C22F1/14

COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS

In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.

Clad material for electric contacts and method for producing the clad material

The present invention is a clad material for an electric contact, including a base material composed of a Cu-based, precipitation-type age-hardening material, and a contact material composed of an Ag alloy bonded to the base material. On a bonded interface between the contact material and the base material, a width of a diffusion region including Ag and Cu is 2.0 μm or shorter. The clad material is produced by bonding each other the contact material and the base material having undergone solutionizing and age-hardening beforehand, suppressing the diffusion region from expanding after bonding. The present invention is capable of providing an electric contact, which achieves higher conductivity, without sacrificing property of the Cu-based, precipitation-type age-hardening material.

Clad material for electric contacts and method for producing the clad material

The present invention is a clad material for an electric contact, including a base material composed of a Cu-based, precipitation-type age-hardening material, and a contact material composed of an Ag alloy bonded to the base material. On a bonded interface between the contact material and the base material, a width of a diffusion region including Ag and Cu is 2.0 μm or shorter. The clad material is produced by bonding each other the contact material and the base material having undergone solutionizing and age-hardening beforehand, suppressing the diffusion region from expanding after bonding. The present invention is capable of providing an electric contact, which achieves higher conductivity, without sacrificing property of the Cu-based, precipitation-type age-hardening material.

INTERMETALLIC L10-NiPtAg CATALYSTS FOR OXYGEN REDUCTION REACTION

An electrode catalyst for an oxygen reduction reaction including intermetallic L1.sub.0-NiPtAg alloy nanoparticles having enhanced ORR activity and durability. The catalyst including intermetallic L1.sub.0-NiPtAg alloy nanoparticles is synthesized by employing silver (Ag) as a dopant and annealing under specific conditions to form the intermetallic structure. In one example, the intermetallic L1.sub.0-NiPtAg alloy nanoparticles are represented by the formula: Ni.sub.xPt.sub.yAg.sub.z wherein 0.4≤x≤0.6, 0.4≤y≤0.6, z≤0.1.

INTERMETALLIC L10-NiPtAg CATALYSTS FOR OXYGEN REDUCTION REACTION

An electrode catalyst for an oxygen reduction reaction including intermetallic L1.sub.0-NiPtAg alloy nanoparticles having enhanced ORR activity and durability. The catalyst including intermetallic L1.sub.0-NiPtAg alloy nanoparticles is synthesized by employing silver (Ag) as a dopant and annealing under specific conditions to form the intermetallic structure. In one example, the intermetallic L1.sub.0-NiPtAg alloy nanoparticles are represented by the formula: Ni.sub.xPt.sub.yAg.sub.z wherein 0.4≤x≤0.6, 0.4≤y≤0.6, z≤0.1.

Laser patterning of multi-layer structures
11008644 · 2021-05-18 · ·

A method of non-ablatively laser patterning a multi-layer structure, the multi-layer structure including a substrate, a first layer disposed on the substrate, a second layer disposed on the first layer, and a third layer disposed on the second layer, the method including generating at least one laser pulse having laser parameters selected for non-ablatively changing the conductivity a selected portion of the third layer such that the selected portion becomes non-conductive, and directing the pulse to the multi-layer structure, wherein the conductivity of the first layer is not substantially changed by the pulse.

Laser patterning of multi-layer structures
11008644 · 2021-05-18 · ·

A method of non-ablatively laser patterning a multi-layer structure, the multi-layer structure including a substrate, a first layer disposed on the substrate, a second layer disposed on the first layer, and a third layer disposed on the second layer, the method including generating at least one laser pulse having laser parameters selected for non-ablatively changing the conductivity a selected portion of the third layer such that the selected portion becomes non-conductive, and directing the pulse to the multi-layer structure, wherein the conductivity of the first layer is not substantially changed by the pulse.

POLYELEMENTAL HETEROSTRUCTURE NANOPARTICLES AND METHODS OF MAKING THE SAME
20210163707 · 2021-06-03 ·

Disclosed herein are method and design rules for making polyelemental systems with specific heterostructures, including tetra-phase nanopartides with as many as six junctions. In accordance with an embodiment, a method of making a tetra-phase polyelemental nanoparticle using tri-phase nanoparticle architectures can include selecting two or more triphase nanoparticle architectures, wherein the two or more tri-phase nanoparticle architectures are one or more striped tri-phase architectures, one or more pie-shaped tri-phase architectures, or combinations thereof; identifying from the selected two or more tri-phase nanoparticle architectures groups of metals for generating each of the two or more tri-phase nanoparticle architectures; contacting a tip coated with an ink to a substrate to form a nanoreactor, the ink comprising block copolymer and the metals from the groups of metals identified for generating each of the two or more tri-phase nanoparticle architectures; and annealing the nanoreactors under conditions sufficient to synthesize a tetra-phase polyelemental nanoparticle.

Process for producing molded material, molded material, wavefront control element and diffraction grating
10968505 · 2021-04-06 · ·

A process for producing a molded material that can form metallic glass material in a state of lower viscosity, and can manufacture a small structure of several 10 μm or less in a comparatively short time while precisely controlling shape thereof, by the process comprising a heating step of heating supercooled state metallic glass material or a solid metallic glass material at a temperature increase rate of 0.5 K/s to a temperature at or higher than a temperature at which a crystallization process for a supercooled liquid of the metallic glass material begins, and a molding step of transfer molding the metallic glass material until the crystallization process for the supercooled liquid of the metallic glass material has been completed. In addition, the purpose is also to provide the molded material that has been formed by this process, a wavefront control element, and a diffraction grating.

Process for producing molded material, molded material, wavefront control element and diffraction grating
10968505 · 2021-04-06 · ·

A process for producing a molded material that can form metallic glass material in a state of lower viscosity, and can manufacture a small structure of several 10 μm or less in a comparatively short time while precisely controlling shape thereof, by the process comprising a heating step of heating supercooled state metallic glass material or a solid metallic glass material at a temperature increase rate of 0.5 K/s to a temperature at or higher than a temperature at which a crystallization process for a supercooled liquid of the metallic glass material begins, and a molding step of transfer molding the metallic glass material until the crystallization process for the supercooled liquid of the metallic glass material has been completed. In addition, the purpose is also to provide the molded material that has been formed by this process, a wavefront control element, and a diffraction grating.