A method of forming a composite component having a brass or bronze powder metal portion sinter fit into a supporting, ferrous portion.

A laminate includes a base substrate, and a coating layer formed on the base substrate. The coating layer includes a copper alloy portions derived from precipitation-hardening copper alloy particles and hard particle portions which are harder than the copper alloy portions, the hard particle portions are derived from hard particles, and the parts bond with each other via an interface. Each of the hard particle portions has a non-spherical shape. A sliding member includes the laminate in at least one sliding portion. A method for manufacturing a laminate includes a step of spraying a mixture in a non-molten state including precipitation-hardening copper alloy particles and hard particles having a non-spherical shape and being harder than the copper alloy particles onto a base substrate, to form a coating layer on the base substrate.

A laminate includes a base substrate, and a coating layer formed on the base substrate. The coating layer includes a copper alloy portions derived from precipitation-hardening copper alloy particles and hard particle portions which are harder than the copper alloy portions, the hard particle portions are derived from hard particles, and the parts bond with each other via an interface. Each of the hard particle portions has a non-spherical shape. A sliding member includes the laminate in at least one sliding portion. A method for manufacturing a laminate includes a step of spraying a mixture in a non-molten state including precipitation-hardening copper alloy particles and hard particles having a non-spherical shape and being harder than the copper alloy particles onto a base substrate, to form a coating layer on the base substrate.

A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.

A metal powder contains not less than 0.10 mass % and not more than 1.00 mass % of at least one of chromium and silicon, and a balance of copper. The total content of the chromium and the silicon is not more than 1.00 mass %. In accordance with an additive manufacturing method for this metal powder, an additively-manufactured article made from a copper alloy is provided. The additively-manufactured article has both an adequate mechanical strength and an adequate electrical conductivity.

There is provided a Cu alloy target including a Cap film alloy. In a case where the number of atoms of the Cap film alloy is 100 at %, when the Cap film alloy contains Cu of more than 50 at % and Al of 0.5 at % or more, the Cap film alloy contains an additive metal containing at least one metal material selected from the group consisting of Mg of 0.5 at % or more, Si of 0.5 at % or more, and Ni of 3 at % or more, or contains Ca of 0.5 at % or more as the additive metal. Adhesion between a Cap film and a Si oxide thin film formed on the Cap film by a CVD method is strong, and removal does not occur.

There is provided a Cu alloy target including a Cap film alloy. In a case where the number of atoms of the Cap film alloy is 100 at %, when the Cap film alloy contains Cu of more than 50 at % and Al of 0.5 at % or more, the Cap film alloy contains an additive metal containing at least one metal material selected from the group consisting of Mg of 0.5 at % or more, Si of 0.5 at % or more, and Ni of 3 at % or more, or contains Ca of 0.5 at % or more as the additive metal. Adhesion between a Cap film and a Si oxide thin film formed on the Cap film by a CVD method is strong, and removal does not occur.

A copper alloy sheet material that is excellent in surface smoothness of an etched surface has a composition containing, (mass %), from 1.0 to 4.5% of Ni, from 0.1 to 1.2% of Si, from 0 to 0.3% of Mg, from 0 to 0.2% of Cr, from 0 to 2.0% of Co, from 0 to 0.1% of P, from 0 to 0.05% of B, from 0 to 0.2% of Mn, from 0 to 0.5% of Sn, from 0 to 0.5% of Ti, from 0 to 0.2% of Zr, from 0 to 0.2% of Al, from 0 to 0.3% of Fe, from 0 to 1.0% of Zn, the balance Cu and unavoidable impurities. A number density of coarse secondary phase particles has a major diameter of 1.0 μm or more of 4.0×10.sup.3 per square millimeter or less. KAM value measured with a step size of 0.5 μm is more than 3.00.

A copper alloy sheet material that is excellent in surface smoothness of an etched surface has a composition containing, (mass %), from 1.0 to 4.5% of Ni, from 0.1 to 1.2% of Si, from 0 to 0.3% of Mg, from 0 to 0.2% of Cr, from 0 to 2.0% of Co, from 0 to 0.1% of P, from 0 to 0.05% of B, from 0 to 0.2% of Mn, from 0 to 0.5% of Sn, from 0 to 0.5% of Ti, from 0 to 0.2% of Zr, from 0 to 0.2% of Al, from 0 to 0.3% of Fe, from 0 to 1.0% of Zn, the balance Cu and unavoidable impurities. A number density of coarse secondary phase particles has a major diameter of 1.0 μm or more of 4.0×10.sup.3 per square millimeter or less. KAM value measured with a step size of 0.5 μm is more than 3.00.

A copper-nickel-tin alloy with excellent castability, hot workability and cold workability, high resistance to abrasive wear, adhesive wear and fretting wear and improved resistance to corrosion and stress relaxation stability, consisting of (in weight %): 2.0-10.0% Ni, 2.0-10.0% Sn, 0.01-1.0% Fe, 0.01-0.8% Mg, 0.01-2.5% Zn, 0.01-1.5% Si, 0.002-0.45% B, 0.004-0.3% P, selectively up to a maximum of 2.0% Co, selectively up to a maximum of 0.25% Pb, the residue being copper and unavoidable impurities. The ratio Si/B of the element-contents in wt. % of the elements silicon and boron is a minimum 0.4 and a maximum 8 such that the copper-nickel-tin alloy has Si-containing and B-containing phases, phases of the systems Ni—Si—B, Ni—B, Fe—B, Ni—P, Fe—P, Mg—P, Ni—Si, and Mg—Si, and other Fe-containing phases and Mg-containing phases.