A device including a near field transducer, the near field transducer including gold (Au) and at least one other secondary atom, the at least one other secondary atom selected from: boron (B), bismuth (Bi), indium (In), sulfur (S), silicon (Si), tin (Sn), hafnium (Hf), niobium (Nb), manganese (Mn), antimony (Sb), tellurium (Te), carbon (C), nitrogen (N), and oxygen (O), and combinations thereof; erbium (Er), holmium (Ho), lutetium (Lu), praseodymium (Pr), scandium (Sc), uranium (U), zinc (Zn), and combinations thereof; and barium (Ba), chlorine (Cl), cesium (Cs), dysprosium (Dy), europium (Eu), fluorine (F), gadolinium (Gd), germanium (Ge), hydrogen (H), iodine (I), osmium (Os), phosphorus (P), rubidium (Rb), rhenium (Re), selenium (Se), samarium (Sm), terbium (Tb), thallium (Th), and combinations thereof.

The disclosure relates to a Cu-based microcrystal alloy and a preparation method thereof. Through being measured in percentage by mass, the Cu-based microcrystal alloy provided by the disclosure includes 20 to 30 percent of Mn, 0.01 to 10 percent of Al, 5 to 10 percent of Ni, 0.3 to 1.5 percent of Ti, 0 to 1.5 percent of Zr, 0.05 to 2 percent of Si and 45 to 74.64 percent of Cu.

The disclosure relates to a Cu-based microcrystal alloy and a preparation method thereof. Through being measured in percentage by mass, the Cu-based microcrystal alloy provided by the disclosure includes 20 to 30 percent of Mn, 0.01 to 10 percent of Al, 5 to 10 percent of Ni, 0.3 to 1.5 percent of Ti, 0 to 1.5 percent of Zr, 0.05 to 2 percent of Si and 45 to 74.64 percent of Cu.

A method of making a metallic alloy, more particularly, a high-entropy alloy with a composite structure that exhibits high strength and good ductility, and is used as a component material in electromagnetic, chemical, shipbuilding, machinery, and other applications, and in extreme environments, and the like.

A method of making a metallic alloy, more particularly, a high-entropy alloy with a composite structure that exhibits high strength and good ductility, and is used as a component material in electromagnetic, chemical, shipbuilding, machinery, and other applications, and in extreme environments, and the like.

The purpose of the present invention is to provide: a slide member in which the bonding strength between a Bi-containing copper alloy layer and a substrate is enhanced; and a method for manufacturing the slide member. The slide member according to the present invention has a substrate and a copper alloy layer. The copper alloy layer comprises a copper alloy containing 4.0-25.0 mass % of Bi and has a structure in which Bi phases are scattered in a copper alloy structure. The volume ratio of Bi phases in the region of the copper alloy layer extending 10 m from the bonding interface with the substrate is not more than 2.0%. The slide member is manufactured by casting a molten copper alloy onto the substrate and causing the copper alloy to unidirectionally solidify.

Composite suction liners and associated centrifugal pump architectures are described herein which, in some embodiments, provide enhanced operating lifetimes under abrasive slurry conditions. For example, a composite suction liner includes a suction liner substrate and a monolithic cladding metallurgically bonded to a face of the suction liner substrate, the monolithic cladding comprising metal matrix composite including a hard particle phase dispersed in matrix metal or alloy.

Composite suction liners and associated centrifugal pump architectures are described herein which, in some embodiments, provide enhanced operating lifetimes under abrasive slurry conditions. For example, a composite suction liner includes a suction liner substrate and a monolithic cladding metallurgically bonded to a face of the suction liner substrate, the monolithic cladding comprising metal matrix composite including a hard particle phase dispersed in matrix metal or alloy.

A metallic alloy, more particularly, a high-entropy alloy with a composite structure exhibits high strength and good ductility, and is used as a component material in electromagnetic, chemical, shipbuilding, machinery, and other applications, and in extreme environments, and the like.

A metallic alloy, more particularly, a high-entropy alloy with a composite structure exhibits high strength and good ductility, and is used as a component material in electromagnetic, chemical, shipbuilding, machinery, and other applications, and in extreme environments, and the like.