A lead free solder composition is disclosed and includes: 0.02% to 6% by weight stibium, 0.03% to 3% by weight copper, 0.03% to 8% by weight bismuth, 42% to 70% by weight indium, 0.3% to 8% by weight silver, 5% to 11% by weight magnesium, 0.8% to 1.6% by weight scandium, 0.7% to 2.0% by weight yttrium, and 10% to 45% by weight tin. The lead free solder composition of the invention has a solidus temperature no lower than 120° C., has good ductility and stability, and hence is suitable for soldering electrical connectors onto the metalized surface on the glass.

Provided is a super elastic alloy for biological use having a high biocompatibility, good processability and super elasticity, said super elastic alloy being a super elastic zirconium alloy for biological use comprising 27-54 mol % inclusive of titanium, 5-9 mol % inclusive of niobium which is a β phase-stabilizing element capable of stabilizing the β phase of zirconium, and 1-4 mol % inclusive in total of tin and/or aluminum which are ω phase-suppressing elements capable of suppressing the ω phase of zirconium, with the balance consisting of zirconium and inevitable impurities.

Provided is a super elastic alloy for biological use having a high biocompatibility, good processability and super elasticity, said super elastic alloy being a super elastic zirconium alloy for biological use comprising 27-54 mol % inclusive of titanium, 5-9 mol % inclusive of niobium which is a β phase-stabilizing element capable of stabilizing the β phase of zirconium, and 1-4 mol % inclusive in total of tin and/or aluminum which are ω phase-suppressing elements capable of suppressing the ω phase of zirconium, with the balance consisting of zirconium and inevitable impurities.

A low modulus corrosion-resistant alloy is disclosed, and comprises five principal elements, wherein the five principal elements are Zr, Nb, Ti, Mo, and Sn. Experimental data reveal that, samples of the low modulus corrosion-resistant alloy all include following characteristics: hardness of at least 250 HV, Young's modulus less than 100 GPa, yield strength greater than 600 MPa, and critical pitting potential greater than 1.3V. As a result, experimental data have proved that this low modulus corrosion-resistant alloy has a significant potential for application in the manufacture of biomedical articles including medical devices and surgical implants. In addition, this low modulus corrosion-resistant alloy is also suitable for application in the manufacture of various industrially-producible articles, including springs, coils, wires, clamps, fasteners, blades, valves, elastic sheets, spectacle frames, sports equipment, and other high-strength low-modulus corrosion-resistant structural materials.

A low modulus corrosion-resistant alloy is disclosed, and comprises five principal elements, wherein the five principal elements are Zr, Nb, Ti, Mo, and Sn. Experimental data reveal that, samples of the low modulus corrosion-resistant alloy all include following characteristics: hardness of at least 250 HV, Young's modulus less than 100 GPa, yield strength greater than 600 MPa, and critical pitting potential greater than 1.3V. As a result, experimental data have proved that this low modulus corrosion-resistant alloy has a significant potential for application in the manufacture of biomedical articles including medical devices and surgical implants. In addition, this low modulus corrosion-resistant alloy is also suitable for application in the manufacture of various industrially-producible articles, including springs, coils, wires, clamps, fasteners, blades, valves, elastic sheets, spectacle frames, sports equipment, and other high-strength low-modulus corrosion-resistant structural materials.

A high strength and low modulus alloy is disclosed, and comprises at least five principal elements and at least one additive element. The principal elements are Ti, Zr, Nb, Mo, and Sn, and the additive element(s) are V, W, Cr, and/or Hf. Particularly, a summation of numeric values of Ti and Zr in atomic percent is less than or equal to 85, and the additive elements have a total numeric value in atomic percent less than or equal to 4. Experimental data reveal that, samples of the high strength and low modulus alloy all have properties of yield strength greater than 600 MPa and Young's modulus less than 90 GPa. As a result, experimental data have proved that the high strength and low modulus alloy has a significant potential for applications in the manufacture of various industrial components and/or devices, medical devices, and surgical implants.

A high strength and low modulus alloy is disclosed, and comprises at least five principal elements and at least one additive element. The principal elements are Ti, Zr, Nb, Mo, and Sn, and the additive element(s) are V, W, Cr, and/or Hf. Particularly, a summation of numeric values of Ti and Zr in atomic percent is less than or equal to 85, and the additive elements have a total numeric value in atomic percent less than or equal to 4. Experimental data reveal that, samples of the high strength and low modulus alloy all have properties of yield strength greater than 600 MPa and Young's modulus less than 90 GPa. As a result, experimental data have proved that the high strength and low modulus alloy has a significant potential for applications in the manufacture of various industrial components and/or devices, medical devices, and surgical implants.

An electrical connector includes a first layer formed of a copper based material and a second layer formed of an iron-nickel alloy. The second layer has a thickness of 8% to 30% of the thickness of the electrical connector. The electrical connector also includes a third layer which is formed of a solder alloy that consists essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy that is tin.

An electrical connector includes a first layer formed of a copper based material and a second layer formed of an iron-nickel alloy. The second layer has a thickness of 8% to 30% of the thickness of the electrical connector. The electrical connector also includes a third layer which is formed of a solder alloy that consists essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy that is tin.

A transistor device structure may include a submount, a transistor device on the carrier submount, and a metal bonding layer between the submount and the transistor die, the metal bonding stack providing mechanical attachment of the transistor die to the submount. The metal bonding stack may include gold, tin and nickel. A weight percentage of a combination of nickel and tin in the metal bonding layer is greater than 50 percent and a weight percentage of gold in the metal bonding layer is less than 25 percent.