A device including a near field transducer, the near field transducer including gold (Au), silver (Ag), copper (Cu), or aluminum (Al), and at least two other secondary atoms, the at least two other secondary atoms selected from: boron (B), bismuth (Bi), indium (In), sulfur (S), silicon (Si), tin (Sn), manganese (Mn), tellurium (Te), holmium (Ho), lutetium (Lu), praseodymium (Pr), scandium (Sc), uranium (U), barium (Ba), chlorine (Cl), cesium (Cs), dysprosium (Dy), europium (Eu), fluorine (F), germanium (Ge), hydrogen (H), iodine (I), rubidium (Rb), selenium (Se), terbium (Tb), nitrogen (N), oxygen (O), carbon (C), antimony (Sb), gadolinium (Gd), samarium (Sm), thallium (Tl), cadmium (Cd), neodymium (Nd), phosphorus (P), lead (Pb), hafnium (Hf), niobium (Nb), erbium (Er), zinc (Zn), magnesium (Mg), palladium (Pd), vanadium (V), zinc (Zn), chromium (Cr), iron (Fe), lithium (Li), nickel (Ni), platinum (Pt), sodium (Na), strontium (Sr), calcium (Ca), yttrium (Y), thorium (Th), beryllium (Be), thulium (Tm), erbium (Er), ytterbium (Yb), promethium (Pm), neodymium (Nd cobalt (Co), cerium (Ce), lanthanum (La), praseodymium (Pr), or combinations thereof.

A copper alloy disclosed in the present description has a basic alloy composition represented by Cu.sub.100(x+y)Sn.sub.xAl.sub.y (where 8x12 and 8y9 are satisfied), in which a main phase is a CuSn phase with Al dissolved therein, and the CuSn phase undergoes martensitic transformation when heat-treated or worked. A method for producing a copper alloy disclosed in the present description is a casting step of melting and casting a raw material containing Cu, Sn, and Al and having a basic alloy composition represented by Cu.sub.100(x+y)Sn.sub.xAl.sub.y (where 8x12 and 8y9 are satisfied) so as to obtain a cast material, and a homogenization step of homogenizing the cast material in a temperature range of a CuSn phase so as to obtain a homogenized material, the method includes at least the casting step.

A copper alloy disclosed in the present description has a basic alloy composition represented by Cu.sub.100(x+y)Sn.sub.xAl.sub.y (where 8x12 and 8y9 are satisfied), in which a main phase is a CuSn phase with Al dissolved therein, and the CuSn phase undergoes martensitic transformation when heat-treated or worked. A method for producing a copper alloy disclosed in the present description is a casting step of melting and casting a raw material containing Cu, Sn, and Al and having a basic alloy composition represented by Cu.sub.100(x+y)Sn.sub.xAl.sub.y (where 8x12 and 8y9 are satisfied) so as to obtain a cast material, and a homogenization step of homogenizing the cast material in a temperature range of a CuSn phase so as to obtain a homogenized material, the method includes at least the casting step.

The present disclosure relates to a copper based microcrystalline alloy and a preparation method thereof, and an electronic product. In percentage by weight and based on the total amount of the copper based microcrystalline alloy, the copper based microcrystalline alloy includes: 30-60 wt % of Cu; 25-40 wt % of Mn; 4-6 wt % of Al; 10-17 wt % of Ni; 0.01-10 wt % of Si; and 0.001-0.03% of Be.

The present disclosure relates to a copper based microcrystalline alloy and a preparation method thereof, and an electronic product. In percentage by weight and based on the total amount of the copper based microcrystalline alloy, the copper based microcrystalline alloy includes: 30-60 wt % of Cu; 25-40 wt % of Mn; 4-6 wt % of Al; 10-17 wt % of Ni; 0.01-10 wt % of Si; and 0.001-0.03% of Be.

The purpose of the present invention is to provide: a slide member in which the bonding strength between a Bi-containing copper alloy layer and a substrate is enhanced; and a method for manufacturing the slide member. The slide member according to the present invention has a substrate and a copper alloy layer. The copper alloy layer comprises a copper alloy containing 4.0-25.0 mass % of Bi and has a structure in which Bi phases are scattered in a copper alloy structure. The volume ratio of Bi phases in the region of the copper alloy layer extending 10 m from the bonding interface with the substrate is not more than 2.0%. The slide member is manufactured by casting a molten copper alloy onto the substrate and causing the copper alloy to unidirectionally solidify.

A soldering material (1) for active soldering, in particular for active soldering of a metallization (3) to a carrier layer (2) comprising ceramics, wherein the soldering material comprises copper and is substantially silver-free.

A soldering material (1) for active soldering, in particular for active soldering of a metallization (3) to a carrier layer (2) comprising ceramics, wherein the soldering material comprises copper and is substantially silver-free.

Provided are a slide material in which the joining strength between a Bi-containing copper alloy layer and a substrate is improved, and a method for manufacturing the slide material. The slide material according to the present invention has a substrate and a copper alloy layer. The copper alloy layer comprises a copper alloy containing 4.0-25.0 mass % of Bi and has a structure in which Bi phases are scattered in a copper alloy structure. The contact area ratio of Bi phases of the copper alloy layer at the joining interface with the substrate is not more than 2.0%. The slide material is manufactured by casting a molten copper alloy onto a substrate and causing the copper alloy to solidify unidirectionally.

Provided are a slide material in which the joining strength between a Bi-containing copper alloy layer and a substrate is improved, and a method for manufacturing the slide material. The slide material according to the present invention has a substrate and a copper alloy layer. The copper alloy layer comprises a copper alloy containing 4.0-25.0 mass % of Bi and has a structure in which Bi phases are scattered in a copper alloy structure. The contact area ratio of Bi phases of the copper alloy layer at the joining interface with the substrate is not more than 2.0%. The slide material is manufactured by casting a molten copper alloy onto a substrate and causing the copper alloy to solidify unidirectionally.