Provided is a Corson alloy having improved bending workability and also having high dimensional accuracy after press-working. A copper alloy strip which is a rolling material, the rolling material containing from 0 to 5.0% by mass of Ni or from 0 to 2.5% by mass of Co, the total amount of Ni+Co being from 0.2 to 5% by mass; from 0.2 to 1.5% by mass of Si, the balance being copper and unavoidable impurities, wherein the rolling material has a surface satisfying the relationship: 1.0≤I.sub.(200)/I.sub.0(200)≤5.0; wherein an area ratio of Cube orientation {100} <001> is from 2 to 10% in EBSD measurement of a rolling parallel cross section; and wherein a ratio: (an average crystal grain size of Cube orientation {100} <001> of the rolling parallel cross section)/(an average crystal grain size of the rolling parallel cross section) is from 0.75 to 1.5.

A method for manufacturing a thermoelectric conversion module of the present invention is a method for manufacturing a thermoelectric conversion module including a thermoelectric semiconductor part in which a plurality of p-type semiconductors and a plurality of n-type semiconductors are alternately arranged, and a high temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a high temperature heat source side and a low temperature side electrode bound to a binding surface of the p-type semiconductor and the n-type semiconductor on a low temperature heat source side, which electrically connect the p-type semiconductor and the n-type semiconductor adjacent to each other in series, and includes a binding step of binding at least one of the high temperature side electrode and the low temperature side electrode, and the p-type semiconductor and the n-type semiconductor together, by sintering a binding layer containing metal particles, which is provided between the electrode and the semiconductor.

A sintered bearing is made of a sintered compact containing nickel silver (Cu—Ni—Zn) as a base. In the sintered bearing, P is not added in the sintered compact. Alternatively, a content of P in the sintered compact is less than 0.05 mass % in terms of mass ratio to a total mass. Consequently, crystal grains constituting the sintered compact can be micronized. In particular, in the sintered bearing, an average crystal particle diameter of the crystal grains constituting the sintered compact is 20 μm or less. Consequently, the mechanical strength and the vibration resisting properties can be improved, and the rotation shaft can be prevented from being damaged.

A sintered bearing is made of a sintered compact containing nickel silver (Cu—Ni—Zn) as a base. In the sintered bearing, P is not added in the sintered compact. Alternatively, a content of P in the sintered compact is less than 0.05 mass % in terms of mass ratio to a total mass. Consequently, crystal grains constituting the sintered compact can be micronized. In particular, in the sintered bearing, an average crystal particle diameter of the crystal grains constituting the sintered compact is 20 μm or less. Consequently, the mechanical strength and the vibration resisting properties can be improved, and the rotation shaft can be prevented from being damaged.

Provided is a Cu-based alloy powder that is suitable for a process involving rapid melting and rapid solidification and that can provide a shaped object superior in characteristics. The powder is composed of a Cu-based alloy, which contains an element M being one or more elements selected from Cr, Fe, Ni, Zr, and Nb: 0.1% by mass or more and 10.0% by mass or less, Si: more than 0% by mass and 0.20% by mass or less, P: more than 0% by mass and 0.10% by mass or less, and S: more than 0% by mass and 0.10% by mass or less, the balance being Cu and inevitable impurities. This powder has a ratio (D50/TD) of the average particle diameter D50 (μm) thereof to the tap density TD (Mg/m.sup.3) is 0.2×10.sup.−5.Math.m.sup.4/Mg or more and 20×10.sup.−5.Math.m.sup.4/Mg or less, and has a sphericity of 0.80 or more and 0.95 or less.

Provided is a Cu-based alloy powder that is suitable for a process involving rapid melting and rapid solidification and that can provide a shaped object superior in characteristics. The powder is composed of a Cu-based alloy, which contains an element M being one or more elements selected from Cr, Fe, Ni, Zr, and Nb: 0.1% by mass or more and 10.0% by mass or less, Si: more than 0% by mass and 0.20% by mass or less, P: more than 0% by mass and 0.10% by mass or less, and S: more than 0% by mass and 0.10% by mass or less, the balance being Cu and inevitable impurities. This powder has a ratio (D50/TD) of the average particle diameter D50 (μm) thereof to the tap density TD (Mg/m.sup.3) is 0.2×10.sup.−5.Math.m.sup.4/Mg or more and 20×10.sup.−5.Math.m.sup.4/Mg or less, and has a sphericity of 0.80 or more and 0.95 or less.

A composite material includes: an iron-based alloy layer; an intermediate layer provided on the iron-based alloy layer; and a tungsten-containing layer provided on the intermediate layer, wherein the intermediate layer is composed of pure nickel or is an alloy that contains at least one selected from a group consisting of copper, cobalt, and iron at more than 0 mass % and less than or equal to 71 mass % in total, and that contains nickel at more than or equal to 29 mass % and less than 100 mass %.

A composite material includes: an iron-based alloy layer; an intermediate layer provided on the iron-based alloy layer; and a tungsten-containing layer provided on the intermediate layer, wherein the intermediate layer is composed of pure nickel or is an alloy that contains at least one selected from a group consisting of copper, cobalt, and iron at more than 0 mass % and less than or equal to 71 mass % in total, and that contains nickel at more than or equal to 29 mass % and less than 100 mass %.

An electrical connector consists of a connector housing (10) and at least one electrical contact element (1). The connector housing (10) and/or the electrical contact element (1) have a lead content of <0.1 weight percent. A method for manufacturing a contact element from a blank which has a lead content of <0.1 weight percent, uses the following method steps: Loading the blank into a manufacturing machine; producing a pin region or a socket region for electrically contacting another, opposite contact element; producing a fixing region for fixing the contact element in an insulating body; producing a crimp region for electrically connecting a conductor to the contact element or finishing the crimp region if the blank has already been previously prepared on a different machine; and removing the finished contact element from the manufacturing machine.

An electrical connector consists of a connector housing (10) and at least one electrical contact element (1). The connector housing (10) and/or the electrical contact element (1) have a lead content of <0.1 weight percent. A method for manufacturing a contact element from a blank which has a lead content of <0.1 weight percent, uses the following method steps: Loading the blank into a manufacturing machine; producing a pin region or a socket region for electrically contacting another, opposite contact element; producing a fixing region for fixing the contact element in an insulating body; producing a crimp region for electrically connecting a conductor to the contact element or finishing the crimp region if the blank has already been previously prepared on a different machine; and removing the finished contact element from the manufacturing machine.