A method for heat-treating a titanium alloy, such as Ti-6Al-4V. The method may occur after or include a step of forging the titanium alloy such that localized, highly deformed grains are formed in the titanium alloy. Then the method may include steps of recrystallization annealing the titanium alloy by heating the titanium alloy to a temperature in a range between 30 F. to 200 F. below beta transus of the titanium alloy for 1 hour to 6 hours and then furnace cooling of the titanium alloy to 1200 F. to 1500 F. at a rate of 50 F. to 500 F. per hour. Following the recrystallization annealing, the method may include beta annealing the titanium alloy. These steps may be performed in a single heat treating cycle.

One aspect of this copper alloy for an electronic and electrical equipment contains: more than 2.0 mass % to 36.5 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.15 mass % to less than 1.00 mass % of Ni; and 0.005 mass % to 0.100 mass % of P, with the balance containing Cu and inevitable impurities, wherein atomic ratios of amounts of elements satisfy 3.00<Ni/P<100.00 and 0.10<Sn/Ni<2.90, and a strength ratio TS.sub.TD/TS.sub.LD of tensile strength TS.sub.TD in a direction perpendicular to a rolling direction to tensile strength TS.sub.LD in a direction parallel to the rolling direction exceeds 1.09.

A copper foil for producing graphene, having 60 degree gloss of 500% .Iadd.or more .Iaddend.in a rolling direction and a direction transverse to .Iadd.the .Iaddend.rolling direction, and an average crystal grain size of 200 m or more after heating at 1000 C. for 1 hour in an atmosphere containing 20% by volume or more of hydrogen and balance argon.

A copper foil for producing graphene, having 60 degree gloss of 500% .Iadd.or more .Iaddend.in a rolling direction and a direction transverse to .Iadd.the .Iaddend.rolling direction, and an average crystal grain size of 200 m or more after heating at 1000 C. for 1 hour in an atmosphere containing 20% by volume or more of hydrogen and balance argon.

A method for heat treating a superalloy component includes heating a superalloy component to a first temperature, cooling the superalloy from the first temperature to a second temperature at a first cooling rate in a furnace, and cooling the superalloy component from the second temperature to a final temperature at a second cooling rate. The second cooling rate is higher than the first cooling rate.

A high creep-resistant equiaxed grain nickel-based superalloy. The high creep-resistant equiaxed grain nickel-based superalloy is characterized that the chemical compositions in weight ratios include Cr in 8.0 to 9.5 wt %, W in 9.5 to 10.5 wt %, Co in 9.5 to 10.5 wt %, Al in 5.0 to 6.0 wt %, Ti in 0.5 to 1.5 wt %, Mo in 0.5 to 1.0 wt %, Ta in 2.5 to 4.0 wt %, Hf in 1.0 to 2.0 wt %, Ir in 2.0 to 4.0 wt %, C in 0.1 to 0.2 wt %, B in 0.01 to 0.1 wt %, Zr in 0.01 to 0.10 wt %, and the remaining part formed by Ni and inevitable impurities.

A high creep-resistant equiaxed grain nickel-based superalloy. The high creep-resistant equiaxed grain nickel-based superalloy is characterized that the chemical compositions in weight ratios include Cr in 8.0 to 9.5 wt %, W in 9.5 to 10.5 wt %, Co in 9.5 to 10.5 wt %, Al in 5.0 to 6.0 wt %, Ti in 0.5 to 1.5 wt %, Mo in 0.5 to 1.0 wt %, Ta in 2.5 to 4.0 wt %, Hf in 1.0 to 2.0 wt %, Ir in 2.0 to 4.0 wt %, C in 0.1 to 0.2 wt %, B in 0.01 to 0.1 wt %, Zr in 0.01 to 0.10 wt %, and the remaining part formed by Ni and inevitable impurities.

A method of manufacturing a heat dissipation device is disclosed. The heat dissipation device manufactured with the method includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.

A method of manufacturing a heat dissipation device is disclosed. The heat dissipation device manufactured with the method includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.

The present disclosure relates to a method for processing a component formed by an ALM method using a -strengthened superalloy having a solvus temperature. The processing method comprises heating the component to a treatment temperature at or above the solvus temperature at a rate equal to or greater than 50 C./min and then cooling the component at a rate of greater than 60 C./min.