Patent classifications
C22C45/08
Electromagnetic wave shielding thin film, electronic device provided with electromagnetic wave shielding thin film and shielding structure, and method for manufacturing electromagnetic wave shielding thin film
An electromagnetic wave shielding thin film for shielding from electromagnetic waves generated in an electronic part is provided. The electromagnetic wave shielding thin film includes metal plate which has elastic limit of 1% or more, strength of 1000 MPa or more, and a volume fraction of an amorphous phase of 50% or more.
METHOD FOR ADDITIVE MANUFACTURING OF THREE-DIMENSIONAL OBJECTS FROM METALLIC GLASSES
A method for additive manufacturing of three-dimensional objects from metallic glasses utilizing a process of melting of successive layers of the starting material by a laser beam or an electron beam. The method includes steps such that every material layer is melted twice, using parameters which yield a crystalline melt trace in the first melting, and the successively melted beam paths contact with one another, while in the second melting, parameters yielding an amorphous melt trace are used, and the successively remelted paths or spots do not come in contact with one another, and/or between the scanning of successive paths or spots, an interval not shorter than 10 ms is maintained, the surface power density in the first remelting being lower than in the second remelting.
METHODS TO INCREASE SOLID SOLUTION ZIRCONIUM IN ALUMINUM ALLOYS
A method of making an aluminum alloy containing zirconium includes heating a first composition comprising aluminum to a first temperature of greater than or equal to about 580 C. to less than or equal to about 800 C. The method further includes adding a second composition including a copper-zirconium compound to the first composition to form a third composition. The copper-zirconium compound of the second composition has a molar composition of greater than or equal to about 41% zirconium to less than or equal to about 67% zirconium and a balance of copper. The method also includes solidifying the third composition at a cooling rate of greater than or equal to about 0.1 C./second to less than or equal to about 100 C./second to a second temperature less than or equal to a solidus temperature and decomposing the copper-zirconium compound at a third temperature of less than or equal to about 715 C.
METHODS TO INCREASE SOLID SOLUTION ZIRCONIUM IN ALUMINUM ALLOYS
A method of making an aluminum alloy containing zirconium includes heating a first composition including aluminum to a first temperature. The first temperature is greater than or equal to a liquidus temperature of the first composition. The method further includes adding a second composition including a copper-zirconium compound to the first composition. The method further includes decomposing at least a portion of the copper-zirconium compound into copper and zirconium. The method further includes forming a third composition by dissolving at least some of the copper from the decomposing in the aluminum of the first composition. The method further includes cooling the third composition to a second temperature to form a first solid material. The second temperature is less than or equal to a solidus temperature of the third composition. The method further includes heat treating the first solid material to form the aluminum alloy containing zirconium.
Amorphous alloy-reinforced and toughened aluminum matrix composite and preparation method thereof
Provided are an amorphous alloy-reinforced and toughened aluminum matrix composite (AMC) and a preparation method thereof. The amorphous alloy-reinforced and toughened AMC includes 55 vol. % to 95 vol. % of an aluminum-based alloy and 5 vol. % to 45 vol. % of an amorphous alloy, wherein the amorphous alloy is Fe.sub.52Cr.sub.26Mo.sub.18B.sub.2C.sub.12.
Amorphous alloy-reinforced and toughened aluminum matrix composite and preparation method thereof
Provided are an amorphous alloy-reinforced and toughened aluminum matrix composite (AMC) and a preparation method thereof. The amorphous alloy-reinforced and toughened AMC includes 55 vol. % to 95 vol. % of an aluminum-based alloy and 5 vol. % to 45 vol. % of an amorphous alloy, wherein the amorphous alloy is Fe.sub.52Cr.sub.26Mo.sub.18B.sub.2C.sub.12.
RAPIDLY SOLIDIFIED ALUMINUM-RARE EARTH ELEMENT ALLOY AND METHOD OF MAKING THE SAME
Disclosed herein are embodiments of rapidly solidified alloys that comprise aluminum, a rare earth element, one or more additional alloying elements, such as aluminum, and an optional additive component. The alloy embodiments exhibit a unique microstructure as compared to microstructures obtained from other alloys that are not rapidly cooled. The disclosed aluminum-rare earth element alloys also exhibit improved mechanical properties without the need for post-processing heat treatments and further do not exhibit substantial coarsening.
RAPIDLY SOLIDIFIED ALUMINUM-RARE EARTH ELEMENT ALLOY AND METHOD OF MAKING THE SAME
Disclosed herein are embodiments of rapidly solidified alloys that comprise aluminum, a rare earth element, one or more additional alloying elements, such as aluminum, and an optional additive component. The alloy embodiments exhibit a unique microstructure as compared to microstructures obtained from other alloys that are not rapidly cooled. The disclosed aluminum-rare earth element alloys also exhibit improved mechanical properties without the need for post-processing heat treatments and further do not exhibit substantial coarsening.
Electrodeposition of metal microstructures
In one embodiment, a method for fabricating a metal microstructure includes forming a non-conductive polymer membrane having a plurality of pores, coating at least one end of the membrane and inner surfaces of the pores with a conductive material to form a conductive coating, electrodepositing a metal on the conductive coating, and dissolving the membrane to obtain a free-standing metal microstructure having at least one metal end plate and multiple elongated metal members extending therefrom.
Conductive paste and electronic device and solar cell including an electrode formed using the conductive paste
A conductive paste includes a conductive powder, a metallic glass having a glass transition temperature of less than or equal to about 600 C. and a supercooled liquid region of greater than or equal to 0 K, and an organic vehicle, and an electronic device and a solar cell include an electrode formed using the conductive paste.