The present invention relates to new brazing alloys containing copper, silver, zinc, manganese, and indium, and a method for their production and their use.

The present invention relates to new brazing alloys containing copper, silver, zinc, manganese, and indium, and a method for their production and their use.

A negative electrode active material for an electric device includes an alloy containing Si in a range from 23% to 64% exclusive, Sn in a range from 4% to 58% inclusive, Zn in a range from 0% to 65% exclusive, and inevitable impurities as a residue. The negative electrode active material can be obtained with a multi DC magnetron sputtering apparatus by use of, for example, silicon, tin and zinc as targets. An electric device such as a lithium ion secondary battery employing the negative electrode active material can improve cycle life of the battery and ensure a high capacity and high cycle durability.

A negative electrode active material for an electric device includes an alloy containing Si in a range from 23% to 64% exclusive, Sn in a range from 4% to 58% inclusive, Zn in a range from 0% to 65% exclusive, and inevitable impurities as a residue. The negative electrode active material can be obtained with a multi DC magnetron sputtering apparatus by use of, for example, silicon, tin and zinc as targets. An electric device such as a lithium ion secondary battery employing the negative electrode active material can improve cycle life of the battery and ensure a high capacity and high cycle durability.

The present invention relates to metal alloys including copper.

A system and method are presented for producing metallic core-shell particles. The system includes the housing having a hollow interior configured to receive and hold a molten metal input, a carrier fluid, and one or more reagents. The system also includes a shearing assembly positioned within the hollow interior of the housing. The shearing assembly is configured to, when the molten metal input, carrier fluid, and one or more reagents are held withing hollow interior and sealed within housing, shear the molten metal input into particles of an effective size so that a shell created on a surface of the particles via reaction with the one or more reagents prevents a core of the particles from solidifying when the particles are cooled to a temperature below a freezing temperature of the molten metal input.

Provided is an alloy comprising eight or more types of constituent elements, wherein the relative difference in terms of distance between nearest neighbors DNN between a constituent element having the largest distance between nearest neighbors DNN when constituting a bulk crystal from a single element and a constituent element having the smallest distance between nearest neighbors DNN when constituting a bulk crystal from a single element is 9% or less, the number of constituent elements having the same crystal structure when constituting a bulk crystal from a single element is not more than 3, and the difference in concentration between the constituent element having the highest concentration and the constituent element having the lowest concentration is 2 at. % or lower.

Provided is an alloy comprising eight or more types of constituent elements, wherein the relative difference in terms of distance between nearest neighbors DNN between a constituent element having the largest distance between nearest neighbors DNN when constituting a bulk crystal from a single element and a constituent element having the smallest distance between nearest neighbors DNN when constituting a bulk crystal from a single element is 9% or less, the number of constituent elements having the same crystal structure when constituting a bulk crystal from a single element is not more than 3, and the difference in concentration between the constituent element having the highest concentration and the constituent element having the lowest concentration is 2 at. % or lower.

Provided is a high-temperature lead-free solder alloy having excellent tensile strength and elongation in a high-temperature environment of 250° C. In order to make the structure of an Sn—Sb—Ag—Cu solder alloy finer and cause stress applied to the solder alloy to disperse, at least one material selected from the group consisting of, in mass %, 0.003 to 1.0% of Al, 0.01 to 0.2% of Fe, and 0.005 to 0.4% of Ti is added to a solder alloy containing 35 to 40% of Sb, 8 to 25% of Ag, and 5 to 10% of Cu, with the remainder made up by Sn.

Provided is a high-temperature lead-free solder alloy having excellent tensile strength and elongation in a high-temperature environment of 250° C. In order to make the structure of an Sn—Sb—Ag—Cu solder alloy finer and cause stress applied to the solder alloy to disperse, at least one material selected from the group consisting of, in mass %, 0.003 to 1.0% of Al, 0.01 to 0.2% of Fe, and 0.005 to 0.4% of Ti is added to a solder alloy containing 35 to 40% of Sb, 8 to 25% of Ag, and 5 to 10% of Cu, with the remainder made up by Sn.