.y (where 8x12 and 8y9 are satisfied) so as to obtain a cast material, and a homogenization step of homogenizing the cast material in a temperature range of a CuSn phase so as to obtain a homogenized material, the method includes at least the casting step.

A copper alloy disclosed in the present description has a basic alloy composition represented by Cu.sub.100(x+y)Sn.sub.xAl.sub.y (where 8x12 and 8y9 are satisfied), in which a main phase is a CuSn phase with Al dissolved therein, and the CuSn phase undergoes martensitic transformation when heat-treated or worked. A method for producing a copper alloy disclosed in the present description is a casting step of melting and casting a raw material containing Cu, Sn, and Al and having a basic alloy composition represented by Cu.sub.100(x+y)Sn.sub.xAl.sub.y (where 8x12 and 8y9 are satisfied) so as to obtain a cast material, and a homogenization step of homogenizing the cast material in a temperature range of a CuSn phase so as to obtain a homogenized material, the method includes at least the casting step.

A covered electrical wire including a conductor and an insulating coating layer covering the outer periphery of the conductor, in which the conductor is a twisted wire obtained by twisting together a plurality of elemental wires constituted by copper or a copper alloy, and the covered electrical wire includes a metallically bonded portion where the elemental wires that are adjacent to each other are metallically bonded to each other.

A covered electrical wire including a conductor and an insulating coating layer covering the outer periphery of the conductor, in which the conductor is a twisted wire obtained by twisting together a plurality of elemental wires constituted by copper or a copper alloy, and the covered electrical wire includes a metallically bonded portion where the elemental wires that are adjacent to each other are metallically bonded to each other.

There is provided a Cu alloy target on a surface of a substrate made at least one of glass and resin produced by an adhering film alloy containing Cu and additive metals, the adhering film formed by sputtering. The additive metals include two or more of metals selected from the group consisting of Mg of 0.5 at % or more and 6 at % or less, Al of 1 at % or more and 15 at % or less, and Si of 0.5 at % or more and 10 at % or less. The adhering film has strong adhesive force that resists removal.

The present invention relates to a copper alloy for dental prosthesis and specifically, to a copper alloy for dental prosthesis having such color and luster that the copper alloy can be used as a substitute for a gold alloy and having excellent resistance to corrosion, wherein the copper alloy comprises, in wt %, 7-10% of Al, 1-2.5% of In, 1-2.5% of Sn, 2-4% of Fe, 2-3.5% of Ni, 2.5-4% of Mn, 2-5% of Zn, and the balance Cu.