A copper alloy has a composition including: 70 mass ppm or more and 400 mass ppm or less of Mg; 5 mass ppm or more and 20 mass ppm or less of Ag; less than 3.0 mass ppm of P; and a Cu balance containing inevitable impurities. In the copper alloy, an average crystal grain size is in a range of 10 μm or more and 100 μm or less, an electrical conductivity is 90% IACS or more, and a residual stress rate is 50% or more at 150° C. after 1000 hours.

It is an object to provide a method for producing a substrate for epitaxial growth having a higher degree of biaxial crystal orientation without forming an irregular part a3. The method for producing a substrate for epitaxial growth comprising a step of laminating a metal base material and a copper layer having an fcc rolling texture by surface-activated bonding, a step of applying mechanical polishing to the copper layer, and a step of carrying out orientation heat treatment of the copper layer, wherein the copper layer is laminated in such a way that, when ratios of the (200) plane of the copper layer before laminated and of the copper layer after laminated when measured by XRD are I0.sub.Cu and I0.sub.CLAD, respectively and ratios of the (220) plane of the copper layer before laminated and of the copper layer after laminated are I2.sub.Cu and I2.sub.CLAD, respectively, I0.sub.Cu<20%, I2.sub.Cu=70 to 90%, and I0.sub.CLAD<20%, I2.sub.CLAD=70 to 90% and I0.sub.CLAD−I0.sub.Cu<13%.

It is an object to provide a method for producing a substrate for epitaxial growth having a higher degree of biaxial crystal orientation without forming an irregular part a3. The method for producing a substrate for epitaxial growth comprising a step of laminating a metal base material and a copper layer having an fcc rolling texture by surface-activated bonding, a step of applying mechanical polishing to the copper layer, and a step of carrying out orientation heat treatment of the copper layer, wherein the copper layer is laminated in such a way that, when ratios of the (200) plane of the copper layer before laminated and of the copper layer after laminated when measured by XRD are I0.sub.Cu and I0.sub.CLAD, respectively and ratios of the (220) plane of the copper layer before laminated and of the copper layer after laminated are I2.sub.Cu and I2.sub.CLAD, respectively, I0.sub.Cu<20%, I2.sub.Cu=70 to 90%, and I0.sub.CLAD<20%, I2.sub.CLAD=70 to 90% and I0.sub.CLAD−I0.sub.Cu<13%.

A preparation method of a uniform low stress cone shaped charge liner includes the steps of multi-pass extrusion forming, vibration aging treatment, and cryogenic treatment. The step of multi-pass extrusion forming refers to 4 to 8 passes of extrusion deformation under the actions of a three-dimensional compressive stress and a deformation rate of 5 to 10 mm/s, having a deformation amount of 5 to 50% for each pass. The shaped charge liner prepared by the present invention has high dimensional accuracy, good geometric symmetry, low stress value, and excellent stability in the precise machining process and in use, which may significantly improve the penetration capability and stability of the shaped charge liner of high-explosive anti-tank warheads.

A preparation method of a uniform low stress cone shaped charge liner includes the steps of multi-pass extrusion forming, vibration aging treatment, and cryogenic treatment. The step of multi-pass extrusion forming refers to 4 to 8 passes of extrusion deformation under the actions of a three-dimensional compressive stress and a deformation rate of 5 to 10 mm/s, having a deformation amount of 5 to 50% for each pass. The shaped charge liner prepared by the present invention has high dimensional accuracy, good geometric symmetry, low stress value, and excellent stability in the precise machining process and in use, which may significantly improve the penetration capability and stability of the shaped charge liner of high-explosive anti-tank warheads.

There is provided a copper alloy consisting of: Ni: 10 to 15% by weight, Sn: 5.0% by weight or more, Mn: 0 to 0.5% by weight, Zr: 0 to 0.5% by weight, at least one selected from the group consisting of Nb, Fe, Al, Ti, B, Zn, Si, Co, P, Mg, and Bi: 0 to 0.2% by weight in total, and the balance being Cu and inevitable impurities. The copper alloy has, in an X-ray diffraction profile, (i) a peak in the vicinity of 2θ=46 to 50° having a peak intensity of 30% or more with respect to a peak intensity in the vicinity of 2θ=84 to 88° and (ii) a peak in the vicinity of 2θ=40 to 42° having a peak intensity of 2.0% or more with respect to a peak intensity in the vicinity of 2θ=84 to 88°.

A gradient control method for a microstructure ultrafine crystallization of a deep cone copper shaped charge liner includes the steps of an extrusion forming, a recrystallization heat treatment, and a high-frequency percussion. A multi-pass extrusion is used in the extrusion forming, and in the high-frequency percussion step, a percussion speed is 30,000 to 40,000 times/min, a percussion force is 1600 N to 2000 N, and a number of percussion times is 1 to 3. The forming and surface quality control of the deep cone shaped charge liner are realized by the control technology of the present invention; the plasticity of the material is improved, and fine crystal structures are obtained; and an ultrafine grain gradient structure distributed along the thickness direction is formed in the inner surface of the shaped charge liner.

A gradient control method for a microstructure ultrafine crystallization of a deep cone copper shaped charge liner includes the steps of an extrusion forming, a recrystallization heat treatment, and a high-frequency percussion. A multi-pass extrusion is used in the extrusion forming, and in the high-frequency percussion step, a percussion speed is 30,000 to 40,000 times/min, a percussion force is 1600 N to 2000 N, and a number of percussion times is 1 to 3. The forming and surface quality control of the deep cone shaped charge liner are realized by the control technology of the present invention; the plasticity of the material is improved, and fine crystal structures are obtained; and an ultrafine grain gradient structure distributed along the thickness direction is formed in the inner surface of the shaped charge liner.

A high strength/highly conductive copper alloy plate material of the present invention contains silver in a range of 4% by mass or more and 13% by mass or less, and balancing copper and unavoidable impurities. In the high strength/highly conductive copper alloy plate material, a minimum value of a tensile strength (UTS) is 600 MPa or more and 1250 MPa or less, and a conductivity (% IACS) is 60% or more and 90% or less.

A high strength/highly conductive copper alloy plate material of the present invention contains silver in a range of 4% by mass or more and 13% by mass or less, and balancing copper and unavoidable impurities. In the high strength/highly conductive copper alloy plate material, a minimum value of a tensile strength (UTS) is 600 MPa or more and 1250 MPa or less, and a conductivity (% IACS) is 60% or more and 90% or less.