The invention relates to a method for producing precise components, preferably machining tools or cold forming tools, cold extrusion punches and dies, by laser melting or laser sintering or laser deposit welding or FDM or binder jetting of a powder material, which consists of a mixture of at least two powder elements, the powder mixture being formed by the primary component iron powder and additional powder alloying elements, which are present in elemental, pre-alloyed or partially pre-alloyed form, the powder elements each being added separately or in arbitrary combination in the following quantities according to the standard DIN EN 10027-2 no. 1.33XX or DIN EN 10027-2 no. 1.27XX, in particular according to the standard DIN EN 10027-2 no. 1.3343 with the short name HS6-5-2C or DIN EN 10027-2 no. 1.2709, a powder alloy being created from said powder elements over the course of the laser sintering process, wherein the following powder elements, present in elemental, alloyed or pre-alloyed form, are each additionally added to the alloy separately or in arbitrary combination: tungsten in the range of between 35, 10 and 0.7 mass%, preferably 10 mass%, titanium in the range of between 0.2, 3.2 to 10.7 mass%, preferably 3.2 mass%, carbon in the range of between 0.08, 1.23 up to 4.1 mass%, preferably 1.23 mass%, O in the range of between 0.00 up to 0.02 mass%, N in the range of between 0.00 up to 0.02 mass%, undefined residual substances at less than 0.1 mass%.

An implantable medical device includes an elongate member having a cross-sectional dimension that is less than 0.00085 inch, wherein the elongate member is made from a material comprising a platinum-tungsten alloy having a percentage of tungsten that is at least 10% by weight or alternatively the implantable medical device includes an elongate member made from a material comprising an alloy containing rhenium.

A method for fabricating a functionally graded tungsten-copper composite (W—Cu FGC) may include the following steps. A binder alloy powder may be prepared that may include mechanically alloyed metal powders of nickel (Ni), copper (Cu), and manganese (Mn); the binder alloy powder may be mixed with a pure tungsten (W) powder to obtain a modified W powder; a plurality of W—Cu composite powders may be prepared by mixing the modified W powder with pure copper powder with different ratios; the plurality of W—Cu composite powders may then be stacked inside a die; the stacked plurality of W—Cu composite powders may be pressed inside the die to obtain a W—Cu compact; and the W—Cu compact may be sintered to obtain a W—Cu FGC.

Provided are: a novel electrode which is suitable for use in an input device as typified by a capacitive touch panel sensor, and which has low electrical resistivity and low reflectance; and a method for producing this electrode. This electrode has a multilayer structure comprising a first layer that is formed of an Al film or an Al alloy film and a second layer that is partially nitrided and is formed of an Al alloy containing Al and at least one element selected from the group consisting of Mn, Cu, Ti and Ta.

A method for reducing surface roughness of an article includes contacting a surface of an article with a molten metal agent, the surface having an initial roughness; altering at least a portion of the surface in the molten metal agent; and removing the surface from contact with the agent; wherein, after the removing step, the surface has a processed roughness that is less than the initial roughness.

A method for reducing surface roughness of an article includes contacting a surface of an article with a molten metal agent, the surface having an initial roughness; altering at least a portion of the surface in the molten metal agent; and removing the surface from contact with the agent; wherein, after the removing step, the surface has a processed roughness that is less than the initial roughness.

The invention is directed at sputter targets including 50 atomic % or more molybdenum, a second metal element of titanium, and a third metal element of chromium or tantalum, and deposited films prepared by the sputter targets. In a preferred aspect of the invention, the sputter target includes a phase that is rich in molybdenum, a phase that is rich in titanium, and a phase that is rich in the third metal element.

The invention is directed at sputter targets including 50 atomic % or more molybdenum, a second metal element of titanium, and a third metal element of chromium or tantalum, and deposited films prepared by the sputter targets. In a preferred aspect of the invention, the sputter target includes a phase that is rich in molybdenum, a phase that is rich in titanium, and a phase that is rich in the third metal element.

According to one embodiment, a tungsten alloy includes a W component and a Hf component including HfC. A content of the Hf component in terms of HfC is 0.1 wt % or more and 3 wt % or less.

According to one embodiment, a tungsten alloy includes a W component and a Hf component including HfC. A content of the Hf component in terms of HfC is 0.1 wt % or more and 3 wt % or less.