The present disclosure provides a method for preparing a high-purity powder material, an application thereof, and a double-phase powder material. The high-purity powder material is prepared through an atomization comminuting process and de-phasing method. The preparation method comprises the following steps: firstly preparing intermediate alloy powders with first-phase particles wrapped by a second-phase matrix through an atomization comminuting process. Impurity elements are enriched into the second-phase matrix and the first-phase particles are purified during the solidification of the intermediate alloy powders; By removing the second-phase matrix in the intermediate alloy powders, a high-purity target powder material originated from the original first-phase particles can be obtained. The preparation method of the present disclosure has the characteristics of a simple process, easy operation, and low cost, and can be used to prepare nano-level, sub-micron-level, and micro-level multiple high-purity powder materials, which has a good application prospect in catalytic materials, powder metallurgy

A laminate includes a base substrate, and a coating layer formed on the base substrate. The coating layer includes a copper alloy portions derived from precipitation-hardening copper alloy particles and hard particle portions which are harder than the copper alloy portions, the hard particle portions are derived from hard particles, and the parts bond with each other via an interface. Each of the hard particle portions has a non-spherical shape. A sliding member includes the laminate in at least one sliding portion. A method for manufacturing a laminate includes a step of spraying a mixture in a non-molten state including precipitation-hardening copper alloy particles and hard particles having a non-spherical shape and being harder than the copper alloy particles onto a base substrate, to form a coating layer on the base substrate.

A laminate includes a base substrate, and a coating layer formed on the base substrate. The coating layer includes a copper alloy portions derived from precipitation-hardening copper alloy particles and hard particle portions which are harder than the copper alloy portions, the hard particle portions are derived from hard particles, and the parts bond with each other via an interface. Each of the hard particle portions has a non-spherical shape. A sliding member includes the laminate in at least one sliding portion. A method for manufacturing a laminate includes a step of spraying a mixture in a non-molten state including precipitation-hardening copper alloy particles and hard particles having a non-spherical shape and being harder than the copper alloy particles onto a base substrate, to form a coating layer on the base substrate.

The present invention provides a titanium copper foil having improved adhesion to solder and higher resistance to discoloration due to a high temperature and high humidity environment, an acid solution or an alkaline solution, and as well as having improved etching processability. The present invention provides a titanium copper foil comprising a base metal, the base metal having a composition containing Ti of from 1.5 to 5.0% by mass, the balance being copper and inevitable impurities, and having a thickness of from 0.018 to 0.1 mm, wherein the titanium copper foil has an Sn plated layer on a surface of the base metal, and has an adhesive strength of 0.5 N or more as measured by a solder adhesive strength test according to the definition in the specification.

The present invention provides a titanium copper foil having improved adhesion to solder and higher resistance to discoloration due to a high temperature and high humidity environment, an acid solution or an alkaline solution, and as well as having improved etching processability. The present invention provides a titanium copper foil comprising a base metal, the base metal having a composition containing Ti of from 1.5 to 5.0% by mass, the balance being copper and inevitable impurities, and having a thickness of from 0.018 to 0.1 mm, wherein the titanium copper foil has an Sn plated layer on a surface of the base metal, and has an adhesive strength of 0.5 N or more as measured by a solder adhesive strength test according to the definition in the specification.

It is a method for manufacturing an electrode material containing Cu, Cr, a heat-resistant element, and a low melting metal. A Cr powder and a heat-resistant element powder are mixed together in a ratio such that the Cr is greater than the heat-resistant element by weight. The mixed powder of the heat-resistant element and the Cr powder is baked. A MoCr solid solution obtained by the baking and containing a solid solution of the heat-resistant element and the Cr is pulverized and then classified. The classified MoCr solid solution powder, a Cu powder, and a low-melting metal powder are mixed together, followed by sintering at a temperature that is 1010 C. or higher and is lower than 1038 C., thereby obtaining the electrode material.

It is a method for manufacturing an electrode material containing Cu, Cr, a heat-resistant element, and a low melting metal. A Cr powder and a heat-resistant element powder are mixed together in a ratio such that the Cr is greater than the heat-resistant element by weight. The mixed powder of the heat-resistant element and the Cr powder is baked. A MoCr solid solution obtained by the baking and containing a solid solution of the heat-resistant element and the Cr is pulverized and then classified. The classified MoCr solid solution powder, a Cu powder, and a low-melting metal powder are mixed together, followed by sintering at a temperature that is 1010 C. or higher and is lower than 1038 C., thereby obtaining the electrode material.

A device including a near field transducer, the near field transducer including gold (Au) and at least one other secondary atom, the at least one other secondary atom selected from: boron (B), bismuth (Bi), indium (In), sulfur (S), silicon (Si), tin (Sn), hafnium (Hf), niobium (Nb), manganese (Mn), antimony (Sb), tellurium (Te), carbon (C), nitrogen (N), and oxygen (O), and combinations thereof; erbium (Er), holmium (Ho), lutetium (Lu), praseodymium (Pr), scandium (Sc), uranium (U), zinc (Zn), and combinations thereof; and barium (Ba), chlorine (Cl), cesium (Cs), dysprosium (Dy), europium (Eu), fluorine (F), gadolinium (Gd), germanium (Ge), hydrogen (H), iodine (I), osmium (Os), phosphorus (P), rubidium (Rb), rhenium (Re), selenium (Se), samarium (Sm), terbium (Tb), thallium (Th), and combinations thereof.

A laminate includes a base substrate, and a coating layer formed on the base substrate. The coating layer includes a copper alloy portions derived from precipitation-hardening copper alloy particles and hard particle portions which are harder than the copper alloy portions, the hard particle portions are derived from hard particles, and the parts bond with each other via an interface. Each of the hard particle portions has a non-spherical shape.

A sliding member includes the laminate in at least one sliding portion.

A method for manufacturing a laminate includes a step of spraying a mixture in a non-molten state including precipitation-hardening copper alloy particles and hard particles having a non-spherical shape and being harder than the copper alloy particles onto a base substrate, to form a coating layer on the base substrate.

A laminate includes a base substrate, and a coating layer formed on the base substrate. The coating layer includes a copper alloy portions derived from precipitation-hardening copper alloy particles and hard particle portions which are harder than the copper alloy portions, the hard particle portions are derived from hard particles, and the parts bond with each other via an interface. Each of the hard particle portions has a non-spherical shape.

A sliding member includes the laminate in at least one sliding portion.

A method for manufacturing a laminate includes a step of spraying a mixture in a non-molten state including precipitation-hardening copper alloy particles and hard particles having a non-spherical shape and being harder than the copper alloy particles onto a base substrate, to form a coating layer on the base substrate.