The invention relates to a compacted and densified metal material having one or more phases formed of an agglomerate of grains, the cohesion of the material being provided by bridges formed between grains, said material having a relative density higher than or equal to 95% and preferably higher than or equal to 98%.

The invention relates to a compacted and densified metal material having one or more phases formed of an agglomerate of grains, the cohesion of the material being provided by bridges formed between grains, said material having a relative density higher than or equal to 95% and preferably higher than or equal to 98%.

The invention relates to a compacted and densified metal material having one or more phases formed of an agglomerate of grains, the cohesion of the material being provided by bridges formed between grains, said material having a relative density higher than or equal to 95% and preferably higher than or equal to 98%.

The invention relates to a method for producing metal components, consisting at least partially of a copper alloy, comprising the following alloy components in wt. %: 0 wt. %<Sn≤8 wt. %; 0 wt. %<Zn≤6 wt. %; 0.1 wt. %≤S≤0.7 wt. %; optionally no more than 0.2 wt. % phosphorus; optionally no more than 0.1 wt. % antimony; and optionally iron, zirconium and/or boron alone or in a combination of two or more of said elements of no more than 0.3 wt. %; and unavoidable impurities, and the rest being copper. The method comprises the following stages: (a) melting the copper alloy: (b) producing press blanks from the copper alloy; and (c) pressing the press blanks at a suitable pressing temperature to form the metal components. The invention also relates to a metal component which has been produced according to a method of this type.

A sliding member includes a back-metal layer including an Fe alloy and a sliding layer including a copper alloy including 0.5 to 12 mass % of Sn and the balance of Cu and inevitable impurities. A cross-sectional structure of the sliding layer includes first copper alloy grains in contact with a bonding surface and second copper alloy grains not in contact with the bonding surface. The first and second grains have an average grain size D1 and D2 respectively. D1 is 30 to 80 μm; and D1/D2=0.1 to 0.3. In the cross-sectional structure, the second grains includes third grains that includes internal grains therein that are not in contact with a grain boundary of the third grains. A total area S1 of the third grains and a total area of the second copper alloy grains S2 satisfy: S0/S2=0.25 to 0.80.

A sliding member includes a base material and an alloy layer that includes Cu as a main component and Bi and having a sliding surface formed on a side opposite to the base material. The alloy layer has a first region and a second region. The first region is set to a region taking up 30% of the thickness of the alloy layer which is from an interface in contact with the base material toward the sliding surface. The second region is set to a region taking up 10% of the thickness of the alloy layer which is from the sliding surface toward the base material. A larger number of Bi phases having larger cross-sectional areas are distributed in an arbitrary observation cross section as Bi phases included in the second region compared to Bi phases included in the first region.

The invention is a copper alloy with excellent comprehensive performance, including the following components in percentage by weight: 0.4 wt %-2.0 wt % of Ni, 0.2 wt %-2.5 wt % of Sn, 0.02 wt %-0.25 wt % of P, 0.001 wt %-0.5 wt % of Si, and the balance of Cu and unavoidable impurities. The copper alloy has a yield strength of 550 MPa or above, and an electrical conductivity of 38% IACS or above. A bending workability is as follows: the value of R/t in the GW direction is less than or equal to 1, and the value of R/t in the BW direction is less than or equal to 2; and after the copper alloy is kept at 150° C. for 1000 hours, a residual stress rate is greater than or equal to 75%, and the stress relaxation resistance is excellent.

The invention is a copper alloy with excellent comprehensive performance, including the following components in percentage by weight: 0.4 wt %-2.0 wt % of Ni, 0.2 wt %-2.5 wt % of Sn, 0.02 wt %-0.25 wt % of P, 0.001 wt %-0.5 wt % of Si, and the balance of Cu and unavoidable impurities. The copper alloy has a yield strength of 550 MPa or above, and an electrical conductivity of 38% IACS or above. A bending workability is as follows: the value of R/t in the GW direction is less than or equal to 1, and the value of R/t in the BW direction is less than or equal to 2; and after the copper alloy is kept at 150° C. for 1000 hours, a residual stress rate is greater than or equal to 75%, and the stress relaxation resistance is excellent.

The present disclosure relates to a copper alloy tube for a heat exchanger having excellent breaking strength and a method of manufacturing the same, and more particularly, to a Cu alloy tube having excellent breaking strength and thermal conductivity and suitable for use in a heat exchanger, and a method of manufacturing the same.

The present disclosure relates to a copper alloy tube for a heat exchanger having excellent breaking strength and a method of manufacturing the same, and more particularly, to a Cu alloy tube having excellent breaking strength and thermal conductivity and suitable for use in a heat exchanger, and a method of manufacturing the same.