Methods of producing high purity powders of submicron particles of metal oxides are presented. The methods comprise providing or forming an alloy of a first metal with a second metal, optionally heating the alloy, subjecting the alloy to a leaching agent to remove the second metal from the alloy and to oxidize the first metal, thus forming submicron oxide particles of the first metal. Collections of high purity, high surface area, submicron particles are presented as well.

Provided is an FeNiCr alloy that has excellent surface characteristics and enables formation of a blackened coating having excellent blackening characteristics and peeling resistance. The FeNiCr alloy has a chemical composition containing, by mass %, C, Si, Mn, P, S, Cr, Ni, Mo, Co, Cu, N, Ti, Al, O, and H, the balance being Fe and inevitable impurities, and satisfying formulae (1) to (4): (1) T1=11[% N]+0.1; (2) T2=39[% N]1.0; (3) A1=7.5[% N]+0.1; (4) A2=42.5[% N]+1.0, where [% M] represents content (mass %) of element M in the alloy, and T1, T2, A1, and A2 satisfy relationships T1<[% Ti]<T2 and A1<[% A1]<A2.

Provided is an FeNiCr alloy that has excellent surface characteristics and enables formation of a blackened coating having excellent blackening characteristics and peeling resistance. The FeNiCr alloy has a chemical composition containing, by mass %, C, Si, Mn, P, S, Cr, Ni, Mo, Co, Cu, N, Ti, Al, O, and H, the balance being Fe and inevitable impurities, and satisfying formulae (1) to (4): (1) T1=11[% N]+0.1; (2) T2=39[% N]1.0; (3) A1=7.5[% N]+0.1; (4) A2=42.5[% N]+1.0, where [% M] represents content (mass %) of element M in the alloy, and T1, T2, A1, and A2 satisfy relationships T1<[% Ti]<T2 and A1<[% A1]<A2.

Austenitic stainless alloys have been discovered that exhibit unexpectedly superior corrosion resistance, particularly to sulfuric acid solutions, when compared to that exhibited by conventional alloys with closely related compositions. These alloys advantageously are corrosion resistant to a relatively wide range of sulfuric acid concentration and temperature and are thus particularly suitable for use in the industrial production of sulfuric acid.

A lead-free solder preform includes a core layer and adhesion layer coated over surfaces of the core layer, where the preform delivers the combined merits from constituent solder alloys of the core and adhesion layers to provide both high temperature performance and improved wetting in high-temperature solder applications such as die attach. The core layer may be formed of a Bi Alloy having a solidus temperature above 260 C., and the adhesion layer may be formed of Sn, a Sn alloy, a Bi alloy, In, or an In alloy having a solidus temperature below 245 C. The solder preform may be formed using techniques such as: (1) electroplating a core ribbon with an adhesion material, (2) cladding an adhesion material foil onto a core ribbon, and/or (3) dipping a core ribbon in a molten adhesion alloy bath to allow thin layers of adhesion material to adhere to a core ribbon.

This hot-dip Zn-based plated steel sheet includes a steel sheet and a plating layer formed on at least part of a surface of the steel sheet, in which the plating layer has a chemical composition that includes, by mass %, Al: 6.00% to 35.00%, Mg: 2.00% to 12.00%, Ca: 0.005% to 2.00%, Si: 0% to 2.00%, Fe: 0% to 2.00%, Sb: 0% to 0.50%, Sr: 0% to 0.50%, Pb: 0% to 0.50%, Sn: 0% to 1.00%, Cu: 0% to 1.00%, Ti: 0% to 1.00%, Ni: 0% to 1.00%, Mn: 0% to 1.00%, Cr: 0% to 1.00%, and a remainder: Zn and impurities, the plating layer has an area ratio of a MgZn.sub.2 phase in a range of 15% to 60% in a cross section in a thickness direction, and the MgZn.sub.2 phase includes a Ca-based intermetallic compound having a circle equivalent diameter of 0.10 m or smaller.

A method comprising incorporating indium into an entire Sn film for preventing the growth of whiskers from the Sn film, wherein the Sn film is applied to a metallic substrate. The indium is present in the entire thickness of the Sn film.

A method comprising incorporating indium into an entire Sn film for preventing the growth of whiskers from the Sn film, wherein the Sn film is applied to a metallic substrate. The indium is present in the entire thickness of the Sn film.

A high-entropy alloy having ultra-high strength and high hydrogen embrittlement resistance due to formation of a microstructure at a low strain may be produced without a severe plastic deformation.

A method for producing the high-entropy alloy includes (a) annealing and homogenizing an initial alloy material at 1000 to 1200 C. for 1 to 24 hours; and (b) rolling the annealed and homogenized initial alloy material into a rod, at a cryogenic temperature of 100 to 200 C. while pressing the initial alloy material in multi-axial directions at a strain of 0.4 to 1.2, thereby to produce the high-entropy alloy having intersecting twins as a microstructure, and secondary fine twins formed in the intersecting twins, wherein the initial alloy material contains Co of 5 to 35%, Cr of 5 to 35%, Fe of 5 to 35%, Mn of 5 to 35%, and Ni of 5 to 35%, based on weight %.

A high-entropy alloy having ultra-high strength and high hydrogen embrittlement resistance due to formation of a microstructure at a low strain may be produced without a severe plastic deformation.

A method for producing the high-entropy alloy includes (a) annealing and homogenizing an initial alloy material at 1000 to 1200 C. for 1 to 24 hours; and (b) rolling the annealed and homogenized initial alloy material into a rod, at a cryogenic temperature of 100 to 200 C. while pressing the initial alloy material in multi-axial directions at a strain of 0.4 to 1.2, thereby to produce the high-entropy alloy having intersecting twins as a microstructure, and secondary fine twins formed in the intersecting twins, wherein the initial alloy material contains Co of 5 to 35%, Cr of 5 to 35%, Fe of 5 to 35%, Mn of 5 to 35%, and Ni of 5 to 35%, based on weight %.