A dilute copper metal composition includes 57-85% wt Cu, ≥3.0% wt Ni, ≤0.8% wt Fe, 7-25% wt Sn and 3-15% wt Pb. A process includes the steps of partially oxidizing a black copper composition to obtain a first copper refining slag and a first enriched copper metal, partially oxidizing the first enriched copper metal to obtain a second copper refining slag, whereby at least 37.0% wt of the amount of tin and lead processed is retrieved in the first and second copper refining slags together; and partially reducing the first copper refining slag to form a first lead-tin based metal composition and a first spent slag. The process further includes the steps of adding the second copper refining slag to the first lead-tin based metal composition, thereby forming a first liquid bath; and partially oxidizing the first liquid bath, thereby obtaining the dilute copper metal composition.

A dilute copper metal composition includes 57-85% wt Cu, ≥3.0% wt Ni, ≤0.8% wt Fe, 7-25% wt Sn and 3-15% wt Pb. A process includes the steps of partially oxidizing a black copper composition to obtain a first copper refining slag and a first enriched copper metal, partially oxidizing the first enriched copper metal to obtain a second copper refining slag, whereby at least 37.0% wt of the amount of tin and lead processed is retrieved in the first and second copper refining slags together; and partially reducing the first copper refining slag to form a first lead-tin based metal composition and a first spent slag. The process further includes the steps of adding the second copper refining slag to the first lead-tin based metal composition, thereby forming a first liquid bath; and partially oxidizing the first liquid bath, thereby obtaining the dilute copper metal composition.

In an aspect, a method of manufacturing a high purity copper-based alloy comprises providing in a melting furnace a feedstock and melting the feedstock. The method additionally includes bubbling an inert gas into the molten copper-based alloy to form the high purity copper-based alloy. Aspects are also directed to an apparatus and a method of fabricating an apparatus for manufacturing the high purity copper-based alloy.

The present invention relates to a method for producing metal-comprising geometrically complex pieces and/or parts. The method is specially indicated for highly performant components. It is disclosed a method for the production of complex geometry, and even large, highly performant metal-comprising components in a cost effective way. The method is also indicated for the construction of components with internal features and voids. The method is also beneficial for light construction. The method allows the reproduction of bio-mimetic structures and other advanced structures for topological performance optimization.

The present invention relates to a method for producing metal-comprising geometrically complex pieces and/or parts. The method is specially indicated for highly performant components. It is disclosed a method for the production of complex geometry, and even large, highly performant metal-comprising components in a cost effective way. The method is also indicated for the construction of components with internal features and voids. The method is also beneficial for light construction. The method allows the reproduction of bio-mimetic structures and other advanced structures for topological performance optimization.

[Object] To improve both abrasion resistance and seizure resistance. [Solution] A copper alloy sliding material is configured, which contains 0.5 to 12.0 mass % of Sn, 2.0 to 8.0 mass % of Bi, and 1.0 to 5.0 vol % of an inorganic compound, the balance being Cu and inevitable impurities, wherein the inorganic compound includes a first inorganic compound having an average particle size of 0.5 to 3.0 μm and a second inorganic compound having an average particle size of 4.0 to 20.0 μm, and wherein a value obtained by dividing a volume fraction of the first inorganic compound by a volume fraction of the second inorganic compound is 0.1 to 1.0.

[Object] To improve both abrasion resistance and seizure resistance. [Solution] A copper alloy sliding material is configured, which contains 0.5 to 12.0 mass % of Sn, 2.0 to 8.0 mass % of Bi, and 1.0 to 5.0 vol % of an inorganic compound, the balance being Cu and inevitable impurities, wherein the inorganic compound includes a first inorganic compound having an average particle size of 0.5 to 3.0 μm and a second inorganic compound having an average particle size of 4.0 to 20.0 μm, and wherein a value obtained by dividing a volume fraction of the first inorganic compound by a volume fraction of the second inorganic compound is 0.1 to 1.0.

A copper-tin brazing wire and a preparation method and use thereof are provided. A copper-tin brazing wire includes a plurality of copper wires each having a composite metal layer on a surface thereof; the copper-tin brazing wire includes, in parts by weight, 75-84 parts of Cu, 20-25 parts of Sn, and 0.4-0.5 parts of P; and the composite metal layer includes Cu, Sn, and P, in which a mass ratio of Cu, Sn, and P is (45-55):(46-56):(0.5-1.5).

A copper-tin brazing wire and a preparation method and use thereof are provided. A copper-tin brazing wire includes a plurality of copper wires each having a composite metal layer on a surface thereof; the copper-tin brazing wire includes, in parts by weight, 75-84 parts of Cu, 20-25 parts of Sn, and 0.4-0.5 parts of P; and the composite metal layer includes Cu, Sn, and P, in which a mass ratio of Cu, Sn, and P is (45-55):(46-56):(0.5-1.5).

Disclosed is a conductive ink composition and a manufacturing method thereof. The composition includes about 50 to about 99 wt % copper nanoparticles and about 1 to about 50 wt % tin. Copper nanoparticles are atomized and suspended in a tin bath, wherein the copper nanoparticles are evenly dispersed within the bath through sonification. The composition is cooled, extracted, and formed into a filament for use as a conductive ink. The ink has a resistivity of about 46.2×E−9 Ω*m to about 742.5×E−9 Ω*m. Once in filament form, the tin-copper mix will be viable for material extrusion, thus allowing for a lower cost, electrically conductive traces to be used in additive manufacturing.