A copper alloy having the following composition (in % by weight) Zn: 17 to 20.5%, Ni: 17 to 23%, Mn: 8 to 11.5%, optionally up to 4% Cr, optionally up to 5.5% Fe, optionally up to 0.5% Ti, optionally up to 0.15% B, optionally up to 0.1% Ca, optionally up to 1.0% Pb, balance copper and unavoidable impurities, wherein the proportion of copper is at least 45% by weight. Further, the ratio of the proportion of Ni to the proportion of Mn is at least 1.7 and the alloy has a microstructure which has inclusions of MnNi and MnNh precipitates.

A copper alloy having the following composition (in % by weight) Zn: 17 to 20.5%, Ni: 17 to 23%, Mn: 8 to 11.5%, optionally up to 4% Cr, optionally up to 5.5% Fe, optionally up to 0.5% Ti, optionally up to 0.15% B, optionally up to 0.1% Ca, optionally up to 1.0% Pb, balance copper and unavoidable impurities, wherein the proportion of copper is at least 45% by weight. Further, the ratio of the proportion of Ni to the proportion of Mn is at least 1.7 and the alloy has a microstructure which has inclusions of MnNi and MnNh precipitates.

A hot stamped steel includes a base material, a plated layer that is formed on a surface of the base material, and an oxide film that is formed on a surface of the plated layer; chemical composition of the plated layer contains 20.00 to 45.00 mass % of Al, 10.00 to 45.00 mass % of Fe, 4.50 to 15.00 mass % of Mg, 0.10 to 3.00 mass % of Si, 0.05 to 3.00 mass % of Ca, 0 to 0.50 mass % of Sb, 0 to 0.50 mass % of Pb, 0 to 1.00 mass % of Cu, 0 to 1.00 mass % of Sn, 0 to 1.00 mass % of Ti, 0 to 0.50 mass % of Sr, 0 to 1.00 mass % of Cr, 0 to 1.00 mass % of Ni, and 0 to 1.00 mass % of Mn with a remainder of Zn and impurities; and chemical composition of the oxide film contains 20.0 to 55.0 at % of Mg, 0.5 to 15.0 at % of Ca, 0 to 15.0 at % of Zn, and 0 at % or more and less than 10.0 at % of Al with a remainder of O and a total of 5.0 at % or less of impurities, and the adhesion amount of the oxide film per one surface is in a range of 0.01 to 10 g/m.sup.2.

A hot stamped steel includes a base material, a plated layer that is formed on a surface of the base material, and an oxide film that is formed on a surface of the plated layer; chemical composition of the plated layer contains 20.00 to 45.00 mass % of Al, 10.00 to 45.00 mass % of Fe, 4.50 to 15.00 mass % of Mg, 0.10 to 3.00 mass % of Si, 0.05 to 3.00 mass % of Ca, 0 to 0.50 mass % of Sb, 0 to 0.50 mass % of Pb, 0 to 1.00 mass % of Cu, 0 to 1.00 mass % of Sn, 0 to 1.00 mass % of Ti, 0 to 0.50 mass % of Sr, 0 to 1.00 mass % of Cr, 0 to 1.00 mass % of Ni, and 0 to 1.00 mass % of Mn with a remainder of Zn and impurities; and chemical composition of the oxide film contains 20.0 to 55.0 at % of Mg, 0.5 to 15.0 at % of Ca, 0 to 15.0 at % of Zn, and 0 at % or more and less than 10.0 at % of Al with a remainder of O and a total of 5.0 at % or less of impurities, and the adhesion amount of the oxide film per one surface is in a range of 0.01 to 10 g/m.sup.2.

A hot stamped steel includes a base material that is formed of steel, a plated layer that is formed on a surface of the base material, and a phosphate coating that is formed on a surface of the plated layer; chemical composition of the plated layer contains 20.00 to 45.00 mass % of Al, 10.00 to 45.00 mass % of Fe, 4.50 to 15.00 mass % of Mg, 0.10 to 3.00 mass % of Si, 0.05 to 3.00 mass % of Ca, 0 to 0.50 mass % of Sb, 0 to 0.50 mass % of Pb, 0 to 1.00 mass % of Cu, 0 to 1.00 mass % of Sn, 0 to 1.00 mass % of Ti, 0 to 0.50 mass % of Sr, 0 to 1.00 mass % of Cr, 0 to 1.00 mass % of Ni, and 0 to 1.00 mass % of Mn with a remainder of Zn and impurities; the phosphate coating consists of zinc phosphate crystals containing 5.0 to 50.0 mass % of Mg and 0.5 to 5.0 mass % of Ca; and the adhesion amount of the phosphate coating per one surface is in a range of 0.1 to 10.0 g/m.sup.2.

A hot stamped steel includes a base material that is formed of steel, a plated layer that is formed on a surface of the base material, and a phosphate coating that is formed on a surface of the plated layer; chemical composition of the plated layer contains 20.00 to 45.00 mass % of Al, 10.00 to 45.00 mass % of Fe, 4.50 to 15.00 mass % of Mg, 0.10 to 3.00 mass % of Si, 0.05 to 3.00 mass % of Ca, 0 to 0.50 mass % of Sb, 0 to 0.50 mass % of Pb, 0 to 1.00 mass % of Cu, 0 to 1.00 mass % of Sn, 0 to 1.00 mass % of Ti, 0 to 0.50 mass % of Sr, 0 to 1.00 mass % of Cr, 0 to 1.00 mass % of Ni, and 0 to 1.00 mass % of Mn with a remainder of Zn and impurities; the phosphate coating consists of zinc phosphate crystals containing 5.0 to 50.0 mass % of Mg and 0.5 to 5.0 mass % of Ca; and the adhesion amount of the phosphate coating per one surface is in a range of 0.1 to 10.0 g/m.sup.2.

An aluminium alloy including 1.0-1.5 wt % Mn, up to 0.1 wt % Mg, up to 0.3 wt % Si, up to 0.3 wt % Fe, up to 0.1 wt % Cu, up to 0.25 wt % Cr, up to 0.1 wt % Ni, up to 0.3 wt % Zn, up to 0.1% Ti, up to 0.2 Zr. The allow also includes impurities, each no more than 0.05 wt. % and wherein the total of impurities is no more than 0.15 wt. %, with the balance being aluminum.

An aluminium alloy including 1.0-1.5 wt % Mn, up to 0.1 wt % Mg, up to 0.3 wt % Si, up to 0.3 wt % Fe, up to 0.1 wt % Cu, up to 0.25 wt % Cr, up to 0.1 wt % Ni, up to 0.3 wt % Zn, up to 0.1% Ti, up to 0.2 Zr. The allow also includes impurities, each no more than 0.05 wt. % and wherein the total of impurities is no more than 0.15 wt. %, with the balance being aluminum.

An electrical connector includes a first layer having a first coefficient of thermal expansion and a second layer overlaying the first layer having a second coefficient of thermal expansion. A first difference between the first coefficient of thermal expansion and a coefficient of thermal expansion of glass is greater than a second difference between the second coefficient of thermal expansion and the coefficient of thermal expansion of glass. The electrical connector further includes a layer of a solder alloy having about 15% to 28% indium by weight, about 5% to 20% zinc by weight, about 1% to 6% silver by weight, and at least 36% tin by weight. The solder layer is disposed on at least a portion of the second layer.

An electrical connector includes a first layer having a first coefficient of thermal expansion and a second layer overlaying the first layer having a second coefficient of thermal expansion. A first difference between the first coefficient of thermal expansion and a coefficient of thermal expansion of glass is greater than a second difference between the second coefficient of thermal expansion and the coefficient of thermal expansion of glass. The electrical connector further includes a layer of a solder alloy having about 15% to 28% indium by weight, about 5% to 20% zinc by weight, about 1% to 6% silver by weight, and at least 36% tin by weight. The solder layer is disposed on at least a portion of the second layer.