Methods of forming larger sintered compacts of PCD and other sintered ultrahard materials are disclosed. Improved solvent metal compositions and layering of the un-sintered construct allow for sintering of thicker and larger high quality sintered compacts. Jewelry may also be made from sintered ultrahard materials including diamond, carbides, and boron nitrides. Increased biocompatibility is achieved through use of a sintering metal containing tin. Methods of sintering perform shapes are provided.

Methods of forming larger sintered compacts of PCD and other sintered ultrahard materials are disclosed. Improved solvent metal compositions and layering of the un-sintered construct allow for sintering of thicker and larger high quality sintered compacts. Jewelry may also be made from sintered ultrahard materials including diamond, carbides, and boron nitrides. Increased biocompatibility is achieved through use of a sintering metal containing tin. Methods of sintering perform shapes are provided.

A sintered sliding material with excellent corrosion resistance, heat resistance, and wear resistance is provided. The sintered sliding material has a composition made of: 36-86 mass % of Ni; 1-11 mass % of Sn; 0.05-1.0 mass % of P; 1-9 mass % of C; and the Cu balance including inevitable impurities. The sintered sliding material is made of a sintered material of a plurality of grains of alloy of Ni—Cu alloy or Cu—Ni alloy, the Ni—Cu alloy and the Cu—Ni alloy containing Sn, P, C, and Si; has a structure in which pores are dispersedly formed in grain boundaries of the plurality of the grains of alloy; and as inevitable impurities in a matrix constituted from the grains of alloy, a C content is 0.6 mass % or less and a Si content is 0.15 mass % or less.

A sintered sliding material with excellent corrosion resistance, heat resistance, and wear resistance is provided. The sintered sliding material has a composition made of: 36-86 mass % of Ni; 1-11 mass % of Sn; 0.05-1.0 mass % of P; 1-9 mass % of C; and the Cu balance including inevitable impurities. The sintered sliding material is made of a sintered material of a plurality of grains of alloy of Ni—Cu alloy or Cu—Ni alloy, the Ni—Cu alloy and the Cu—Ni alloy containing Sn, P, C, and Si; has a structure in which pores are dispersedly formed in grain boundaries of the plurality of the grains of alloy; and as inevitable impurities in a matrix constituted from the grains of alloy, a C content is 0.6 mass % or less and a Si content is 0.15 mass % or less.

A metallic alloy, more particularly, a high-entropy alloy with a composite structure exhibits high strength and good ductility, and is used as a component material in electromagnetic, chemical, shipbuilding, machinery, and other applications, and in extreme environments, and the like.

A solder alloy is providing, the solder alloy including zinc, aluminum, magnesium and gallium, wherein the aluminum constitutes by weight 8% to 20% of the alloy, the magnesium constitutes by weight 0.5% to 20% of the alloy and the gallium constitutes by weight 0.5% to 20% of the alloy, the rest of the alloy including zinc.

A solder alloy is providing, the solder alloy including zinc, aluminum, magnesium and gallium, wherein the aluminum constitutes by weight 8% to 20% of the alloy, the magnesium constitutes by weight 0.5% to 20% of the alloy and the gallium constitutes by weight 0.5% to 20% of the alloy, the rest of the alloy including zinc.

To provide a Ni ball having a low α dose and high sphericity even when it contains impurity elements other than Ni in certain amounts. The Ni ball contains an element U, a content thereof being 5 ppb or less, and an element Th, a content thereof being 5 ppb or less, wherein a purity of the Ni ball is 99.9% or more but 99.995% or less, an α dose thereof is 0.0200 cph/cm.sup.2 or less, a content of either Pb or Bi, or a total content of both Pb and Bi is 1 ppm or more, and a sphericity thereof is 0.90 or more, in order to prevent any software errors and reduce connection failure.

To provide a Ni ball having a low α dose and high sphericity even when it contains impurity elements other than Ni in certain amounts. The Ni ball contains an element U, a content thereof being 5 ppb or less, and an element Th, a content thereof being 5 ppb or less, wherein a purity of the Ni ball is 99.9% or more but 99.995% or less, an α dose thereof is 0.0200 cph/cm.sup.2 or less, a content of either Pb or Bi, or a total content of both Pb and Bi is 1 ppm or more, and a sphericity thereof is 0.90 or more, in order to prevent any software errors and reduce connection failure.

A lead free solder composition is disclosed and includes: 0.02% to 6% by weight stibium, 0.03% to 3% by weight copper, 0.03% to 8% by weight bismuth, 42% to 70% by weight indium, 0.3% to 8% by weight silver, 5% to 11% by weight magnesium, 0.8% to 1.6% by weight scandium, 0.7% to 2.0% by weight yttrium, and 10% to 45% by weight tin. The lead free solder composition of the invention has a solidus temperature no lower than 120° C., has good ductility and stability, and hence is suitable for soldering electrical connectors onto the metalized surface on the glass.