A probe pin material including a Ag—Pd—Cu-based alloy essentially including Ag, Pd and Cu, B as a first additive element, and at least any element of Zn, Bi and Sn, as a second additive element. A concentration of the first additive element is 0.1 mass % or more and 1.5 mass % or less, and a concentration of the second additive element is 0.1 mass % or more and 1.0 mass % or less. A Ag concentration, a Pd concentration and a Cu concentration in the Ag—Pd—Cu-based alloy are required as follows: a Ag concentration (S.sub.Ag), a Pd concentration (S.sub.Pd) and a Cu concentration (S.sub.Cu) converted as given that a Ag—Pd—Cu ternary alloy is formed from only such three elements all fall within a predetermined range in a Ag—Pd—Cu ternary system phase diagram. The probe pin material is excellent in resistance value and hardness/wear resistance, and also is enhanced in bending resistance.

A probe pin material including a Ag—Pd—Cu-based alloy essentially including Ag, Pd and Cu, B as a first additive element, and at least any element of Zn, Bi and Sn, as a second additive element. A concentration of the first additive element is 0.1 mass % or more and 1.5 mass % or less, and a concentration of the second additive element is 0.1 mass % or more and 1.0 mass % or less. A Ag concentration, a Pd concentration and a Cu concentration in the Ag—Pd—Cu-based alloy are required as follows: a Ag concentration (S.sub.Ag), a Pd concentration (S.sub.Pd) and a Cu concentration (S.sub.Cu) converted as given that a Ag—Pd—Cu ternary alloy is formed from only such three elements all fall within a predetermined range in a Ag—Pd—Cu ternary system phase diagram. The probe pin material is excellent in resistance value and hardness/wear resistance, and also is enhanced in bending resistance.

There is provided a Cr-based two-phase alloy including two phases of a ferrite phase and an austenite phase that are mixed with each other. A chemical composition of the Cr-based two-phase alloy consists of a main component, an auxiliary component, impurities, a first optional auxiliary component, and a second optional auxiliary component. The main component consists of 33-61 mass % Cr, 18-40 mass % Ni and 10-33 mass % Fe, and a total content of the Ni and the Fe is 37-65 mass %. The auxiliary component consists of 0.1-2 mass % Mn, 0.1-1 mass % Si, 0.005-0.05 mass % Al, and 0.02-0.3 mass % Sn. The impurities include 0.04 mass % or less of P, 0.01 mass % or less of S, 0.03 mass % or less of C, 0.04 mass % or less of N, and 0.05 mass % or less of O.

There is provided a Cr-based two-phase alloy including two phases of a ferrite phase and an austenite phase that are mixed with each other. A chemical composition of the Cr-based two-phase alloy consists of a main component, an auxiliary component, impurities, a first optional auxiliary component, and a second optional auxiliary component. The main component consists of 33-61 mass % Cr, 18-40 mass % Ni and 10-33 mass % Fe, and a total content of the Ni and the Fe is 37-65 mass %. The auxiliary component consists of 0.1-2 mass % Mn, 0.1-1 mass % Si, 0.005-0.05 mass % Al, and 0.02-0.3 mass % Sn. The impurities include 0.04 mass % or less of P, 0.01 mass % or less of S, 0.03 mass % or less of C, 0.04 mass % or less of N, and 0.05 mass % or less of O.

The present invention relates to an alloy which has the following composition:
Cu.sub.47at %−(x+y+z)(Ti.sub.aZr.sub.b).sub.cNi.sub.7at %+xSn.sub.1at %+ySi.sub.z
where c=43-47 at %, a=0.65-0.85, b=0.15-0.35, where a+b=1.00; x=0-7 at %; y=0-3 at %, z=0-3 at %, where y+z≤4 at %.

The present invention relates to an alloy which has the following composition:
Cu.sub.47at %−(x+y+z)(Ti.sub.aZr.sub.b).sub.cNi.sub.7at %+xSn.sub.1at %+ySi.sub.z
where c=43-47 at %, a=0.65-0.85, b=0.15-0.35, where a+b=1.00; x=0-7 at %; y=0-3 at %, z=0-3 at %, where y+z≤4 at %.

An electrical assembly includes an electrical connector soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy being tin.

An electrical assembly includes an electrical connector soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy being tin.

A silver brazing material containing silver, copper, zinc, manganese, nickel, and tin as indispensable constituent elements. The silver brazing material includes 35 mass % or more and 45 mass % or less silver, 18 mass % or more and 28 mass % or less zinc, 2 mass % or more and 6 mass % or less manganese, 1.5 mass % or more and 6 mass % or less nickel, and 0.5 mass % or more and 5 mass % or less tin, with the balance being copper impurities. Within these compositional ranges, a predetermined relation is set between the manganese content and the nickel content, whereby the silver brazing material can be provided with excellent characteristics also in terms of processability or wettability. In the silver brazing material of the present invention, the silver content is reduced, and also melting point reduction and the narrowing of the temperature difference between solidus temperature and liquidus temperature are attempted.

A low-melting-point alloy composite material and a composite material structure are provided. The low-melting-point alloy composite material includes 48 to 54 wt. % In, 30 to 36 wt. % Bi, 14 to 21 wt. % Sn, and at least one selected from 0.1 to 0.3 wt. % carbon material and 0.05 to 0.1 wt. % boron nitride (BN). The composite material structure includes a metal layer, a low-melting-point alloy composite material layer, and an interface material layer, wherein the material of the low-melting-point alloy composite material layer is the above low-melting-point alloy composite material, and the interface material layer is formed between the metal layer and the low-melting-point alloy composite material layers.